Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to upset the global supply chain.
Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D.
Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applications such as robotics and self-driving vehicles. Besides artificial intelligence — which is everywhere — hot topics for investment included photonics, silicon carbide (SiC), and power ICs.
The table below highlights more than 170 notable chip industry fab or facility investments and updates in 2025.
A selection of global onshoring news and progress:
Asia:
Europe:
Americas:
However, in a volatile and fast-moving market, it can be hard for companies to know exactly where to put their money. For example:
US CHIPS ACT uncertainty, optimism
Following the stream of CHIPS Act announcements in 2024 under President Biden, the Trump administration established an Investment Accelerator within the U.S. Department of Commerce to oversee ongoing CHIPS Act negotiations, and voided its $7.4 billion contract with Natcast. NIST became the new operator.
A growing trend saw the U.S. government negotiate deals that included taking stakes in companies. For example:
Others lost out. NIST terminated its $285M award to the SMART USA Institute in Durham, North Carolina. A Michigan government committee pulled $40M funding for Hemlock Semiconductor’s hyper-pure polysilicon fab, but there is no news yet on the federal government’s $325M.
“I am not sure where we are heading in the U.S. Administration,” said Ajit Manocha, president and CEO of SEMI. “Things are still unknown, and I’m hoping that they will come to the right alignment with the industry, for the industry, because there’s still a lot of turmoil about what they want to keep from the CHIPS Act and what they will rule out. The fear is that in other parts of the world, countries are acting very aggressively and progressively on their Chips Acts. For example, Europe is very active on Chips Act 2.0.”
While there has been momentum, the U.S. cannot stop at CHIPS Act 1.0. “We’ve got to go with multiple CHIPS Acts because the gap is so huge between [the U.S. and] where we pushed most of the manufacturing to Asian countries,” said Manocha. “The gap is, say, hundreds of billions of dollars and maybe 10 to 20 years. CHIPS Act 1.0 was $50 billion. That’s not good enough. That’s a good start.”
Others also expressed cautious optimism. “For the first time in many years, leading-edge advanced logic, advanced memory technology, and advanced packaging are expected to be produced at scale within the United States,” said David Henshall, senior vice president at the Semiconductor Research Corporation (SRC).
Semiconductor equipment suppliers, design firms, and EDA leaders joined IDMs and foundries with renewed enthusiasm for collaborative research. “We are excited to see a significant increase in resources being directed toward collaborative research this year, far more than in previous years,” said Henshall. “Much of this momentum is fueled by AI-driven market growth, which is accelerating advances in areas such as advanced packaging, photonics, power delivery and management, quantum technologies, and more. These added resources are strengthening R&D efforts across logic, memory, and analog-related technologies.
To this end, SRC published its Microelectronics and Advanced Packaging Technologies Roadmap 2.0, and Henshall observed substantial growth across three areas in 2025 — 3D heterogeneous integration, digital twins for semiconductor manufacturing, and resources for education and workforce development.
However, Henshall is concerned that the U.S. could lose leadership in foundational research. “Organizations that traditionally funded early-stage exploration and pathfinding research are increasingly shifting their resources toward nearer-term development and deployment,” he said. “As early-stage research declines, the innovation pipeline risks drying up, slowing domestic technical progress, and creating opportunities for countries misaligned with U.S. interests to catch up, or even surpass, U.S. technological leadership. The result will be lost jobs and domestic supply chains dependent on nations of concern to U.S. interests.”
Reduced support for early-stage research limits opportunities for U.S. scientists and engineers. “This pushes many to pursue careers abroad and, in effect, accelerating other nations’ ascent,” said Henshall. “Unless this trend is quickly reversed, the U.S. risks losing its competitive edge.”
Regional progress
A handful of semiconductor companies in certain countries continued to dominate the markets, such as TSMC for advanced chip manufacturing and South Korea for advanced memory. But other players are making inroads — including Intel.
“Keep in mind that we have other companies that are not U.S.-based building fabs in the U.S.,” said Michael Munsey, vice president of semiconductor industry for Siemens Digital Industries Software. “Intel has some things they have to fix before they start building more fabs. But TSMC is going to continue to invest in the U.S. You have SK hynix building a fab in Indiana. You are going to see more fabs built on U.S. soil. China and India are probably two of the largest regions right now where I see a lot of fabs being built. Southeast Asia, I don’t think to the scale as India. India and China, land-wise and resource-wise, have an advantage. Even in Europe, to a lesser extent, nothing’s changed in terms of the desire to onshore, or the building of fabs.”
Another advantage of Asia is workforce access. For example, Mixel chose Vietnam for a new branch to gain mixed-signal design talent. “It is all about connecting with the right talent pool with the relevant expertise,” said Ashraf Takla, founder of Mixel. “That is what we found in Da Nang, a coastal city in central Vietnam, that is becoming a high-tech and a semiconductor hub. Finding and growing mixed-signal talent is more challenging than analog or digital alone because it requires in-depth experience in both.”
Others agree that India and Southeast Asia have emerged as critical players. “They are especially strong in packaging and advanced node development,” said Rama Puligadda, CTO at Brewer Science. “While Germany continues to strengthen its position in automotive semiconductors and specialty materials, these regions are shaping a more distributed global supply chain, which aligns with our philosophy of building resilient partnerships.”
Brewer Science chose Arizona for an innovation center focused on advanced materials R&D for semiconductor applications, particularly chemistries that support EUV lithography, wafer bonding, and next-generation packaging. “One of the biggest surprises in 2025 was the speed at which regional hubs like Arizona scaled up their capabilities,” said Puligadda. “The level of collaboration between industry, academia, and government exceeded expectations and accelerated innovation cycles.”
Materials concerns
Brewer Science is anticipating breakthroughs in sustainable materials and process integration that will help the industry meet performance goals, without compromising environmental responsibility. However, the supply of rare earth materials remains a strategic concern for the entire industry.
“While global demand continues to rise, geopolitical factors have highlighted the need for diversification,” noted Puligadda. “We believe the U.S. can mitigate risk through two approaches — developing domestic sources and strengthening partnerships with allied nations for critical materials.”
Significant momentum is likely to be seen in emerging materials such as bio-inspired polymers, functional polymers for additive manufacturing, and advanced macromolecular structures that enable next-generation lithography and packaging. “Our collaboration with ASU’s Long Research Group focuses on these areas — particularly polymers that combine high performance with sustainability,” said Puligadda. “Expect to hear more about materials that bridge electronics and environmental responsibility.”
SEMI’s Manocha agreed that materials and the environment are key concerns that should be addressed in CHIPS Act 2.0. “The U.S. should really look at the bigger picture — not just the fabs, but also in material companies, the equipment companies, how they can advance in innovation and practice,” he said. “My biggest fear is about research on the materials side, because we are in a major crisis in the industry, which is an energy crisis. If you look at how the industry is growing in terms of the IC revenue, we’re going to grow to $1 trillion by 2030. In fact, it’s more than $1 trillion, and maybe more than $2 trillion by 2040. This growth is enabled by AI and quantum. Both industries will consume a lot of energy.”
