Chip Industry Week In Review


Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Chip Industry Week in Review


Major Deals: Taiwan-based UMC is exploring possible collaboration with Polar Semiconductor for high-volume production of 8-inch wafers at Polar’s expanded Minnesota fab, a move that could provide domestic manufacturing capacity for automotive, data center, consumer, aerospace, and defense customers. Marvell will acquire Celestial AI for $3.25B, adding photonic fabric technology for o... » read more