Blog Review: September 20

Rigid-flex PCBs; multi-physics effects on multi-die systems; chip design computation and storage requirements; AI memory challenges; modeling MOSFETs.


Siemens’ Patrick Hope considers the unique attributes of materials used in flex and rigid-flex PCB designs and how they are constructed.

Synopsys’ Kenneth Larsen and Shekhar Kapoor find that the increased impact of thermal, signal integrity, and other multi-physics effects on multi-die systems calls for looking at the whole system, from technology to dies and package together.

Cadence’s Vinod Khera looks at the increasing demands on cloud-based EDA workloads as computation and storage requirements for designing chips grows with the shift from 5nm to 3nm process technology.

Rambus’ Steven Woo considers some of the challenges and opportunities for DRAMs and memory systems, particularly as the performance requirements for AI/ML continue growing.

Keysight’s Emily Yan finds that accurate modeling of MOSFETs is essential to optimize power management and explains two popular methods for extracting the threshold voltage.

Ansys’ Milan Redon examines auditory masking and how it can be used in a range of scenarios in which reducing a noise is difficult or undesirable, such as in hearing aids, audio compression, or vehicle interiors.

Arm’s Jiaming Guo shows how to use Perf for Linux with the Performance Monitor Unit extension and describes a basic performance analysis workflow on the real Armv8-A platform.

Renesas’ Graeme Clark points out how to automate a series of Serial Peripheral Interface transfers using a command sequencer.

SEMI’s Berton Mahardja highlights efforts to expand STEM and microelectronics education beyond high school to include younger kids with hands-on kits.

And don’t miss the blogs featured in the latest Low Power-High Performance newsletter:

Fraunhofer IIS/EAS’ André Lange looks at how aging simulation and electromigration analysis can improve the long-term stability of designs in a virtual environment.

Synopsys’ Vamsi Thatha explains why virtual metal fill (VMF) provides more accurate extraction and timing results than the traditional metal sheet over area (MSOA) approach.

Siemens EDA’s Mike Donnelly discusses how new thermal models in the electronics supply chain are helping to cool down thermal design issues.

Keysight’s Amit Varde advises documenting the IP selection process and establishing procedures for effective IP management.

Rambus’ Joseph Rodriguez digs into the latest sensor updates and agreements, which will increase flexibility for handling data.

Quadric’s Steve Roddy suggests downsizing your big, expensive applications-class CPU.

Ansys’ Tim Palucka describes a faster way to predict the operational lifetime of solder joints in automotive applications.

Cadence’s Steve Brown examines plans for automating the design workflow to reduce errors introduced by humans.

Arm’s Julio Suárez assesses performance-per-dollar of Nginx Reverse Proxy and API Gateway on different AWS instances.

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