Empty fridge syndrome; mostly right; G2G; dumbing down for dummies; who’s responsible.
By Ed Sperling
Mentor’s Robin Bornoff returns to his beer fridge with a New Year’s resolution for sobriety and a revelation that an empty refrigerator never cools as well as a full one. Well, there’s always Diet Coke and double-shot iced espresso.
Cadence’s Tom Anderson sheds some long overdue light on the famous processor “divide bug” that generated mostly right answers. This one is a good read with a great moral.
Synopsys’ Hannah Watanabe digs into G2G (that’s geek-to-geek, not got-to-go) companies and how social media can work for them. The emphasis is on humanizing a company. Geeks are people, too.
Harry Gries cites research showing that we’re all getting dumber. That means it may take more of us to solve problems of increasing complexity. This adds new meaning to the concept of “dumbing down.”
Cadence’s Richard Goering peels back the covers on a rather touchy issue: Who’s responsible for developing and verifying the software drivers? This is a really timely issue as semiconductor companies are forced to build an ever-larger piece of the software stack if they want to remain competitive.
Mentor’s Mike Jensen looks at the process of releasing EDA software and why even the best-laid plans can go awry.
Cadence’s Jason Andrews looks at what can go wrong in using a SystemC ARM Linux Boot Loader. There’s a lot of good information here that’s applicable well beyond the Boot Loader.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Lots of unknowns will persist for decades across multiple market segments.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
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