Chip Industry Week In Review

By The SE Staff - 20 Mar, 2026 - Comments: 0

War impacts The Iran War's toll on the chip industry is widening. Over 95% of Taiwan's energy is imported, causing the country to secure alternative sources. Korea is also heavily dependent on energy imports from the Middle East. Shortages of key materials are cropping up everywhere. Helium from Qatar, the second largest producer behind the U.S., is constrained by hostilities in the Per... » read more

Chip Industry Week In Review

By The SE Staff - 13 Mar, 2026 - Comments: 0

Disruptions caused by the Iran conflict have taken about one third of the global helium supply off the market, an essential gas for semiconductor manufacturing, reports the World Economic Forum. Other potential impacts for the chip industry include bromine and other chemical shortages, logistical disruptions, and higher energy prices incurred by fabs in Asia. Top Deals IBM and Lam R... » read more

Chip Industry Week In Review

By The SE Staff - 06 Mar, 2026 - Comments: 0

Think tank IAPS' report on AI integrity attacks contends that advanced AI systems must be protected from hidden tampering, backdoors, or unauthorized changes that could alter their behavior or outputs, especially when AI adoption is scaling rapidly, with over 60% of the federal workforce now using AI every day. Geopolitics The U.S. government has drafted new export rules that may give W... » read more

Chip Industry Week In Review

By The SE Staff - 27 Feb, 2026 - Comments: 0

Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

Silicon Photonics In The Data Center: What A CMOS Exec Needs To Know

By Geoff Tate - 09 Feb, 2026 - Comments: 0

Silicon Photonics is changing the data center, with the biggest changes still ahead. Figure 1: Google Jupiter Network for multi-thousand Ironwood TPU clusters. Source: Google Refresher for new readers: Data centers contain hundreds or thousands of racks. For example, the Nvidia GB200 NVL72 AI compute/switch rack is about 24 inches wide, about 88 inches high and 42 inches deep. I... » read more

Chiplet Fundamentals For Engineers: eBook

By Bryon Moyer - 02 Feb, 2026 - Comments: 1

Multi-die assemblies are the next phase of Moore's Law, scaling up and out to improve performance and add flexibility into designs. By decomposing SoCs into building blocks, yield improves for the individual dies and overall performance increases because a chip is no longer bound by reticle limits. But this is much harder than it sounds. Chiplets don't just snap together like LEGOs, and so... » read more

Chip Industry Week In Review

By The SE Staff - 30 Jan, 2026 - Comments: 0

Big deals and fundings Teradyne and MultiLane are forming a joint venture, MultiLane Test Products (MLTP), to accelerate the development of test solutions for high speed data connections. Teradyne will be the majority owner. Ricursive Intelligence raised $300M Series A for AI-driven IC design. IonQ plans to acquire SkyWater for ~$1.8B, creating a "vertically integrated full-stack q... » read more

An Explosion In Interconnect Complexity

By Bryon Moyer - 22 Jan, 2026 - Comments: 0

For decades, electronics offered two levels of routing structure to manage signals that originate or terminate in an integrated circuit. Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also brings greater complexity and ratchets up the number of design decisions needed to complete a project. This transition has been evo... » read more

Chip Industry Week in Review

By The SE Staff - 16 Jan, 2026 - Comments: 0

Geopolitics Taiwan and the U.S. signed a trade agreement this week, with TSMC and other Taiwanese companies collectively pledging to directly invest at least $250B in investments in advanced semiconductor, energy and AI production and capacity in the U.S. The agreement also included Taiwan providing another $250B in credit guarantees for additional IC supply chain expansions in the U.S., cap... » read more

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

By Bryon Moyer - 13 Jan, 2026 - Comments: 0

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s merely a postponement, not a cancellation. HBM has been in high demand for AI in data centers — especially for training. Data movement dominates energy consumption, and high-bandwidth memories... » read more

← Older posts Newer posts →

tag: UMC

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Silicon Photonics In The Data Center: What A CMOS Exec Needs To Know

Chiplet Fundamentals For Engineers: eBook

Chip Industry Week In Review

An Explosion In Interconnect Complexity

Chip Industry Week in Review

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

Trending Articles