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Making Chip Packaging More Reliable


Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Week In Review: Manufacturing, Test


Government policy At one point, there was a school of thought that the Biden administration would relax the current tariffs and export controls in regards to China. So far, the Biden administration hasn’t changed any of the previous policies and is doubling down on those efforts. The Department of Commerce’s Bureau of Industry and Security (BIS) this week added seven Chinese supercomput... » read more

What Goes Wrong In Advanced Packages


Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

Long Lead Times Seen For Equipment


There are a number of big stories in the semiconductor market thus far in 2021. Automotive chip shortages and tight foundry capacity are among the bigger ones. That’s just for starters. What hasn’t received much attention is the ongoing shortages and long lead times for semiconductor equipment. In some cases, lead times have stretched out to 12 months or more for some equipment. Some t... » read more

Week In Review: Manufacturing, Test


Government policy For the last four years, the U.S. and China have been embroiled in a trade war, especially on the technology front. The U.S. has implemented a number of export control measures and tariffs in the arena. But there might be a thawing in the tense relationship between the two superpowers. “Reports surfaced Thursday indicating the China Semiconductor Industry Association (CSIA)... » read more

Shortages, Challenges Engulf Packaging Supply Chain


A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Week In Review: Design, Low Power


Renesas Electronics Corporation will acquire Dialog Semiconductor in an all-cash deal worth about US $5.9 billion. Dialog is a supplier of mixed-signal ICs targeting IoT, consumer, automotive, and industrial. The company's primary areas of focus were communications and power control. These products are complementary to existing Renesas embedded compute products. Dialog CEO Dr. Jalal Bagherli... » read more

Week In Review: Manufacturing, Test


OEMs and chipmakers In recent times, automotive companies have been impacted by chip shortages, forcing vendors to temporarily shutter their plants. OEMs are experiencing manufacturing disruptions due to semiconductor shortages as some semiconductor foundries allocate production, according to IDC. "Semiconductor content growth in vehicles continues to outpace vehicle unit sales growth, with gr... » read more

48V Applications Drive Power IC Package Options


The manufacturing process and die get most of the attention, but the packaging plays an important part in enabling and limiting performance, manufacturability, particularly when it comes to reliability of power devices. Given the wide range of underlying semiconductor power-device technologies — “basic” silicon, wide-bandgap silicon carbide (SiC) and gallium nitride (GaN), power levels... » read more

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