Chip Industry Week In Review

By The SE Staff - 17 Jul, 2026 - Comments: 0

Advanced manufacturing, packaging Intel Foundry will invest €5B to expand Intel 3 capacity at its Leixlip, Ireland campus. The company also entered high-volume manufacturing for a subset of Panther Lake processors manufactured on its 18A using ASML’s High-NA EUV technology. UMC delivered the first production wafers for SILITH’s 1.6T silicon photonics platform from its 300mm Singa... » read more

New Nonvolatile Memory Winners Emerge

By Bryon Moyer - 16 Jul, 2026 - Comments: 0

Key Takeaways: MRAM and RRAM will likely coexist, each with a different focus. PCRAM isn’t being ported onto finFET nodes. FeRAM is seeing new life, while a newcomer has a new NVM bit cell. Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process nodes. Magnetic RAM (MRAM) and resistive RAM (RRAM) appear to ... » read more

Chip Industry Week In Review

By The SE Staff - 10 Jul, 2026 - Comments: 0

Micron The memory maker rolled out a slew of announcements this week, including: Raised its planned U.S. investment to more than $250B through 2035, an incremental $50B above what was announced last June, with an ultimate goal of producing 40% of its DRAM in the U.S.; Planned new investments of $3B for U.S. IC supply-chain investments, including $500M in financing for GlobalWafers’ 3... » read more

Creating A Moore’s Law For AI Scaling

By Laura Peters - 24 Jun, 2026 - Comments: 0

Key Takeaways: AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute efficiency gain over 10 years, making collaboration across algorithms, architectures, devices, packaging, and communication fabrics essential to deliver a 10X improvement in compute efficiency over the next decade. Edge AI chips are moving to leadi... » read more

With Chiplets, What Role Does Economics Play?

By Bryon Moyer - 21 May, 2026 - Comments: 1

Key Takeaways: For the data center, chiplet economics matter, but they’re not a primary decision-driver. With the exception of processor families, chiplets cannot address consumer markets today, where economics dominate. If a chiplet marketplace materializes, the economics may be friendlier because chiplets will have multiple customers and applications. Chiplets are notori... » read more

Chip Industry Week in Review

By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Flash Getting Stacked High-Bandwidth Version

By Bryon Moyer - 14 May, 2026 - Comments: 1

Key takeaways: A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static storage of AI model weights, with optimized read speed. Samples are due out later this year, with accelerators featuring it coming out next year. AI inference using modern models requires billions of parameters, and moving them to where they c... » read more

Chip Industry Week in Review

By The SE Staff - 01 May, 2026 - Comments: 0

Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Chip Industry Week In Review

By The SE Staff - 17 Apr, 2026 - Comments: 0

Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Chip Industry Week In Review

By The SE Staff - 27 Mar, 2026 - Comments: 0

Arm uncorked its first internally developed CPU chip this week, aimed squarely at the agentic AI data center market. Arm CEO Rene Haas (pictured) emphasized the CPU's power efficiency and performance/watt compared to other AI processor architectures. "We are obsessed with efficiency, and if you think about one of the biggest appeals that Arm has had over the years, it is power profile," he ... » read more

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tag: UMC

Chip Industry Week In Review

New Nonvolatile Memory Winners Emerge

Chip Industry Week In Review

Creating A Moore’s Law For AI Scaling

With Chiplets, What Role Does Economics Play?

Chip Industry Week in Review

Flash Getting Stacked High-Bandwidth Version

Chip Industry Week in Review

Chip Industry Week In Review

Chip Industry Week In Review

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