Using Graph Attention for Virtual Metrology in Semiconductor Manufacturing (Intel Foundry, ASU)


Researchers from Arizona State University and Intel Foundry have published “Graph Attention-Based Virtual Metrology for Film Deposition Processes in Semiconductor Manufacturing”. Abstract “Artificial intelligence-driven semiconductor manufacturing increasingly operates at nanometer and angstrom scales, where precise process control depends on accurate and timely metrology. Howeve... » read more

Process Variation In The Era Of Scaling: Improving Uniformity With Dummy Fill


As semiconductor patterning continues to scale, even small layout nonuniformities can lead to noticeably different process outcomes. Real chip layouts contain a mix of dense regions, large open regions, and isolated features. As a result, the etch process encounters different “local environments” across the wafer. Even with the same process settings (or recipe), some areas may etch mo... » read more

AI & Energy: Bending The Curve


By Pushkar P. Apte and Melissa Grupen-Shemansky Artificial intelligence (AI) is scaling at a pace that is reshaping semiconductor roadmaps, data center design, and long-term infrastructure strategy. AI promises many economic and social benefits, but the growth comes with an escalating demand for power, and energy has emerged as a major challenge. The AI & energy challenge AI training c... » read more

Complete End-To-End Closed-Loop Product Yield Ramp And Learning


By Guy Cortez and Maheshwaran Jothi Yield ramp has always been a concern in semiconductor manufacturing: systems companies need confidence that devices meet quality targets before shipment, and chipmakers need to reach yield entitlement quickly to control cost and supply. While this has never been easy, advanced nodes are raising the bar again. First, designs are larger and more heterogen... » read more

Foundry Capacity Is Limiting Who Competes At Leading Edge Nodes


Key Takeaways: Leading-edge node access is increasingly reserved for hyperscalers, squeezing smaller chip developers. Chiplets and advanced packaging offer a path forward, but raise cost, complexity, and risk — especially for smaller teams. Chip architecture is now driven as much by capacity, yield, and economics as by technical goals. The benefits of device scaling are sl... » read more

When Semiconductor Materials Misbehave


Key Takeaways Material behavior in production depends on the process context that no development environment can fully replicate. In advanced packaging, the interactions that cross domain boundaries are increasingly where failures originate. The most accurate materials data is also the most commercially sensitive, leaving simulation models calibrated against generic inputs rather tha... » read more

TSV Complexity Leads To Manufacturing Bottleneck


Key Takeaways: Through-silicon vias are the biggest enabler of 3D chip stacking and chip-to-PCB connections through silicon interposers. The AI boom is causing HBM and advanced assembly shortages, straining the supply chain. Optimization around etch, fill and reveal help reduce TSV cost. Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside hig... » read more

Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time


The semiconductor industry is facing a strategic paradox. AI has rapidly moved from experimental technology to a competitive necessity promising faster yield improvement, smarter supply chain decisions, and autonomous factory operations. Yet the very systems that semiconductor manufacturers depend on to run their fabs, manage their supply chains, and serve their customers were built for a diffe... » read more

Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026


By Samer Bahou and Jaegwan Shim As the global semiconductor industry enters a decisive new phase shaped by artificial intelligence, SEMICON Korea 2026 convened the ecosystem from February 11–13 in Seoul, bringing together the companies, technologies, and talent required to sustain momentum on both sides of the AI equation: using AI to transform semiconductor operations, and advancing sem... » read more

SEMI 2026 U.S. Policy Strategy


The semiconductor industry continues to serve as the foundation of U.S. technological innovation and economic growth, and it has entered its most decisive phase yet. As geopolitical competition intensifies and policy frameworks evolve, 2026 will push the United States to sustain its leadership in semiconductor design, manufacturing, and innovation amid growing alliances and accelerating competi... » read more

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