Blog Review: Sept. 27

PCIe updates; EDA and startups; double patterning errors; intro to interconnects; flexible electronics.


Synopsys’ Mukul Dawar highlights the biggest changes coming to the PCIe 4.0 specification, plus a peek at what’s new in PCIe 5.0.

Cadence’s Paul McLellan considers why EDA startups are less common than they used to be.

Mentor’s David Abercrombie and Alex Pearson discuss new requirements for detecting double patterning errors at advanced nodes.

Rambus’ Aharon Etengoff reports that security researchers successfully conducted a side-channel assisted cryptanalysis attack against QcBits, a code-based public key algorithm based on a problem thought to be resistant to quantum computer attacks.

A Lam Research staff writer presents an introduction to interconnects and the major challenges to shrinking them.

Applied’s Suraj Rengarajan points to why India could become a hotspot for flexible electronics development.

Arm’s Hillary Cain points out a focus on security and connected automotive at this year’s Mobile World Congress.

Silicon Labs’ Kevin Smith digs into the problems caused by an Ouroboros clock configuration and how to spot one.

NetSpeed’s Rakesh Ramanujam digs into the race to autonomous vehicles, describing it as a multi-vendor relay rather than a single-company sprint.

In his latest embedded software video, Mentor’s Colin Walls checks out how parameters are passed to functions in C.

Cadence’s Arthur Schaldenbrand continues his series on analog design by looking at two ways to visualize what Monte Carlo analysis shows about a circuit.

Synopsys’ Luke Arntson examines the “BlueBorne” vulnerabilities present in some implementations of the Bluetooth protocol, plus what to do about it.

And don’t miss the blogs featured in last week’s Manufacturing & Process Technology newsletter:

Editor In Chief Ed Sperling argues that materials vendors need to be included up front in process development or the whole industry will suffer.

Executive Editor Mark LaPedus examines the latest trends in materials.

Technical Editor Katherine Derbyshire explains why neuromorphic computing and neural networks are not the same thing.

SEMI’s Christian Dieseldorff points to big fab equipment sales growth in Korea and China.

Coventor’s Jimmy Gu digs into how to identify which process parameters drive fin top critical dimensions.

Semico Research’s Adrienne Downey looks inside the market for 3D sensing technologies.

Arm’s Brian Fuller explains what an embedded glue layer is and why it matters.

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