AI infrastructure and power challenges
News headlines in 2025 were dominated by multi-billion-dollar announcements for data centers and compute capacity agreements. Equally, there were many reports about the alarming amounts of resources needed to support this growth.
“The world is building one server farm after another to power AI,” said Thomas Rosteck, division president of Connected Secure Systems at Infineon. “This raises the question of how much power are we using for the server farms for AI. We are at a 2% of global power consumption, and we are moving to 7% of power consumption, and this is scary. 7% is about what India needs as power. This will not work.”
Some of Infineon’s fabs are fully automated, and these face different challenges around power. “We went around one of our own factories, where we are deploying robots in abundance,” said Adam White, division president of Power and Sensor Systems at Infineon. “The particular factory we’re talking about is a lights-out concept. What does that mean? The factory, apart from very few maintenance staff, is fully automated. To make that fully automated, you need robots going from one machine to another machine, bringing in wafers or cassettes, for example. Our facility today has these robots, and we were speaking to the engineering team who installed the robots and trained the robots. We were saying, ‘So they’ve got wheels. They haven’t got feet. Why is that?’ They were saying, ‘At the moment, we’ve got wheels because it actually gives us six hours of battery life. With the robots that are using the feet in-house, which we are now testing, the maximum they can get is three hours.’”
Meanwhile, Siemens announced $285M for two manufacturing facilities for electrical products in Texas and California to help power AI data centers during the industrial AI revolution, as well as supporting commercial, industrial, and construction markets.
“Without something changing, it’s going to be near impossible to keep up the energy demands,” said Siemens’ Munsey. “It cuts across the entire ecosystem so that we have to do something at each step of the process. My counterpart, who handles energy and utilities, is already talking to companies that want to build mini nuclear reactors.”
The power supply problem needs to be modeled in digital twins and addressed at every level of the stack.
“When we look at the way that all this gets modeled, it is ultimately virtually with the digital twin, and we need to extend the digital twin model to be able to do a lot of the advanced analysis,” said Munsey. “We could take data center software and data center applications and do a better job of modeling the power consumption of the chip, and then you feed that forward into tools for multi-physics simulation, and then, therefore, do a better job of predicting heat transfer and heat flow and the need to cool that, and how that now goes from the package level into the blade level, into the racks. You can see the heat distribution and the thermal management at a rack level, then into the data center. We could do much better by cranking all the way back into chip design.”
The chip wars, tit-for-tat export controls
While some of the global ecosystem drew closer in 2025, the U.S. continued to restrict China’s access to certain high-performance AI chips. China retaliated with rare earth export restrictions of materials needed for semiconductor manufacturing.
But how effective are export controls? “I don’t think U.S. AI chip controls are going to be effective toward constraining China’s AI-enabled military modernization,” said Jacob Feldgoise, senior data research analyst at Georgetown University’s Center for Security and Emerging Technology (CSET). “But where I think the controls are likely to have an impact is on China’s economy. To the extent that LLMs are going to have transformative economic impacts and drive productivity growth, China may see a hit to those benefits as a result of the controls.”
In an intensely global supply chain, China — and other countries — may succeed at manufacturing certain nodes on home soil, but not all. “One of the most important spaces to watch over the next few years will be semiconductor manufacturing equipment and the extent to which Chinese companies are able to indigenize capabilities in deposition and etch and back-end packaging equipment for hybrid bonding,” said Feldgoise.
China’s success in developing semiconductor manufacturing equipment, like that made by ASML and Nikon, will likely be uneven. “We looked at market shares across different segments of semiconductor manufacturing equipment,” said Feldgoise. “What we found was that Chinese companies had made slow but steady progress across most of the major tool categories. We saw 5% to 10% increases in market share across deposition, etch and ion implantation. The one area where we saw the least progress, however, was lithography, where even in older forms of lithography, such as i-line lithography tools, Chinese companies had not made any substantial progress, maybe gained a couple of percentage points. While there are ongoing efforts to indigenize DUV and EUV lithography tools, we’re not seeing that show up in the market yet.”
Though China paused new rare earth restrictions, others are still in place. However, it’s hard to measure the exact impact on the U.S. military. “A lot will come down to how many layers of the supply chains the rare earth controls will seep through,” said Feldgoise. “If there’s still 5 or 10 layers between the last controlled item that the Chinese government has visibility into, and the item that is eventually incorporated into a military system, then it’s going to be really hard for the Chinese government to decide which licenses to approve and which ones to deny. But if it is the case that there’s only one or two layers in between those two stages, then it may be more achievable.”
Looking forward
It’s an exciting time for semiconductors with rapid advances in AI, machine learning, robotics, and quantum computing.
“AI will still dominate the news for the next couple of years, and slowly we’ll start seeing quantum will very much pick up,” said SEMI’s Manocha. “In the late part of the last decade, we saw the massive convergence of automotive in semiconductors. The next phase of convergence will be with health care in the medtech industry. There will be a lot more benefits of semiconductors to humanity — better health span and longer lifespan. Just like in the case of automotive, we will become so dependent on electric cars and self-driving cars, and they are good for humanity. The other thing that I’m very passionate about will be the humanoids. Humanoids will become great for humanity, especially people who are in need of help, and they can’t afford the cost or count on humans working with them. For taking care of the elderly, humanoids will become a much better companion, and there’s a lot of potential there. That’s probably in the next five-plus years. I see a lot of growth coming in that area.”
— Emma Riverso contributed to this report.
The following table lists prominent new facility/fab investments and updates announced in 2025 since our last report ran, but there are many more beyond this list. Some items reflect shifts in previously announced plans. The table is currently presented alphabetically according to company or organization, but it can also be sorted by country or other features.
