Week In Review: Manufacturing, Test


Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

The Next Advanced Packages


Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Making Silicon Photonics Chips More Reliable


Silicon photonics has the ability to dramatically improve on-die and chip-to-chip communication within a package at extremely low power, but ensuring that signal integrity remains consistent over time isn't so simple. While this technology has been used commercially for at least the past decade, it never has achieved mainstream status. That's mostly due to the fact that Moore's Law scaling h... » read more

The Good And Bad Of Chiplets


The chiplet model continues to gain traction in the market, but there are still some challenges to enable broader support for the technology. AMD, Intel, TSMC, Marvell and a few others have developed or demonstrated devices using chiplets, which is an alternative way to develop an advanced design. Beyond that, however, the adoption of chiplets is limited in the industry due to ecosystem issu... » read more

Week In Review: Manufacturing, Test


Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000 wafers per month. TSMC’s total spending on this project will be approximately $12 billion from 2021 to 2029. Construction is planned to start in 2021 with production targeted to begin in 202... » read more

Week In Review: Manufacturing, Test


Chipmakers The Trump administration has held talks with Intel and TSMC to build more leading-edge fabs in the U.S., according to the Wall Street Journal and other news outlets. IC Insights has released its rankings of the top-10 chip vendors in terms of sales for the first quarter. Intel remains in first place, followed by Samsung and TSMC. The big surprise is China-based fabless IC supplie... » read more

Week In Review: Manufacturing, Test


Fab tools The U.S. Department of Commerce has announced new export control actions to prevent China, Russia, and Venezuela from obtaining U.S. technology for military purposes. This expands the “Military End Use/User Controls (MEU)” license requirement controls on China, Russia, and Venezuela, covering military end-users, as well as semiconductor equipment, sensors and other technologies. ... » read more

Making Chips At 3nm And Beyond


Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

The Need For Traceability In Auto Chips


Someday your car will drive itself to a repair shop for a recall using a scheduling application that is both efficient and can prioritize which vehicles need to be fixed first. But that's still a ways off. Proactive identification of issues is not yet available. To be ready for that, today’s data analytics systems need to begin supporting targeted recalls, enabling predictive maintenance a... » read more

Week In Review: Manufacturing, Test


Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

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