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Week In Review: Manufacturing, Test


Chipmakers TSMC has posted strong results and raised its capital spending budget to $30 billion, up from its prior guidance of $25 billion to $28 billion in 2021. “Its outlook indicates broad-based semiconductor demand continues to strengthen amid supply chain tightness,” said Weston Twigg, an analyst at KeyBanc, in a research note. “TSMC posted another quarter of strong demand for leadi... » read more

Making Chip Packaging More Reliable


Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Week In Review: Manufacturing, Test


Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

What Goes Wrong In Advanced Packages


Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

EUV Pellicles Finally Ready


After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Infineon announced it has a Trusted Platform Module (TPM 2.0), called OPTIGA TPM 2.0, used to secure remote software updates, disc encryption, and user authentication on Linux-based systems. OPTIGA is an open software stack for securing comprehensive TSS* host software implementing the latest FAPI standard. Infineon developed the open-source software with Intel Corporation and Fraunho... » read more

Defect Mitigation And Characterization In Silicon Hardmask Materials


From SPIE Digital Library: In this study, metal contaminants, liquid particle count and on-wafer defects of Si- HMs and filtration removal rates are monitored to determine the effect of filter type, pore size, media morphology, and cleanliness on filtration performance. 5-nm PTFE NTD2 filter having proprietary surface treatment used in this study shows lowest defect count. Authors: Vineet... » read more

Hunting For Open Defects In Advanced Packages


Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for these chips, the greater the effort and the cost. Latent open defects continue to be the bane of test, quality, and reliability engineering. Open defects in packages occur at the chip-to-substra... » read more

Week In Review: Manufacturing, Test


Government policy The National Security Commission on Artificial Intelligence (NSCAI) this week submitted its final report to Congress and the President. The goal is to develop a national strategy to maintain America’s AI advantages related to national security. As part of the long and complex report, the NSCAI came to a sobering conclusion: “The U.S. government is not prepared to defend t... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive/Mobility Chip-telemetry company proteanTecs has joined TSMC’s IP Alliance Program, which puts proteanTecs’ Universal Chip Telemetry (UCT) IP into TSMC’s catalog of production-proven IP. UCT is a monitoring system designed directly into chips to pull measurements from inside the chip throughout its lifecycle, including after placement in systems in the field. Monitoring the hea... » read more

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