| Company/year | Location | Investment | Facility | Details | |
|---|---|---|---|---|---|
| Air Liquide (Jul 25) |
Europe: Dresden, Germany | Over €250M | Gas production facility: ultra-pure nitrogen, oxygen, argon, hydrogen, helium, CO2 | Expected to be operational in 2027 | |
| Air Liquide (Jul 25) |
South Korea: Hwaseong, Gyeonggi Province | Not disclosed | Molybdenum plant for advanced memory, logic chips | New plant opened July 2025. Also, expected to open another plant in the US by the end of 2025 | |
| Altera, Axiscades (Nov 25) |
India: Bangalore | Not disclosed | Opening a new innovation lab for FPGA-based reference designs used in mission-critical applications | 10,000 square foot innovation lab | |
| AMD (Aug 25) |
Malaysia: Bayan Lepas, Penang | Not disclosed | Opened an office and engineering lab. | 209,000 square foot office space for over 1,200 employees | |
| Amkor, Cadence, TSMC, Tesoro VC (Sept 25) |
USA: Phoenix, Arizona | Not disclosed | AI + semiconductor startup hub and global design center, with launch expected in early 2026 | Access to system design, 3DIC, advanced packaging technology enablement and advanced packaging and test | |
| Amkor (Aug 25) |
USA: Peoria, Arizona | $2B | New packaging and test site to be built | Production expected to start in early 2028 | |
| ams OSRAM (Feb 25) |
Europe: Premstaetten, Austria | €227M EU Chips Act funds; the company plans to invest €567M in the project by 2030 | Expand manufacturing; construct new cleanroom, with production expected in 2030 | Next-gen optoelectronic sensors qualified for med-tech, auto; consumer goods also planned; using CMOS, filter, TSV | |
| Analog Devices (Jan 25) |
USA: Massachusetts; Pacific Northwest | Up to up to $105M CHIPS Act funding | Expand, modernize 2 fabs in Beaverton, Ore. and Camas, Wa. | Front-end mature node manufacturing including 180nm and 350nm process nodes; packaging, test | |
| Apple and partners (Feb 25) |
USA: multiple states | Initially $500B over 4 years; later increased to $600B in Aug 25 | Facilities for end-to-end Si supply chain with its Advanced Manufacturing Program, Apple Manufacturing Academy | Partners include Amkor, Coherent, Applied Materials, GF, TI, GlobalWafers, Corning, Samsung, Broadcom | |
| Applied Materials, GlobalFoundries (Sept 25) |
Asia: Singapore | Not disclosed | To establish a waveguide fabrication at GF Singapore for emerging photonics | Applied Materials will develop waveguide components with GF as its high-volume manufacturing partner | |
| Applied Materials (Aug 25) |
USA: Chandler, Arizona | $200M | To create an advanced manufacturing facility to produce equipment components and parts | Creation of potentially 200 additional manufacturing, R&D and services jobs in the semiconductor field over a five-year period | |
| Applied Materials, CEA-Leti (Jun 25) |
Europe: Grenoble, France | Not disclosed | Expansion of joint lab to include full-flow development of specialty devices. Also, the lab would be equipped with state-of-the-art advanced packaging tools | Develop materials engineering solutions for AI data centers; specialty devices for IoT, comms, auto, power, sensors | |
| Applied Materials (Nov 25) |
South Korea: Osan | Not disclosed | Plans for a new chip business collaboration and research center | ||
| Applied Materials, ASU (Oct 25) |
USA: Tempe, Arizona | $270M | Opened a materials-to-fab R&D, prototyping facility | Located inside the ASU’s research park | |
| Arteris (Apr 25) |
Europe: Krakow, Poland | Not disclosed | Opened engineering, customer support hub for Si-proven NoC IP, SoC integration automation SW | Connected to the company’s work with AGH University of Krakow | |
| ASE (Feb 25) |
Malaysia: Penang | Not disclosed | Launched its packaging and test plant | ASE’s fifth facility in Penang, Malaysia. The new plant will expand the floor space from 1 million to 3.4 million sq-ft | |
| ASE (Oct 25) |
Malaysia: Penang | Not disclosed | ASE to purchase ADI Penang facility; build-up area of over 680,000 sq ft | Also, ADI and ASE intend to enter into a long-term supply agreement for ASE to provide manufacturing services for ADI | |
| ASE (Oct 25) |
Taiwan: Kaohsiung | NT$17.6B (~US$579M) | Broke ground on new facility for an advanced IC packaging for AI, HPC, automotive applications | The new fab K18B to commence operations in early 2028, offering CoWoS chip packaging and SiP | |
| ASE-USI subsidiary (Dec 25) |
Vietnam | Not disclosed | Expanding its Hai Phong plant and also intends to purchase land for a 2nd manufacturing facility in Vietnam | Hai Phong plant to achieve monthly capacity of 100,000 units of 800G/1.6T silicon photonic-based optical transceivers | |
| ASM (Dec 25) |
South Korea: Hwaseong, Gyeonggi Province | $100M investment | Opened a new IC innovation, manufacturing center for advanced chips, including ALD and Epi technologies | Built on a 7,400 m² site alongside existing Korean facilities | |
| ASML (Mar 25) |
China: Beijing | Not disclosed | Reuse & Repair Center | ||
| ASML (Nov 25) |
South Korea | 240B won ($164M) | Opened an office complex, R&D, operations, allows collaboration with SK and Samsung | Equipped with maintenance facilities and training centers for DUV and EUV lithography; 16,000-square-meter site | |
| ASML (Nov 25) |
USA: Phoenix, Arizona | Not disclosed | Technical academy for lithography engineering | Fully operational 56,000-sq-ft facility | |
| A*STAR (May 25) |
Singapore | Not disclosed | Unveiled 200mm SiC Open R&D line. Also, Lab-in-Fab 2.0 piezoelectric MEMS with ST, ULVAC, and NUS |
Partners, including GF, will gain access to the new facilities | |
| A*STAR, partners (Jun 25) |
Singapore | $123M | Opened National Semiconductor Translation and Innovation Centre for GaN | 6-inch GaN-on-SiC, 8-inch GaN-on-Si wafer fab lines for advanced 5G, 6G, radars, satellite. It will also offer advanced GaN technology with gate length below 0.1 micrometres and operation frequencies above 100GHz | |
| Aston Univ., partners (Jun 25) |
UK | £5.6M over 4 years from EPSRC | Plans to build a UK Multidisciplinary Centre for Neuromorphic Computing | Led by AIPT and will include researchers from Aston University, Oxford, Cambridge, the University of Southampton and more. | |
| ASU, Univ. Of Michigan (Aug 25) |
USA: Arizona | Not disclosed; funded by NSF | Center for Digital Twins in Manufacturing | The center will operate as an NSF Industry-University Cooperative Research Center. Center kickoff in late 2025/early 2026 | |
| Awz Ventures (Nov 25) |
Israel: Ashkelon | Initial investment NIS 5B ($1.6B) | Plans to build chip manufacturing facility for III-V ICs for defense, academic, civilian institutions | 70,000-sq-m facility | |
