Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Chip Industry Week In Review


Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

RISC-V Unleashes Your Imagination


Since October 2020, Renesas has been officially active in the RISC-V microcontroller space and successfully launched two ASSP products, for motor control and voice-driven HMI systems. Now a general-purpose MCU enhances the RISC-V portfolio. It is the first MCU using a RISC-V core developed internally at Renesas. The R9A02G021 general-purpose microcontroller features an interesting mix of an... » read more

Ultimate Guide To Machine Learning For Embedded Systems


Machine learning is a subfield of artificial intelligence which gives computers an ability to learn from data in an iterative manner using different techniques. Our aim here being to learn and predict from data. This is a big diversion from other fields which poses the limitation of programming instructions instead of learning from them. Machine learning in embedded systems specifically target ... » read more

Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review


By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys  acquired Intrinsic ID, which develops physical unclonable func... » read more

Chip Industry Week In Review


By Adam Kovac, Gregory Haley, and Liz Allan. Cadence plans to acquire BETA CAE Systems for $1.24 billion, the latest volley in a race to sell multi-physics simulation and analysis across a broad set of customers with deep pockets. Cadence said the deal opens the door to structural analysis for the automotive, aerospace, industrial, and health care sectors. Under the terms of the agreement, 6... » read more

AI Performance And Real-Time Control In Robotics And Autonomous Applications


Recent vision AI models have to deal with dynamic and complex environments, resulting in the need for more power efficiency and speed in real-time applications. To meet the market needs, Renesas released the next-generation Dynamically Reconfigurable Processor for AI (DRP-AI) accelerator. The DRP-AI accelerator delivers high-power efficiency of 10 TOPS/W, up to 10 times higher than the conve... » read more

Next Generation Highly Power-Efficient AI Accelerator (DRP-AI3)


As the working population decreases due to falling birthrates and a growing proportion of the population being elderly, advanced artificial intelligence (AI) processing, such as recognition of the surrounding environment, decision of actions, and motion control, will be required in various aspects of society, including factories, logistics, medical care, service robots operating in the city, an... » read more

Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

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