Week In Review: Auto, Security, Pervasive Computing


Automotive Bosch licensed Arteris IP’s FlexNoC interconnect products for Bosch’s automotive chips. “Arteris IP provides the easiest and fastest means to assemble the complex chips we require while allowing us to implement innovative functional safety mechanisms within our designs,” said Oliver Wolst, senior vice president integrated circuits at Bosch. Mentor, a Siemens business, int... » read more

Far Out AI In Remote Locations


There really isn’t anything that you can do on Earth with electronics that you can’t do in space, but it certainly can be a lot harder and take longer to fix is something goes wrong. And as more intelligent electronics are launched into space, the concern over potential failures is growing. AI inferencing has been pushing out further for some time, and it is starting to redefine what con... » read more

Bridging The Gap Between Driven And Driverless Cars


Today, 91% of car accidents worldwide are caused by some form of human error. Moving to ADAS functions, such as Automatic Emergency Braking or Lane Keep Assist, and autonomous vehicles (AVs) will significantly improve road safety and reduce costs associated with accidents, such as car and highway repair, police, ambulance, and insurance. However, to be fully autonomous will take many years, if ... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT Codasip and Metrics Design Automation announced they have integrated Metrics’ SystemVerilog RTL Simulation Platform within Codasip’s SweRV Core Support Package, version, and it will be accessible on the cloud. Aldec’s TySOM Embedded Development Kits have qualified for Amazon Web Services (AWS) IoT Greengrass. TySOM is a family of Xilinx Z... » read more

Accellera Tackles Functional Safety


During DAC, Accellera had a workshop about functional safety. In case you don't know, Accellera has a relatively new working group (WG) on Functional Safety. The chair is Cadence's Alessandra Nardi, who coincidentally also received the Marie Pistilli Award for Women in EDA during DAC (you can read more about that in my post Alessandra Nardi Receives Marie Pistilli Award for Women in EDA). But ... » read more

Week In Review: Auto, Security, Pervasive Computing


IoT Arm is proposing to transfer its two IoT divisions to SoftBank Group Corp., which will own and operate them under new entities. The two IoT Services Group (ISG) businesses are IoT Platform and Treasure Data. Arm intends to focus more on its IP roadmap in data and compute, once the transfer becomes finalized. It is subject to more board review. “Arm believes there are great opportunities ... » read more

Designing Ultra Low Power AI Processors


AI chip design is beginning to shift direction as more computing moves to the edge, adding a level of sophistication and functionality that typically was relegated to the cloud, but in a power envelope compatible with a battery. These changes leverage many existing tools, techniques and best practices for chip design. But they also are beginning to incorporate a variety of new approaches tha... » read more

Week In Review: Auto, Security, Pervasive Computing


Synopsys has added nanoscale and macroscale illumination optics to its RSoft Photonic Device Tools version 2020.03. ARVR designers can use the RSoft-LightTools Bidirectional Scattering Distribution Function (BSDF) interface to make interpolated BSDF files for optimized nanoscale and macroscale optics, such as freeform optical prism projectors, eye tracking technologies, and optical planar waveg... » read more

Week In Review: Manufacturing, Test


Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

Week In Review: Design, Low Power


Silicon Labs will acquire Redpine Signals' Wi-Fi and Bluetooth business, development center in Hyderabad, India, and extensive patent portfolio for $308 million in cash. Silicon Labs says the acquisition will expand the company's IoT wireless technology, including smart phone and industrial IoT, and accelerate its roadmap for Wi-Fi 6. The deal is expected to close in the second quarter of 2020.... » read more

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