| Baya Systems | UK: Cambridge, England | Not disclosed | Opened a regional headquarters and strategic collaboration hub | Enabling closer engagement with European customers, research institutions and partners building next-generation chiplet-based, AI-optimized systems. | |
| Black Semiconductor (Feb 25) |
Germany: Aachen | Will apply €254.4M funding round in June 2024 toward the project | Opened new headquarters in Aachen. Also building a graphene-based optical chip facility, FabONE | Up to 15,000 square meters of production space for cleanroom and infrastructure construction, with pilot line production in 2027 and full production by 2031 | |
| Brewer Science (Sept 25) |
USA: Chandler, Arizona | Not disclosed | Opened a research, customer engagement hub | ||
| Cadence (Oct 25) |
USA: San Jose, California | Not disclosed | Plans to expand AI Hub at San Jose State University. | This multi-year agreement will also include a significant donation of AI design software and digital twin technology to SJSU from Cadence | |
| Catalonia Government (Apr 25) |
Europe: Spain: Catalonia | €400M | ‘InnoFab’, a new 2,000 m2 state-of-the-art cleanroom will kick off in 2025 | Research and pre-production center for chips that use alternative materials to silicon and have strategic applications in sectors such as electronics, health, and energy | |
| CHIPX Global (Dec 25) |
Malaysia | Not disclosed | Plans to build a new 8-inch GaN and SiC wafer fab | Expands regional capacity for power and photonics devices used in AI, EVs, and aerospace | |
| Clas-SiC (May 25) |
India: Odisha
Europe: Mainland |
Not disclosed | Plans to build a new SiC facility in India. Also plans to build a new Europe wide bandgap wafer fab | ||
| Coherent (Jul 25) |
Vietnam: Dong Nai | $127M | Opened a new manufacturing plant, primarily for SiC ICs, , optical glass, and advanced optoelectronic components | ||
| Coherent (Jan 25) |
USA: Easton, Pa. | Up to $79M CHIPS Act funding; additional to funding for Sherman, Texas | Expansion of existing manufacturing facility to increase production capacity of 150mm and 200mm SiC substrates | Also support the expansion of the facility’s SiC epitaxial wafer manufacturing capacity, back-end of line processing, electronic performance, and reliability testing capabilities. | |
| Czech Semiconductor Center (Mar 25) |
Europe: Czech Republic | Funded under the EU Chips Act | Opened center to provide access to 5 EU prototyping lines, specialized chip design software | Collaboration with Brno U. of Technology, Czech Technical U., South Moravian Innovation Center, National Semiconductor Cluster and others | |
| Dongjin Semichem Texas (Feb 25) |
USA: Killeen, Texas | $2.4M Texas Semiconductor Innovation Fund grant; $110M expected capital investment | Expand semi specialty chemicals and materials facility | Ultra-high-purity photoresist thinners to be produced in Texas for the first time | |
| Empower Semiconductor (Dec 25) |
USA: Milpitas, California; Europe: Munich, Germany | Not disclosed | New Silicon Valley headquarters for growth in R&D, applications, product engineering and reliability teams. Plus a Munich R&D design center to serve as a regional innovation hub. | To support rapid development of Empower’s vertical power-delivery platforms and derivatives | |
| Enfabrica (Feb 25) |
India: Hyderabad | Not disclosed | Opened new office, R&D center | Aimed at Accelerated Compute Fabric SuperNIC silicon and networking software for AI infrastructure used for GenAI training, inference and RAG applications | |
| EnSilica (Aug 25) |
Europe: Budapest, Hungary | Not disclosed | Opened new mixed-signal design center | Focus on developing advanced mixed-signal designs for industrial and automotive applications, providing additional EU-based design capacity | |
| EnSilica (May 25) |
UK: Cambridge, England | Not disclosed | Opened new engineering hub, mmWave, RF integrated circuit design | UK Space Agency C-LEO funded award | |
| Entegris (Nov 25) |
USA: Colorado Springs, Colorado | Supported by up to $100M in local, U.S. government incentives | Opened new manufacturing center for advanced products for filtration, purification; FOUPs | 135,000-sq-ft | |
| E&R Engineering Corp. (Sept 25) |
USA: Phoenix, Ariz.; Portland, Oregon | Not disclosed | Establishment of two IC laser, plasma demo labs | To open by 2026; enabling local sample testing and process parameters fine-tuning to shorten development cycles and speed time-to-market. | |
| ExxonMobil (Mar 25) |
USA: Baton Rouge, La. | Not disclosed | Upgrade to existing plant, producing 99.999% high-purity isopropyl alcohol for U.S. chip production | Ultra-pure IPA is used for drying wafer surfaces, reducing impurities, preventing damage. | |
| European Commission (Dec 25) |
Europe: Germany | €623M (~US$729M) | New German semiconductor manufacturing facilities for GlobalFoundries and X-Lab | €495M for GF for new 300mm wafer manufacturing capacity by adjusting and expanding the company’s existing site in Dresden. €128M for X-FAB for a new open foundry facility at its existing site in Erfurt | |
| Flanders Semiconductors (Oct 25) |
Europe: Flanders, Belgium | Not disclosed | New hub to promote IC sector, grow supply chain | Proposed under EU Chips Act, consortium created between 4 Flemish Universities | |
| Foresight Technologies (Dec 25) |
Malaysia | Not disclosed | New plans to expand its Penang facility | The new 80K SF facility adds to the company’s current 110k SF facility, increasing Foresight’s Malaysia manufacturing campus by over 70% | |
| FormFactor (Apr 25) |
Taiwan | Not disclosed | Expand Taiwan Service Center to support customers of advanced packaging for AI, HPC, mobile, auto | Double the cleanroom space, extra office areas to streamline repair turnaround | |
| FormFactor (Jun 25) |
USA: Farmers Branch, Texas | $55M | Purchase of an existing Farmers Branch, Texas manufacturing facility to use for FormFactor’s probe-card products | Four structures and includes 50,000 square feet of clean room space | |
| Fujifilm (Feb 25) |
Europe: Antwerp, Belgium | ¥4B (~$26M) | Install new production facilities of CMP slurries, advanced semiconductor materials, and enhance existing facilities for photolithography-related materials at its production site | The new CMP slurry production facilities and the enhanced developer production facilities are both scheduled to start operation in the spring of 2026 | |
| Fujifilm (Nov 25) |
Japan: Shizuoka | Not disclosed | Completion of an advanced semiconductor materials facility | For development of advanced resists for EUV, ArF, NIL, PFAS-free materials and more | |
| Graphcore (Oct 25) |
