tag: STMicroelectronics

Roadmap To Neuromorphic Computing (Collaboration of 27 Universities/Companies)
By Technical Paper Link - 09 Jul, 2024 - Comments: 0

A technical paper titled “Roadmap to Neuromorphic Computing with Emerging Technologies” was published by researchers at University College London, Politecnico di Milano, Purdue University, ETH Zurich and numerous other institutions. Summary: "The roadmap is organized into several thematic sections, outlining current computing challenges, discussing the neuromorphic computing approach, ana... » read more

Chip Industry Technical Paper Roundup: June 10
By Linda Christensen - 10 Jun, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=232 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

CMOS ICs for 77 GHz Automotive Radar
By Technical Paper Link - 28 May, 2024 - Comments: 0

A new technical paper titled "CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications" was published by researchers at STMicroelectronics and University of Catania. Abstract "This paper presents recent results on CMOS integrated circuits for automotive radar sensor applications in the 77 GHz frequency band. It is well demonstrated that nano-scale CMOS technologies are the b... » read more

Chip Industry Technical Paper Roundup: April 23
By Linda Christensen - 23 Apr, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=216 /] Find last week’s technical paper additions here. » read more

3D Connection Artifacts In PDN Measurements
By Cadence - 28 Feb, 2024 - Comments: 0

Authors: Ethan Koether, Amazon; Kristoffer Skytte, John Phillips, Shirin Farrahi, Cadence; Joseph Hartman, Oracle; Sammy Hindi, Ampere Computing Inc.; Mario Rotigni, STMicroelectronics; Gustavo Blando, Istvan Novak, Samtec From a simulation stand-point, we have covered several important topics that users must consider in detail to get accurate low frequency simulation results. We investigate... » read more

Challenges And Innovations Of HW Security And Trust For Chiplet-Based 2.5D and 3D ICs
By Technical Paper Link - 04 Jan, 2024 - Comments: 0

A technical paper titled “On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations” was published by researchers at STMicroelectronics Crolles (ST-CROLLES), Département Systèmes et Circuits Intégrés Numériques (DSCIN), Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), and Laboratoire Systèm... » read more

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Chip Industry Week In Review
By The SE Staff - 22 Nov, 2023 - Comments: 0

By Jesse Allen, Susan Rambo, and Liz Allan The U.S. government will invest about $3 billion for the National Advanced Packaging Manufacturing Program (NAPMP), including an advanced packaging piloting facility to help U.S. manufacturers adopt new technology and workforce training programs. It also will provide funding for projects concentrating on materials and substrates; equipment, tools, ... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

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