Chip Industry Week in Review


Major Deals: Taiwan-based UMC is exploring possible collaboration with Polar Semiconductor for high-volume production of 8-inch wafers at Polar’s expanded Minnesota fab, a move that could provide domestic manufacturing capacity for automotive, data center, consumer, aerospace, and defense customers. Marvell will acquire Celestial AI for $3.25B, adding photonic fabric technology for o... » read more

New Panel Production Efforts Target Interposer Costs


The rising cost of increasingly large interposers is spurring renewed interest in panel-level manufacturing, which for years has hobbled along due to the massive and collective effort required by the chip industry to change formats. Several companies are developing their own processes, although there is currently no commercial production. And a new consortium called Joint3, spearheaded by Ja... » read more

Chip Industry Week in Review


Samsung reportedly is hiking memory chip prices by 30% to 60% due to high demand from AI data centers and constrained supplies. Those shortages are causing ripples elsewhere. SMIC, China's largest foundry, said its customers are holding back orders for other types of semiconductor due to concerns about memory supplies. Meanwhile, interest in photonics and power semiconductors is picking up, ... » read more

Chip Industry Week in Review


San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Chip Industry Week in Review


Retaliations and countermoves leading up to planned trade talks between the U.S. and China led experts to wonder, 'Who's winning?' New activity on this front: China issued questionnaires to some U.S. semiconductor firms as part of an anti-dumping probe, demanding detailed data on sales, profit margins, logistics costs and Chinese customer names for analog chips. The probe appears aimed at ... » read more

How Semiconductor Fabs Use Water


Water — lots of it — is a critical enabler for advanced chip architectures, lithography, and back-end packaging. It feeds the ultra-pure water loops that touch every wafer, sluicing heat out of tools that run hotter at each node, and carrying spent chemistries to treatment. The natural reaction to reports that fabs “use millions of gallons of water” is concern, but the engineering re... » read more

Reticle Stitching Bumps Up Silicon Interposer Costs


Advanced packaging often relies on silicon interposers to connect chiplets and other components inside a package. The problem is that interposers typically exceed the reticle limit, which adds both complexity and cost. An interposer is essential for 2.5D and 3.5D architectures. As device scaling runs out of steam, chipmakers are decomposing planar SoCs into chiplets and connecting them throu... » read more

2024 UMC Sustainability Report


Message from UMC's ESG Steering Committee Chairman: Jason Wang and Shan-Chieh Chien, Co-presidents and ESG Steering Committee Chairmen. "While the global economy gradually recovered from the pandemic, 2024 presented different challenges, including geopolitical shifts, inflation, inventory adjustments, and industry overcapacity. Despite these headwinds, our management team demonstrated strong... » read more

Chip Industry Week in Review


Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

Chip Industry Week in Review


[Editor's Note: Early edition due to the U.S. July 4th holiday.] The U.S. government lifted export restrictions that barred Synopsys, Siemens EDA, and Cadence from selling EDA tools to China. In a statement, Synopsys said it received a letter from the U.S. Commerce Department immediately rescinding those restrictions. Siemens issued a similar statement. Which tools or hardware accelerated t... » read more

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