India: Bengaluru | Investment of up to £1bn (~$1.3) over the next decade | AI engineering campus; plans to hire the first 100 AI semiconductor engineering roles in India | Wholly owned subsidiary of Softbank | |
| Georgia Tech (Nov 25) |
USA: Georgia | Not disclosed | New Center for Wireless Intelligence to advance FutureG wireless technologies: beyond 5G and 6G | Includes 6G Integrated Sensing and Communication Testbed, combining sub-6 GHz and mmWave spectrum with edge computing and AI capabilities in a live urban environment | |
| GF (Jan 25) |
USA: NY | $575M, plus $186M in R&D over 10 years; NY state to provide up to $20M in addition to earlier $550M; up to $75M additional CHIPS ACT funding | New center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility | Meet growing demand for GF’s Si photonics and other chips for AI, automotive, aerospace and defense, comms | |
| GF (Jun 25) |
USA: Vermont, NY | Additional $3B, for an aggregate $16B including prior investments | Expand IC manufacturing and adv. packaging capabilities | Builds upon the company’s existing U.S. expansion plans to expand and modernize its NY and Vermont facilities and funding for its recently launched New York Advanced Packaging and Photonics Center | |
| GF (Oct 25) |
Europe: Dresden, Germany | €1.1B (~$1.27B) | Expand IC manufacturing and upgrade to offer end-to-end European processes and data flows for critical semiconductor security requirements | Production capacity increase to more than 1M wafers per year by end of 2028; focus on low power, embedded secure memory, and wireless connectivity | |
| GF (Nov 25) |
Singapore | Not disclosed | Acquisition of existing Advanced Micro Foundry (AMF) to expand GF’s silicon photonics technology portfolio | largest pure-play silicon photonics foundry | |
| GigaDevice (Jun 25) |
Singapore | Not disclosed | Opening of new global headquarters | Specializing SPI NOR Flash; and 32-bit MCUs, sensors, analog | |
| Gradiant (Mar 25) |
Europe: Dresden, Germany | Not disclosed | Ultrapure water facility | Will support one of the world’s largest semi manufacturers | |
| Hamamatsu Photonics (Mar 25) |
Japan: Hamamatsu City | About ¥7.5B | New building at the Shingai Factory to boost production of optical semi devices | Includes devices for semi manufacturing, inspection equipment | |
| Hitachi (Apr 25) |
Japan: Kudamatsu, Yamaguchi | ¥24B yen (~$167.8M) announced in Apr 23 | New production facility for Hitachi’s etching systems is now open | 35,000 new square metres of space – essentially doubling the company’s production capacity | |
| IBM (Apr 25) |
USA | $150B over 5 years | Expanded facilities to manufacture mainframe, quantum computers; R&D | Aims to fuel the economy, accelerate global leadership in computing | |
| IBM, Basque Gov’t (Oct 25) |
Europe: San Sebastián, Spain | Not disclosed | Officially inaugurated IBM-Euskadi Quantum Computing Center | Also unveiled IBM Quantum System Two, powered by a 156-qubit IBM Quantum Heron processor | |
| IBM, University of Dayton (Nov 25) |
USA: Dayton, Ohio | $10M IBM investment | New nanofabrication facility at U. Of Dayton campus. | Planned completion in early 2027 | |
| imec (Nov 25) |
Qatar | Not disclosed | R&D hub for PDKs, silicon photonics, 3D integrated circuits, silicon interposers | Agreement with Invest Qatar and QRDI | |
| imec (Oct 25) |
Europe: Heilbronn, Germany | Not disclosed | Opening of new office dedicated to chiplet design, advanced packaging, system integration, sensing, and (edge) AI | Part of Automotive Chiplet Program; partner in CHASSIS | |
| imec, Baden-Württemberg govt. (Mar 25) |
Europe: Baden-Württemberg, Germany | €40M initially for 5 years, with €5M funding | Launch of the Advanced Chip Design Accelerator (ACDA), a new imec competence center | To develop state-of-the-art chiplet, packaging, system integration, sensing, and (edge) AI technology as part of imec’s Automotive Chiplet Program (ACP). | |
| imec, TNO (May 25) |
Europe: Eindhoven, Netherlands | Not disclosed, partly funded by PhotonDelta | Official launch of Holst Centre Photonics Lab | Bridge innovation, industrialization for auto, healthcare, data communications | |
| India Semiconductor Mission (Aug 25) |
India: Odisha; Punjab; Andhra Pradesh | ~US $554M | Four compound manufacturing and advanced packaging facilities are approved | SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies |
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| Indichip, Yitoa Micro Technology (Jan 25) |
India: Andhra Pradesh | Rs 14,000 crores | New agreement to build a SiC wafer fab for renewable energy, EVs | roduction capacity of 10K wafers per month, ramping up to 50K wafers per month in 2-3 years | |
| Infineon (Jan 25) |
Thailand: Samut Prakan, south of Bangkok | Not disclosed | Launch construction of a new backend fab for power modules | First building to be ready for operations at the beginning of 2026; further ramp-up will be managed in line with demand | |
| Infineon (Feb 25) |
Europe: Dresden, Germany | €920M German State aid under the EU Chips Act plus IPCEI funds; the company is investing €5B | New approved funding for Smart Power Fab | Previously announced in 2023; fab opening planned in 2026 | |
| Infineon (Mar 25) |
India: Ahmedabad, Gujarat | Not disclosed | Inauguration of Global Capability Center | R&D for advanced chip design, product software, IT, Systems & Application Engineering | |
| Infineon (Oct 25) |
Europe: Graz, Austria | Not disclosed | New UWB wireless tech for auto, IoT, industrial applications | Application lab developed in collaboration with Silicon Austria Labs | |
| IntelliEPI (Jan 25) |
USA: Allen, Texas | Up to $10.3M CHIPS Act funding | Expansion and modernization of existing facility for epitaxy wafers for advanced compound semis; InP, GaAs, GaSb, GaN wafers | Expands domestic capacity for epitaxy wafers | |
| IQM (Nov 25) |
Finland | €40M (~$46.6M) | Expanded production facility for advanced quantum chips for error corrected quantum computers | Expected completion by Q1 2026 | |
| Japan (Dec 25) |
Japan: Chitose | US$642M | Plans to build a new prototyping center featuring EUV equipment | Start operations in fiscal 2029 | |
| Jenoptik (May 25) |
Europe: Dresden, Germany | just under 100M euros | Opened new micro-optics fab | Supporting production technologies with state-of-the-art, high-precision sensors for high-performance chips, e.g., for applications in AI | |
| Keysight, U. of Malaga (Jan 25) |
Europe: Spain | Not disclosed | Opened a 6G research and innovation lab | The lab features three main workspaces: Monitor, Measurement, and Experience | |
| Kioxia and Sandisk (Sept 25) |
