Market research
In the second quarter of 2019, TrendForce said that the top-5 foundry rankings remained identical with that of last year. But sixth to tenth place showed some changes. Who is up or down in what is a tough business climate?
Global fab equipment spending will rebound in 2020, growing 20% to $58.4 billion after dropping 19% to $48.4 billion in 2019, according to SEMI. However, ... » read more
At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies.
The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more
Chiplet printer
A number of companies, R&D organizations and universities separately presented a slew of papers and technologies at the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas.
It’s difficult to write about all of the papers at ECTC. But one paper that stood out is a prototype chiplet micro-assembly printer developed by the Palo Alto Research Cente... » read more
Many new wafer-level packaging (WLP) technologies involve the processing of thin wafers that must be mechanically supported during the manufacturing flow. These technologies include fan-out wafer-level packaging (FOWLP), fan-in wafer-level chip-scale packaging (FI-WLCSP), 3-D FOWLP, 2.5-D integration with interposer technology, and true 3-D IC integration using through-silicon via (TSV) interco... » read more
Equipment and tools vendors are starting to focus on data as a means of improving yield, adding more sensors and analysis capabilities into the manufacturing flow to circumvent problems in real time.
How much this will impact the cost of developing complex chips at leading-edge nodes, and in 2.5D and 3D-IC packages, remains to be seen. But the race to both generate data during manufacturing ... » read more
Substrates play a huge role when designing any type of device, including printed and flexible electronics. From its compatibility with your printing process or with the inks and materials you’re using, to its thermal properties, the choice of substrate can have a significant impact on the effectiveness and manufacturability of your product.
However, substrate material capabilities tend to ... » read more
Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table.
For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more
Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm.
Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more
Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically.
The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more
Weight is emerging as a key concern for carmakers as more electronic circuitry is added into vehicles that are either fully or partially powered by batteries. As a result, chipmakers and OEMs are exploring alternative substrate materials, different types of sensor fusion, and new ways to reduce the number of wires.
Adding pounds reduces driving range for electric or hybrid vehicles. The auto... » read more
Experts at the Table: What are the limitations today that are preventing 3D-ICs from becoming mainstream, and which companies pushing to make it happen?
