Chip Industry Week In Review

By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Week In Review: Design, Low Power

By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 15 Oct, 2021 - Comments: 0

Chipmakers TSMC posted its results for the quarter and confirmed its long-awaited plans to build a fab in Japan. It’s not a leading-edge fab, but rather a plant for 28nm/22nm processes. “The company confirmed plans to build a new fab in Japan for 22nm + 28nm,” said Aaron Rakers, an analyst at Wells Fargo, in a research note. “An average 22/28nm fab costs ~$4-5B range per 45k wspm. Fab ... » read more

Manufacturing Bits: Aug. 9

By Mark LaPedus - 09 Aug, 2021 - Comments: 1

Quantum RF sensors The quantum computer market is an emerging and hot business. So is the quantum sensor market, where several entities are developing this technology for a range of applications. “Quantum sensors utilize quantum states for measurements,” according to Chalmers University of Technology. “They capitalize on the fact that quantum states are extremely sensitive to disturba... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 25 Jun, 2021 - Comments: 0

Automotive Cadence will be capturing design insights from Presto Engineering, an ASIC designer working on high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto, which also provides semiconductor services such as test and qualification, will use Cadence’s EDA and analysis tools (Allegro X Package Designer Plus, Clarity 3D Solver, Sigrity Xt... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 19 Mar, 2021 - Comments: 0

Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

Manufacturing Bits: Feb. 23

By Mark LaPedus - 23 Feb, 2021 - Comments: 0

Space crystals Northrop Grumman recently launch its Cygnus spacecraft into space, sending thousands of pounds of critical supplies and experiments to the International Space Station (ISS). The launch, which took place from NASA’s Wallops Flight Facility in Virginia, will deliver a diversity of experiments to the ISS National Laboratory. In one experiment, Redwire’s sixth in-space man... » read more

Startup Funding: December 2020

By Jesse Allen - 06 Jan, 2021 - Comments: 1

AI hardware startups were hot in our December startup-funding focus, with two companies landing rounds exceeding $100M and plenty of others seeing investment. Two Chinese EDA companies received funding in a bid to boost the country's semiconductor ecosystem. One company providing control systems for fabs achieved $8M in Series A, and both autonomous driving and electric vehicles pulled in lots ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 02 Oct, 2020 - Comments: 0

Security Synopsys’ Cybersecurity Research Center disclosed that its research resulted in three Common Vulnerability and Exposures (CVE) advisories on wireless router chipsets that have partial authentication bypass vulnerabilities. The vulnerability lets an attacker send an unencrypted data frame through a WPA2-protected WLAN, which will may respond with an encrypted data frame that the atta... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 26 Jun, 2020 - Comments: 0

Security The U.S. Defense Advanced Research Projects Agency (DARPA) selected Synopsys as the main contractor to provide SoC design tools and security IP for its Automatic Implementation of Secure Silicon (AISS) program. The four-year program’s goal to develop a design tool and IP ecosystem to automate adding security into integrated circuits. Synopsys will be working on a research team with ... » read more

← Older posts

tag: Northrop Grumman

Chip Industry Week In Review

Week In Review: Design, Low Power

Week In Review: Manufacturing, Test

Manufacturing Bits: Aug. 9

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

Manufacturing Bits: Feb. 23

Startup Funding: December 2020

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Trending Articles