Improving Yield, Reliability With Data


Big data techniques for sorting through massive amounts of data to identify aberrations are beginning to find a home in semiconductor manufacturing, fueled by new requirements in safety-critical markets such as automotive as well as the rising price of packaged chips in smartphones. Outlier detection—the process of finding data points outside the normal distribution—isn't a new idea. It ... » read more

Toward System-Level Test


The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

Integrated Passives Market Gets Active


Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

Light In A Package


Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

Get Ready For In-Mold Electronics


Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

The Week In Review: Manufacturing


Chipmakers Toshiba is still looking for a buyer for its prized NAND flash memory business. The leading contenders for the business are a consortium with Western Digital. Meanwhile, Toshiba’s memory unit is expanding its Fab 6 facility at its Yokkaichi Operations, based in Japan. And now, it has selected a site for its next fab in Japan, this time in Kitakami City, Iwate. Construction is expe... » read more

The Week In Review: Manufacturing


Packaging and test IoT chip startup zGlue recently announced its technology, dubbed the zGlue Integrated Platform (ZiP). In ZiP, chip customers select and configure their designs based on chiplets. Chiplets are proven silicon IP from existing vendors. Then, the technology automatically generates potential implementations of a design. As part of the effort, zGlue has selected Advanced Semicondu... » read more

The Week In Review: Manufacturing


Fab tools Lam Research held an analyst event this week. The company indicated that the industry is in the midst of a memory boom, including both DRAM and 3D NAND. According to Amit Daryanani, an analyst with RBC, here was one of the big takeaways at the event: “The memory spend portion of WFE is more sustainable than previously assumed due to end-market drivers such as big data, automation, ... » read more

Cheaper Fan-Outs Ahead


Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and smartphones. So in R&D, the industry for some time has been developing next-generation fan-out using a panel-level format, a technology that could potentially lower the cost of fan-out. But there are ... » read more

Advanced Packaging Moves To Cars


By Ann Steffora Mutschler and Ed Sperling As automotive OEMs come up to speed on electrification of vehicles, each at their own pace, they are starting to embrace novel packaging approaches as a way to differentiate themselves in an increasingly competitive market. Wirebond used to dominate this market, where most of the chips were relatively unsophisticated and product cycles were slow... » read more

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