Chip Industry Week In Review


Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging collaborations with ASE and others. AMD also announced the start of its production ramp of its Venice processors on TSMC's 2nm process. Lam Research established a panel-level packaging cen... » read more

Chiplets Need A New Workflow


Key Takeaways: Chiplet design turns semiconductor development into a system-level problem, requiring coordinated workflows across design, packaging, verification, test, and reliability. Successful chiplet workflows must handle multi-physics challenges — especially thermal, mechanical, power, and signal integrity — early enough to reduce costly failures before assembly and tape-out. ... » read more

Can Edge AI Keep Up?


Key Takeaways: Model development is outpacing silicon design cycles, so edge AI architectures must prioritize adaptability. The required cadence for model updates is highly application-dependent and is closely tied to product lifetime and operational risk. Adaptability can conflict with power, performance, and area targets, so effective heterogeneous architectures and robust softwa... » read more

Fast Isn’t Fast Enough: Redefining Metrics for Edge AI


Key Takeaways: Edge AI performance is about low latency and power efficiency, not peak TOPS. Memory bandwidth and data movement now limit edge AI more than compute. Successful edge AI requires balanced hardware, software, and fast model updates. Experts At The Table: Today’s chip architect must contend with multiple factors when architecting AI processors for fast and effi... » read more

Chip Industry Week In Review


Disruptions caused by the Iran conflict have taken about one third of the global helium supply off the market, an essential gas for semiconductor manufacturing, reports the World Economic Forum. Other potential impacts for the chip industry include bromine and other chemical shortages, logistical disruptions, and higher energy prices incurred by fabs in Asia. Top Deals IBM and Lam R... » read more

Exploring The Latest Innovations In MIPI D-PHY And MIPI C-PHY


By Michael Nagib and Nuno Martins In the ever-evolving landscape of high-performance camera and display technologies, MIPI D-PHY and MIPI C-PHY specifications continue to lead the charge, setting benchmarks for low power, low latency, and high bandwidth data transmission. Building on the insights from our previous article, “Demystifying MIPI C-PHY/D–PHY Subsystem” – we now delve into... » read more

Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Chip Industry Week in Review


The U.S. government announced new import tariff actions and deals this week, including: The EU: 15% tariff on most goods including semiconductors. According to the EU's president, the action excludes semiconductor equipment. Copper: 50% tariff on all imports of semi-finished copper products and intensive copper derivative products, effective Aug. 1, but raw input material is excluded. ... » read more

Chip Industry Week in Review


Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

Often Overlooked, PHYs Are Essential To High-Speed Data Movement


Over the past couple of decades, the semiconductor industry has evolved from a supporting role for traditional verticals like mobile, automotive, and PCs to a foundational role in those markets, as well as in AI factories and hyperscale data centers. Underlying this transformation is the physical layer (PHY), which has emerged as a critical enabler for data transfer and communications. The P... » read more

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