Japan: Iwate Prefecture, Kitakami | Portion of investment subsidized by Japanese gov’t | Began operations of Fab 2 for 8th-gen, 218-layer 3D flash memory | Production capacity will ramp up in stages, with meaningful output expected in the first half of 2026 | |
| KIST (Sept 25) |
Asia: Seoul, South Korea | Not disclosed | Opened full-cycle photonics-based quantum fabrication | First in South Korea | |
| KoMiCo (Mar 25) |
USA: Round Rock, Texas | $36M company investment plus $2M Texas Semiconductor Innovation Fund grant | Expand facility that provides precision cleaning and coatings for semi wafer manufacturing tools | Expanding by over 40,000 sq-ft to increase clean room, production lines to handle sub 10nm geometry chamber tool parts | |
| Korea Zinc (Dec 25) |
USA: Tennessee | $6.6B capital investment, $210M in CHIPS Act funding | New advanced smelter and critical minerals processing facility | To produce 13 critical and strategic minerals that are vital to semiconductors, AI, quantum computing, aerospace & defense, automotives, and industrials | |
| La Luce Cristallina (Sept 25) |
USA: Austin, Texas | Not disclosed | Opened new fab for wafer-scale fabrication of its crystal-on-glass BaTiO₃ substrates | Also, launched new 200-mm (8-inch) barium titanate (BaTiO₃) wafer | |
| Lam Research (Feb 25) |
India: Bengaluru, Karnataka | INR 10,000 crore (~$1.2B) | Signed a deal to lease and eventually purchase a land parcel located in Whitefield, Bengaluru | ||
| Lam Research (Mar 25) |
Europe: Enschede, Netherlands | Not disclosed | Opened a European center for pulsed laser deposition development | 100-sq-mt clean room to support customer demonstrations and enable future devices | |
| L&T Semiconductor (Jan 25) |
India | $10B | Plans to build a SiC fab | Planned for after it after it hits at least $1B per annum revenue selling its designed and patented chips | |
| LG Innotek (Apr 25) |
South Korea | Not disclosed | Publicly unveiled Dream Factory fab for FC-BGAs | Spanning 26,000 sq-mt, aims to eliminate defects caused by human contact through robots and full automation | |
| Macom (Jan 25) |
USA: Lowell, Ma.; Durham, N.C. | Up to $70M CHIPS Act funding to support company’s 5-year strategic investment plan of up to $345M | Modernize and expand facilities in Massachusetts and N. Carolina | To increase production of existing 100mm GaN and GaAs semiconductor fabrication and introduce production of 150mm GaN | |
| Marvell (Sept 30) |
Vietnam: Ho Chi Minh City; Da Nang | Not disclosed | Opening of 3 new facilities: two in Ho Chi Minh City, and ICT1 in Da Nang | Ho Chi Minh City facility will feature a R&D lab equipped with advanced validation tools for testing chips | |
| Mexican Govt. (Feb 25) |
Mexico: Puebla, Jalisco, Sonora | Not disclosed | National Semiconductor Design Center; network of design hubs | Part of the Kutsari project, a national initiative to strengthen the country’s semi industry | |
| Merck KGaA (Dec 25) |
Taiwan: Kaohsiung | € 500M (~$586.9M) total investment | Opening of an Integrated production site focused on IC materials, especially thin films | 150,000 m2 site | |
| Micron (Jan 25) |
Singapore | About $7B | Broke ground on HBM advanced packaging facility to meet AI data center demand | Adjacent to the company’s current facilities; scheduled to begin in 2026 | |
| Micron (Jun 25) |
USA: Boise, Idaho; Manassas, Virginia; New York | $30B for fabs on top of earlier amounts, plus $50B for domestic R&D | Leading-edge memory; advanced packaging for HBM | Building 2nd memory fab in Boise; expanding fab in Manassas; continued work on megafab in NY | |
| Micron (Sept 25) |
Japan: Hiroshima | 536B yen (~$3.63B) from Japan | Funding for new fab for DRAM, memory development, mass production | Aims to start shipping advanced memory chips in 2028 | |
| Micron (Nov 25) |
Japan: Hiroshima | 1.5T yen ($9.6B) | Build a new factory within Hiroshima for HBM chips | Confirmation is pending from Micron | |
| Mixel (Jan 25) |
Vietnam: Da Nang | Not disclosed | New branch to expand engineering talent, serve customer base | Marks the company’s first office in Asia | |
| Muratec, InSeCoTec (Aug 25) |
Europe: Dresden, Germany | Not disclosed | Technical training center | Building HQ on the same site | |
| NaMo Semiconductor (Oct 25) |
India | Estimated cost Rs 4.95 crore (~$557,828), funded under Members of Parliament Local Area Development (MPLAD) Scheme | Approval for new Lab at IIT Bhubaneswar for youth, chip design, fabrication, packaging | ||
| National Manufacturing Institute Scotland (Mar 25) |
UK: Inchinnan, Renfrewshire, Scotland | £9M funding injection from Innovate UK | Advanced packaging scale-up line for power electronic semis | Aims to support UK companies developing new solutions, expanding use of UK-made wafers | |
| Northrop Grumman (Sept 25) | USA: Calif., Maryland, Florida | Not disclosed | U.S. government accredited foundries now open to external customers | Includes access to adv. packaging facility (100mm-300mm wafer bumping, probing, dicing ) | |
| Nova (Jan 25) |
Germany: Bad Urach | Not disclosed | Opening of new chemical metrology manufacturing facility, R&D center | Doubles production capacity, expands global presence | |
| NVIDIA (Apr 25) |
USA: Arizona; Texas | Not disclosed | Working with manufacturing partners to build new fabs for GPUs/AI; supercomputers. Samsung-Nvidia AI factory (Oct 25) | Commissioned more than 1M sq-ft to build, test Blackwell chips in Arizona; AI supercomputers in Texas; partners include Amkor, SPIL, TSMC, Foxconn and more. | |
| Ontario. Ranovus (Aug 25) |
Canada: Ottawa, Ontario | Over $100M CAD | Expand its optical semi fab, specifically advanced optical interconnect solutions | Reshoring effort; specialized AI chips | |
| OpenAI, Oracle, SoftBank (Sept 25) |
USA: Texas, New Mexico, Midwest | $400B investment over next 3 years | AI data centers | ||
| OQC and Digital Realty and NVIDIA (Sept 25) |
USA: New York, New York City | Not disclosed | Launch of Quantum-AI Data Centre | First Quantum-AI Data Centre in New York City; located at Digital Realty’s JFK10 | |
| Panasonic (Sept 25) |
Thailand: Ayutthaya | 17B yen (~$114.3M) | Construct new manufacturing facility for its MEGTRON multi-layer circuit board materials | Mass production scheduled by end of fiscal year 2028 | |
| PhotonHub PHACTORY (Apr 25) |
Europe: Brussels, Belgium | €15M in funding from the EU Commission | Photonics hub launched, covering value chain (early-stage concept, prototyping, upscaling) to fast-track access to labs, subsidies | Led by Brussels Photonics at Vrije Universiteit, the initiative builds on PhotonHub Europe | |
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Polymatech Electronics (Aug 25) |
