Week In Review: Manufacturing, Test


Chipmakers A fire broke out this week at a joint NAND flash fab between Western Digital (WD) and Kioxia. Kioxia is the former Toshiba NAND flash unit that was recently spun out by the Japanese company. “On Monday, January 6, (morning, January 7 local time) a small fire occurred at one of our joint venture facilities in Yokkaichi, Japan. Local firefighters quickly extinguished the fire, and w... » read more

Open Source Hardware Risks


Open-source hardware is gaining attention on a variety of fronts, from chiplets and the underlying infrastructure to the ecosystems required to support open-source and hybrid open-source and proprietary designs. Open-source development is hardly a new topic. It has proven to be a successful strategy in the Linux world, but far less so on the hardware side. That is beginning to change, fueled... » read more

Blog Review: Dec. 18


Lam Research's David Haynes finds that taking advances made at 300mm and applying them via upgrades to 200mm equipment is a cost appropriate strategy to quickly improve yield and add capacity. Synopsys' Taylor Armerding looks at which of this year's many data breaches hit corporate wallets the hardest and how the cost of privacy noncompliance is expected to rise with California's CCPA and st... » read more

Week In Review: Design, Low Power


Rambus finalized its acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure, for $45 million at closing, and up to an additional $20 million, subject to certain revenue targets in 2020. RISC-V SiFive unveiled two new product families. The SiFive Apex processor cores target mission-critical processors with Size, Weight, and Power (SW... » read more

Week in Review: IoT, Security and Automotive


Internet of Things Western Digital Corp. and Codasip are working together on Western Digital’s SweRV Core EH1, which is a RISC-V core with a 32-bit, dual superscalar, 9-stage pipeline architecture. The core, launched earlier this is aimed at embedded devices supporting data-intensive edge applications, such as storage controllers, industrial IoT, real-time analytics in surveillance systems, ... » read more

Week In Review: Manufacturing, Test


Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

Week in Review: IoT, Security, Autos


Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Week In Review: Manufacturing, Test


Trade wars In recent testimony before a U.S. government panel considering tariffs on $300 billion worth of Chinese goods, SEMI called for the removal of about 30 tariff lines. These items are central to the semiconductor manufacturing process. “SEMI asserts that these tariffs will harm not only companies operating in the U.S., but other companies as well in the semiconductor supply chain... » read more

Week In Review: Design, Low Power


ON Semiconductor completed its $946 million acquisition of Quantenna Communications, a San Jose-based company that specializes in Wi-Fi chips and software. Aldec introduced automatic UVM register generation to its Riviera-PRO verification platform. Riviera-PRO can now accept a CSV file or IP-XACT register description as an input and, working at the Register Abstraction Layer (RAL) of UVM, ou... » read more

Falling Chip Forecasts


It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

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