Blog Review: Nov. 17

Decarbonizing compute; HBM3; 10 years of ISO 26262; space debris.


In a podcast, Arm’s Geof Wheelwright and Hilary Tam chat about the importance of efforts to decarbonize compute and how low-power compute can help ensure that the benefits of technology outweigh the environmental cost.

Synopsys’ Graham Allan and Vikas Gautam consider what’s driving demand for HBM3, what’s different from the previous HBM2E specification, unique design considerations, and how it can help drive the move to 3D ICs for data-intensive applications.

Cadence’s Paul McLellan looks back at ten years of the ISO 26262 standard for functional safety in automotive with an overview of what it defines, important later additions for semiconductors, and some other closely related standards.

Siemens EDA’s Jake Wiltgen looks into the expectations when designing hardware to comply with DO-254, the airborne hardware safety standard, particularly the requirements for HDL coding standards.

Ansys’ Magdalena Kuczkowska warns about the impact space debris could have on vital satellite services and launches and checks out a company working to reduce the amount of space debris in orbit by working to locate and remove defunct orbiting trash.

A Rambus writer takes a look at Compute Expreass Link (CXL) 2.0 and how it maintains memory coherency between the CPU memory space and memory on attached devices to enable resource sharing.

Memory analyst Jim Handy will offer a free webinar to help SEMICON West attendees get the most out of the show, with a focus on emerging memory technologies and their impact.

Nvidia’s Jensen Huang introduces an effort to create a digital twin of the Earth with a new supercomputer specialized for ultra-high resolution climate modeling, including the physics, chemistry, and biology of the atmosphere, waters, ice, land, and human activities.

Western Digital’s Thomas Ebrahimi checks out an effort to track and understand wildfires and what it takes to manage the data from the 900 cameras that make up the computer vision network.

Plus, catch up on the blogs featured in the latest Low Power-High Performance newsletter:

Fraunhofer’s Dirk Mayer looks at better ways to integrate numerous functions in autonomous robotic systems.

Rambus’ Joseph Rodriguez contends that the explosion of cameras and sensors in modern cars will require greater reliance on interface specifications.

Synopsys’ Markus Willems and Pieter van der Wolf show how to improve algorithms that extract relevant information from sensors.

Siemens EDA’s Andy Meier and Tomasz Piekarz present alternatives to using actual software workloads in pre-silicon designs.

Arm’s Mohamed Awad explains how to unlock scalability and simplify deployments with flexible IoT development platforms.

Electroflight’s Douglas Campbell digs into battery development and multi-physics simulation for zero-emissions aircraft.

Cadence’s Paul McLellan foresees augmented and virtual reality in the workplace as AR glasses get smaller.

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