Europe: Estonia | Not disclosed | Commissioning of PCB fab | 10,000-sq-f cleanroom,capable of producing up to 50,000 square meters of multi-layer High-Density Interconnect (HDI) PCBs annually | |
| proteanTecs (Nov 25) |
Japan: Yokohama, Kanagawa Prefecture | Not disclosed | New Japan office opened | Strategic expansion in the Japanese market; advanced analytics solutions for semiconductor health and performance monitoring | |
| PsiQuantum (Sept 25) |
USA: Chicago, Illinois | $1B in funding for Series E | Broke ground on quantum computing site | America’s first million-qubit scale, fault-tolerant quantum computer will be built and deployed | |
| Quadric (Jan 25) |
Japan: Tokyo | Not disclosed | Opening of new Japan subsidiary and office to support expanding customer base | Licensor of fully programmable GPNPU, capable of running both ML inference workloads and traditional DSP and control algorithms | |
| Quantinuum (Jan 25) |
USA: New Mexico | Not disclosed | New quantum R&D center | The proposed center will focus on photonics technologies. Expected to open in late 2025. | |
| Quantum Brilliance (Nov. 25) |
Australia: Melbourne | $13M investment | Official opening of quantum-grade diamond at scale production facility | 1st of its kind | |
| QuantumDiamonds (Dec 25) |
Europe: Munich, Germany | €152M | Plan to build new production facility for advanced chip testing systems | ||
| Renesas | India: Uttar Pradesh, Bengaluru | Not disclosed | Inauguration of 3nm chip design facilities | Indian govt. Inaugurated facilities; signed MoU with Renesas to strengthen ecosystem | |
| Research Fab Microelectronics Germany (Mar 25) |
Europe: Germany | Not disclosed; funded under the EU’s €730M APECS pilot line | Unveiled Chiplet Application Hub to bridge gap between research, industrial use | Led by Fraunhofer-Gesellschaft; signed MoU with imec’s auto chiplet center in Baden-Württemberg | |
| Rigaku (Oct 25) |
Taiwan | Not disclosed | R&D, customer support, joint development | ||
| Rigaku (May 25) |
Japan | Not disclosed | Opened new facility for X-ray diffraction systems, manufacturing, assembly, shipping | Floor space tripled to 23,000 sq-m | |
| Rigetti Computing, Montana State University (Aug 25) |
USA: Montana | Not disclosed | Opening of QCORE, a new research and innovation center dedicated to quantum and photonic systems integration | On-premise 9-qubit Novera QPU | |
| RPI (Nov 25) |
USA: Albany, USA | Not disclosed | Launched Semiconductor CoLab, to advance semiconductor research, microelectronics academic programming | 6,000 sq ft at NY Creates’ Albany NanoTech Complex | |
| Samsung (Sept 25) |
USA: Taylor, Texas | TSIF $250M grant recipient. Project includes more than $4.73B in capital investment | Update: Texas grant given towards a new initiative at the Taylor semiconductor fabrication facility as part of an onshoring strategy and transition to the manufacture of 2nm technologies | ||
| SCREEN, NY Creates (Dec 25) |
USA: Albany, NY | $75M | Plans to build a new R&D center for process applications, within Albany NanoTech complex | R&D for post etch, pre-deposition, pre-lithography, post CMP cleans, selective wet etch, and other critical process steps | |
| SEALSQ, Kaynes SemiCon (Sept 25) |
India | Not disclosed | Joint venture to establish an Outsourced Semiconductor Test and Personalization facility within the Kaynes SemiCon’s site | ||
| Shenzhen Longsys Electronics (May 25) |
Brazil | Not disclosed | Memory fab | Part of China’s partnerships with Brazil | |
| Siemens (Mar 25) |
USA: Fort Worth, Texas; Pomona, Calif. | $285M for 2 facilities; $10B total for U.S. manufacturing jobs, software, AI infrastructure | Unveiling of two manufacturing facilities for electrical products in commercial, industrial, construction, and powering AI data centers | Siemens now surpasses $100B in total U.S. investment over the past 20 years | |
| Silicon Labs (Feb 25) |
USA: Austin, Texas | $23M from the Texas Semiconductor Innovation Fund | New R&D lab for secure, intelligent wireless technology | Help with the build-out and design of Silicon Labs’ Series 3 technology, an advanced wireless platform that makes devices smarter and more connected than ever before | |
| SkyWater (Mar 25) |
USA: Austin, Texas | Not disclosed | SkyWater to purchase Infineon’s 200 mm Fab 25; operate as a foundry for auto, industrial defense | The companies also signed a long-term supply agreement | |
| Solstice Advanced Materials (Dec 25) |
USA: Spokane Valley, Washington | $200M investment | Expansion, modernization of electronic materials facility, sputtering targets | The expansion will introduce 100% laser-vision quality inspections, real-time monitoring, full product traceability and rapid root-cause analysis | |
| SpaceX (Mar 25) |
USA: Bastrop, Texas | $17.3M Texas Semiconductor Innovation Fund grant; expected over $280M capital investment | Expand semiconductor R&D, advanced packaging facility for Starlink kits, component parts | Over 3 years, the facility will expand by 1M sq-ft to be the largest PCB, PLP facility in North America | |
| Spain, Diamond Foundry (Nov 25) |
Europe: Trujillo, Spain | The Spanish government will invest €753M ($868M) | New synthetic semiconductor diamond wafers plant | ||
| Spirox (Feb 25) |
Taiwan: Hsinchu | Not disclosed | New power semi dynamic reliability verification laboratory for auto | Established in collaboration with SET GmbH now part of NI | |
| STMicroelectronics (Sept 25) |
Europe: Tours, France | $60M | New PLP pilot line in Tours | Panel-level packaging technology, expected to be operational in Q3 2026. | |
| Sumika (Jan 25) |
USA: Baytown, Texas | Up to $52.1M CHIPS Act funding | Ultra-high purity isopropyl alcohol used in advanced logic and memory chip production | Construction of a greenfield factory as most UHP IPA production is in East Asia | |
| Swiss Fablab (Jul 25) |
Europe: Zurich, Switzerland | Not disclosed | National chip production, research center; bespoke chips for robotics, SDVs, satellite comms, quantum computing | Center is organized by Swiss semi industry, universities; includes 4,000 sq-m cleanroom | |
| Synopsys (Sept 25) |
India: Bengaluru, Karnataka | Not disclosed | R&D facility | 455,000 sq. ft to support EDA, semiconductor IP, verification and design | |
| Tachyum (Oct 25) | Taiwan | Not disclosed | Opening of new manufacturing, testing, assembly, ODM, logistics and support facilities | To advance of production of the Prodigy Universal Processor | |
| Taiwan government (Oct 25) |
Taiwan:Kaohsiung | Tech expected to create NT$7 trillion (US$228 million) in production value by 2028 | Build a national silicon photonics hub | Hon Hai Precision Industry Co to build center | |
| Taiwan govt. (Jul 25) |
