tag: Mixel

MIPI In Next Generation Of AI IoT Devices At The Edge
By Ashraf Takla - 11 Apr, 2024 - Comments: 0

The history of data processing begins in the 1960s with centralized on-site mainframes that later evolved into distributed client servers. In the beginning of this century, centralized cloud computing became attractive and began to gain momentum, becoming one of the most popular computing tools today. In recent years however, we have seen an increase in the demand for processing at the edge or ... » read more

Deployment Of MIPI In Ultra-Low-Power Streaming Sensors
By Mahmoud ElBanna - 14 Mar, 2024 - Comments: 0

By Mahmoud ElBanna and Brian Lenkowski Streams of data from higher-speed sensors pose throughput and latency challenges for designers. However, optimizing a design for those criteria can come at the expense of increased power consumption if not conceived and executed carefully. A device like a high-resolution, high-frame-rate home security camera in a non-wired application requiring frequent... » read more

MIPI Deployment In Ultra-Low-Power Streaming Sensors
By Mixel - 13 Mar, 2024 - Comments: 0

Streams of data from higher-speed sensors pose throughput and latency challenges for designers. However, optimizing a design for those criteria can come at the expense of increased power consumption if not conceived and executed carefully. A device like a high-resolution, high-frame-rate home security camera in a non-wired application requiring frequent battery changes or recharging will likely... » read more

Accellera Preps New Standard For Clock-Domain Crossing
By Brian Bailey - 29 Feb, 2024 - Comments: 0

Part of the hierarchical development flow is about to get a lot simpler, thanks to a new standard being created by Accellera. What is less clear is how long will it take before users see any benefit. At the register transfer level (RTL), when a data signal passes between two flip flops, it initially is assumed that clocks are perfect. After clock-tree synthesis and place-and-route are perfor... » read more

AI Tradeoffs At The Edge
By Ann Mutschler - 15 Feb, 2024 - Comments: 0

AI is impacting almost every application area imaginable, but increasingly it is moving from the data center to the edge, where larger amounts of data need to be processed much more quickly than in the past. This has set off a scramble for massive improvements in performance much closer to the source of data, but with a familiar set of caveats — it must use very little power, be affordable... » read more

Glitch Power Issues Grow At Advanced Nodes
By Ann Mutschler - 11 Jan, 2024 - Comments: 0

An estimated 20% to 40% of total power is being wasted due to glitch in some of the most advanced and complex chip designs, and at this point there is no single best approach for how and when to address it, and mixed information about how effective those solutions can be. Glitch power is not a new phenomenon. DSP architects and design engineers are well-versed in the power wasted by long, sl... » read more

2023: A Good Year For Semiconductors
By Brian Bailey - 21 Dec, 2023 - Comments: 0

Looking back, 2023 has had more than its fair share of surprises, but who were the winners and losers? The good news is that by the end of the year, almost everyone was happy. That is not how we exited 2022, where there was overcapacity, inventories had built up in many parts of the industry, and few sectors — apart from data centers — were seeing much growth. The supposed new leaders we... » read more

Using Real Workloads To Assess Thermal Impacts
By Ann Mutschler - 14 Dec, 2023 - Comments: 0

Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various components may be exercised or stressed. However, getting a clear picture of the thermal activity in advanced-node chips and packages is extremely complex, and it can vary significantly by use c... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

EDA’s Role Grows For Preventing And Identifying Failures
By Karen Heyman - 08 Jun, 2023 - Comments: 0

The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

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