Blog Review: June 22

Microarchitectural security; high-NA EUV; fault simulation; PCB digital twins.


Arm’s Andrew Pickard checks out a project at Sorbonne Université in Paris that is using the Cortex-M3 processor source code to model what is happening in the hardware at the microarchitectural level and find ways to prevent side-channel leakage of sensitive cryptographic information.

Cadence’s Paul McLellan digs into the development of high-NA EUV lithography and some of the challenges ahead for the technology, including increased line edge roughness, poorer metrology due to the limited image contrast with the thinner resist used, alternative absorber materials, and pellicle development.

Synopsys’ Brian Davenport and Rimpy Chugh consider how fault simulation has become difficult as chip complexity increases to meet the demands of mission-critical applications such as autonomous vehicles, medical equipment, and military/aerospace systems.

Siemens’ Katie Tormala points to PCB assembly digital twins and how a comprehensive virtual model of the printed circuit board assembly, inspection, and testing processes can help catch errors earlier in the design process.

Ansys’ Vidyu Challa considers some of the most common secondary, or rechargeable, battery chemistries and the impact on properties such as energy density, flammability and safety, available cell constructions, and temperature range.

SEMI’s Serena Brischetto chats with Henryk Schoder of X-FAB about a new project that aims to create a well-skilled European workforce in microelectronics R&D, design, and manufacturing.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Lam Research’s Krishnan Shrinivasan explains why 3D requires radical changes in the way devices are designed, necessitating new deposition and etch approaches.

Amkor Technology’s Marc Mangrum looks at some of the packaging technology that is meeting unique dimensional, environmental, and application requirements.

Coventor’s Michael Hargrove predicts that well-understood materials likely will play a key role in the quantum era.

Brewer Science’s Jessica Albright lays outs the difference between types of chromatography to determine which is best for an application.

Arteris IP’s Paul Graykowski advises bridging the disconnect between requirements and implementation with design-aware traceability.

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