Taiwan | Aims to generate over NT$15 trillion (US$510.86B) in economic value by 2040 | Ten Major AI Infrastructure Projects focused on Si photonics, quantum, AI robotics | Also establish 3 international research labs | |
| Tata Electronics (Sept 25) |
India: Jagiroad, Assam | Total ~US$ 14B for Dholera fab and Jairoad OSAT | To build the first commercial Fab in Dholera, Gujarat and first OSAT facility in Jagiroad, Assam | ||
| Thales, Radiall, FoxConn (May 25) |
Europe: France | Total potential investment over €250M | Exploring creating of an OSAT for SiPs for aero, auto, telecoms, defense, advanced packaging | Planned production capacity in excess of 100 million System In Package (SIP) per annum by 2031 | |
| Thema Foundries (Aug 25) |
Europe: Oudenaarde, Belgium | €200M investment | Establish Europe’s first full-fledged photonic chip center | Conversion of BelGaN facility into production and service centre for integrated photonics | |
| Texas Instruments (Nov 25) |
Malaysia: Melaka | Potential investment up to MYR 5B (~$1.2B) | Opened its 2nd assembly, test factory | 6 levels; 900,000 sq ft | |
| Texas Instruments (Jun 25) |
USA: Sherman and Richardson, Texas; Lehi, Utah | $60B for 7 fabs across 3 sites | Low-cost 300mm capacity at scale for analog, embedded processing chips | TI’s largest mega-site in Sherman, TX, includes SM1 and SM2 already underway, and two additional fabs, SM3 and SM4 | |
| TII and NVIDIA (Sept 25) |
Middle East: Abu Dhabi, United Arab Emirates | Not disclosed | New AI, robotics R&D hub | First-of-its-kind hub in the region | |
| Tokyo Electron (Feb 25) |
Japan: Miyagi | Approx. ¥104B (~$680M) | New production building at the Miyagi site started construction in summer 2025 with completion expected in 2027 | The site in Iwakura, adjoining to the north of the Tokyo Electron Miyagi plant, was acquired in May 2021; total floor area approx. 88,600 m² | |
| Tokyo Electron (Oct 25) |
Japan: Koshi-shi, Kumamoto | Construction cost: Approx. 47 billion yen (~$304.8) | Completed construction of new development building for semiconductor manufacturing equipment including coater/developers and cleaning systems | Next-gen development activities prioritizing safety, quality, environment, development, operations | |
| Tokyo Electron (Sept 25) |
India: Bengaluru, Karnataka | Not disclosed | Establishment of a new software development, equipment design, simulation site | ||
| Toray (Mar 25) |
Taiwan: Songshan, Taipei; Zhubei, Hsinchu | Not disclosed | Opened technologies and materials R&D center | Also provide technical services in the Taiwan market | |
| TSMC, University of Tokyo (Jun 25) |
Japan: Tokyo | Not disclosed | New TSMC-UTokyo Lab, for materials, devices, processes, metrology, packaging, circuit design research | TSMC’s first joint lab with a university outside Taiwan | |
| TSMC (Aug 25) |
USA: Phoenix, Arizona | Not disclosed | Broke ground on Industrial reclamation water plant | Will support two fabs; operational by 2028 | |
| TSMC (Mar 25) |
USA: Phoenix, Arizona | US $100B incremental to the $65B previously announced for a total of $165B | 3 new fabrication plants, 2 advanced packaging facilities and a major R&D team center | ||
| TSMC (May 25) |
Europe: Munich, Germany | Not disclosed | To establish chip design center for high-density, high-performance, energy-efficient chips for auto, industrial, AI, IoT | Germany is also location of TSMC’s 1st EU chip fab with the European Semiconductor Manufacturing Company including NXP, Infineon | |
| TSMC (Aug 25) |
Asia: Taichung, Taiwan | Not disclosed | Started construction on its 1.4-nanometer chip fabs | ||
| TSMC (Nov 25) |
Taiwan | Total investment estimated to reach 900B Taiwan dollars ($28.6B) | 3 additional 2nm chip fabs | Expands 2nm factories from 7 to 10 total locations | |
| TU/e (Jun 25) |
Netherlands | Not disclosed | New research institute for quantum, photonics, high-tech systems, future chips | Merges Eindhoven Hendrik Casimir Institute with High Tech Systems Center, Future Chips Flagship | |
| UMC (Apr 25) |
Singapore | Up to $5B to bring 1st phase to full capacity of 30,000 wafers per month; room for further investment in 2nd phase expansion | Opened new fab for 22nm, 28nm chips for premium smartphone display, power-efficient memory for IoT, connectivity | The first phase of the new facility will start volume production in 2026. Note, Fab12i P3 was announced in 2022 | |
| UMC (Dec 25) |
Taiwan: Tainan | NT$1.8B (~$57.5M) | New Circular Economy & Recycling Innovation Center for circular material use to advance sustainability | On-site waste recycling facility located within the company’s Fab 12A in the Southern Taiwan Science Park | |
| University of Arkansas (Nov 25) |
USA: Arkansas | Not disclosed | Opened a new Multi-User SiC facility(MUSiC) facility for energy, transportation, data centers, aerospace systems | Only openly accessible fabrication facility of its kind in the U.S. | |
| University of Chicago (Aug 25) |
USA: Chicago, Illinois | $3M grant from the U.S. National Science Foundation | New NSF ACE-3D Chip Design Hub | To focus on advanced 3D chip technologies | |
| University of Copenhagen (Aug 25) |
Europe: Copenhagen, Denmark | Not disclosed | Opened a new wafer 300mm wafer factory, The POEM Technology Center inside the Niels Bohr Institute | The new facility will also help speed up the development of quantum chips | |
| UST, Kaynes Semicon (Sept 25) |
India: Sanand, Gujarat | Rs 3,300 crore | To establish an OSAT facility | ||
| VCI Global, Kinesis (Feb 25) |
India: Chennai | Initial investment of $3.5M | To establish a semiconductor wire manufacturing plant | 25,000 sq-ft facility with plans to expand to four production lines | |
| Vishay (Mar 25) |
UK: Newport, Wales | £250M in new joint investments from Vishay mostly and UK’s Automotive Transformation Fund | New investment announced in March 2025 for SiC semis for EVs | Additional to £51M investment in Nov 24 after purchase of $177M in Mar 24 Nexperia fab. | |
| VTT (Feb 25) |
Europe: Finland | €29M Chips Act funding from EU, Finnish govts. for the APECS pilot line | Focus on VTT’s shared-use cleanroom facilities; semi manufacturing processes | VTT is also involved in the FAMES, NanoIC and PIXEurope pilot lines | |
| YMTC (Nov 25) |
China: Wuhan | Not disclosed | Began construction on 3rd NAND flash plant | Expected to begin mass production in 2027 | |
| YST (May 25) |
USA: East Vancouver, Oregon | $100M | New fab for chips used in telecoms, IT | The Chinese company hopes to expand U..S sales | |
| X-FAB (Sept 25) |
Malaysia: Sarawak | $600M | Opened 180nm BCD-on-SOI cleanroom | Added 6,000 sq. meters of cleanroom space |
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