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Defect Challenges Growing In Advanced Packaging


The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. In response, several vendors are rolling out new defect inspection systems for use in various advanced packages, such as 2.5D/3D technologies and fan-out. The new defect inspection systems are more capable than the previous tools, but ... » read more

Week In Review: Manufacturing, Test


Fab/mask manufacturing An alliance of companies have formed the Center for Deep Learning in Electronics Manufacturing (CDLe). NuFlare, Mycronic and D2S have established the San Jose, Calif.-based center to advance the state-of-the-art in deep learning for its industry-specific applications. Imec.xpand, an early-stage and growth fund that is initiated by Imec, has closed its first fund at 11... » read more

The Race To Zero Defects


By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

Cobalt Shortages Ahead


Rapid growth of electric vehicles is creating an enormous demand for cobalt, causing tight supply, high prices and supply chain issues for this critical material. Cobalt is a ferromagnetic metal and one of the key materials used in lithium-ion batteries for cell phones, notebook PCs, battery-electric cars and hybrids. It also is used in alloys and semiconductors. And while the IC industry co... » read more

Sorting Out Packaging Options


Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial T... » read more

Week In Review: Manufacturing, Test


Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

Return Of The Organic Interposer


Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

Week In Review: Manufacturing, Test


Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Mixed Outlook For Semi Biz


Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Bridges Vs. Interposers


The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

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