Blog Review: May 15

RISC-V innovation; analog challenges; PCB fabrication; automotive circuit board test.


Cadence’s Anika Sunda suggests that RISC-V has opened numerous doors for innovation and believes EDA tools can help bridge the knowledge gap and foster a growing community of RISC-V developers.

Synopsys’ Alessandra Costa chats with industry experts about challenges facing analog design, what’s needed for multi-die designs, and the potential of AI.

Siemens’ Bill Ji explains why understanding several key steps in the PCB fabrication process is helpful for PCB library creation, primarily imaging and etching, lamination and drilling, solder mask, and silk screen steps.

Keysight’s Kwan Wee Lee explains dual-stage testing for automotive circuit boards and the risks and considerations of having both in-circuit test and functional circuit test methods in a single test station.

Infineon’s Skip Ashton points to supports for new device types in the Matter 1.3 specification, along with updates to core functionality and improved testing coverage.

Ansys’ Susan Coleman and Jennifer Procario check out a startup developing floating solar technology that can be placed on bodies of water in near-shore locations and how finite element analysis and computational fluid dynamics have helped optimize its design.

Arm’s Chris Goodyer highlights what’s new in the latest version of Arm Compiler for Linux, including LLVM 18, improved performance of hyperbolic functions, support for vectorizing loops with math functions, and random number generator libraries.

In a blog for SEMI, Lam Research’s Wojtek Osowiecki looks to employee-driven sustainability projects in the semiconductor industry.

And don’t miss the blogs featured in the latest Automotive, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Siemens EDA’s Reetika and Sulabh Kumar Khare show how to identify reset domain bugs due to soft resets in automotive designs.

Rambus’ Bart Stevens warns that high-value datasets containing sensitive information must be shielded from unauthorized access.

Flex Logix’s Jayson Bethurem predicts that as chiplets evolve, the industry will require more adaptable solutions.

TXOne Networks’ Jim Montgomery shines a light on how GUIs and remote access can provide an entry point for bad actors.

Synopsys’ Nathalie Bijnens points to the need for certifying that root-of-trust IP is protected from physical attacks.

Infineon’s Kimia Azad digs into powering FPGAs for aerospace and defense applications.

Cadence’s Vinod Khera contends that modular design will be needed to deal with the increasing complexity and functionality of modern vehicles.

Renesas’ Daryl Khoo finds plenty of room under the MCU tent for competing and complementary processor cores.

Onto Innovation’s Mike McIntyre explains how device makers can access manufacturing details and recover some of the advantages that were lost when they shifted away from an OEM business model.

Synopsys’ Hari Mani provides an automatic test pattern generation to automatic test equipment (ATPG-to-ATE) translation flow for creating high fault-coverage test vectors.

NI’s Michael Bryner outlines the benefits of modular test systems, including swift integration into different product configurations and reduced costs.

Teradyne’s Thomas Koehler discusses how a battery management system improves range, extends battery life, and ensures Li-ion safety and reliability.

Advantest’s Keith Schaub digs into HPC’s role in the technological revolution as companies pursue advanced, efficient, and accessible AI capabilities.

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