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Week In Review: Manufacturing, Test


Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

Week In Review: Manufacturing, Test


Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

Computing Where Data Resides


Computational storage is starting to gain traction as system architects come to grips with the rising performance, energy and latency impacts of moving large amounts of data between processors and hierarchical memory and storage. According to IDC, the global datasphere will grow from 45 zettabytes in 2019 to 175 by 2025. But that data is essentially useless unless it is analyzed or some amou... » read more

Startup Funding: February 2021


In February, several startups emerge from stealth, with one company working on AI inference architectures for the data center and another trying to make lenses thinner by patterning surfaces with tiny structures. Two new Chinese companies are trying to expand the country's semiconductor design ecosystem with GPUs and interface IP. Plus, a maker of AI chips for ADAS draws another massive round t... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Several chipmakers have not resumed production in their fabs in Texas for the second consecutive week. This follows power outages due to a major winter storm. As reported, a severe winter storm hit many parts of the United States, including Texas. Last week, utility providers began to prioritize service to residential areas in Austin, Texas. As a result, electricity and ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

DRAM, 3D NAND Face New Challenges


It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

Components For Open-Source Verification


Defining an open-source verification methodology is a lot more difficult than just developing an open-source simulator. This is the reality facing open-source hardware such as RISC-V. Some people may be asking for the corresponding open-source verification, but that is a much tougher problem — and it is not going to be solved in the short term. Part one examined the reasons why open-source... » read more

Open-Source Hardware Momentum Builds


Open-source hardware continues to gain ground, spearheaded by RISC-V — despite the fact that this processor technology is neither free nor simple to use. Nevertheless, the open-source hardware movement has established a solid foothold after multiple prior forays that yielded only limited success, even for processors. With demand for more customized hardware, and a growing field of startups... » read more

Blog Review: June 24


Cadence's Paul McLellan provides an overview of the new IEEE 1838 standard for manufacturing test of 3D stacked ICs and how it aims to enable testing of multi-die chiplet-based designs. In a video, Mentor's Colin Walls investigates the scope and lifetime of pointers in embedded applications. A Synopsys writer checks out the latest mobile memory standard, JESD209-5A, and the enhancements i... » read more

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