tag: A*Star

Research Bits: March 26
By Jesse Allen - 26 Mar, 2024 - Comments: 0

Skyrmion switches Researchers from the Agency for Science, Technology and Research (A*STAR) and National University of Singapore harnessed skyrmions to build a switch that has the potential to process data faster while using significantly less energy. Skyrmions are magnetic whirls that form in very thin metal layers and can be efficiently moved between magnetic regions. Using a magnetic tun... » read more

Chip Industry’s Technical Paper Roundup: Oct 25
By Linda Christensen - 25 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Active Learning to Reduce Data Requirements For Defect Identification in Semiconductor Manufacturing
By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A new technical paper titled "Exploring Active Learning for Semiconductor Defect Segmentation" was published by researchers at Agency for Science, Technology and Research (A*STAR) in Singapore. "We identify two unique challenges when applying AL on semiconductor XRM scans: large domain shift and severe class-imbalance. To address these challenges, we propose to perform contrastive pretrainin... » read more

Technical Paper Roundup: Sept 27
By Linda Christensen - 27 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=53 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Implementations of 2D Material-Based Devices For IoT Security
By Technical Paper Link - 14 Sep, 2022 - Comments: 0

A new research paper titled "Application of 2D Materials in Hardware Security for Internet-of-Things: Progress and Perspective" was published by researchers at National University of Singapore and A*STAR. The paper explores the "implementation of hardware security using 2D materials, for example, true random number generators (TRNGs), physical unclonable functions (PUFs), camouflage, and ant... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Jan, 2022 - Comments: 0

Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Manufacturing Bits: July 13
By Mark LaPedus - 13 Jul, 2021 - Comments: 0

Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jun, 2021 - Comments: 0

Government policy The Malaysian government has extended its lockdown due to the pandemic until June 14, a move that may impact the global electronics supply chain, according to TrendForce. Malaysia recently implemented MCO 3.0 (Movement Control Order), the nation’s pandemic control measure. Malaysia is home to many fab equipment, packaging and testing facilities, as well as passive compon... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy