Shedding Pounds In Automotive Electronics


Weight is emerging as a key concern for carmakers as more electronic circuitry is added into vehicles that are either fully or partially powered by batteries. As a result, chipmakers and OEMs are exploring alternative substrate materials, different types of sensor fusion, and new ways to reduce the number of wires. Adding pounds reduces driving range for electric or hybrid vehicles. The auto... » read more

Blog Review: Feb. 20


Synopsys' Chirag Tyagi examines how Display Stream Compression 1.2 allows the commonly used MIPI DSI display interface to support 8k UHD displays in applications like infotainment and AR/VR even with the limited bandwidth of PHY layers. Cadence's Paul McLellan listens in on a panel discussion at DesignCon on how to create PDKs for silicon photonics so non-photonics experts can complete at le... » read more

Week in Review: IoT, Security, Auto


Internet of Things Is Google developing a Pixel Watch wearable? Perhaps, if recent job listings are any indication. The company recently was looking to hire someone as vice president of hardware engineering, wearables. Last month, Fossil Group sold smartwatch technology intellectual property to Google for $40 million, while Google hired certain members of Fossil’s wearables R&D team. ... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Diamond semiconductor IP vendor AKHAN Semiconductor is cooperating with a U.S. federal investigation into alleged theft of its intellectual property by China’s Huawei. When AKHAN agreed to send its proprietary technology to Huawei pursuant to an agreement, AKHAN “believes that Huawei destroyed our product, shipped it to China without authorization, subjected it to tests... » read more

Week in Review: IoT, Security, Auto


Internet of Things McKinsey & Company identified 10 top trends in the Internet of Things. They include: IoT is a business opportunity, not just a tech opportunity; disciplined execution across multiple use cases is the path to value; and IoT is gradually enabling more subscription business models, but consumers are resistant. Louis Columbus of IQMS provides some IoT data points and id... » read more

Embedded Phase-Change Memory Emerges


The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

Week In Review: Manufacturing, Test


Trade and fab equipment The SEMI Industry Strategy Symposium (ISS) this week opened with the theme “Golden Age of Semiconductor: Enabling the Next Industrial Revolution.” The annual three-day conference gave the year’s first outlook of the global electronics manufacturing industry. Click here for a recap. SEMI and Imec are joining forces to drive innovation and deepen industry align... » read more

FD-SOI At The Edge


Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Manufacturing Bits: Jan. 2


Better nanowire MOSFETs At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Applied Materials presented a paper on a new and improved way to fabricate vertically stacked gate-all-around MOSFETs. More specifically, Imec and Applied reported on process improvements for a silicon nanowire MOSFET, which is integrated in a CMOS dual work function metal replacement metal ga... » read more

Week In Review: Manufacturing, Test


Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

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