Week In Review: Manufacturing, Test


Fab tools, chips and technologies What happened at the SEMI Industry Strategy Symposium (ISS) this week? The annual three-day conference of executives gave the year’s first comprehensive outlook of the global electronics manufacturing industry. Click here to see the details. CyberOptics has unveiled its new WaferSense Auto Resistance Sensor (ARS) and its CyberSpectrum software. The produc... » read more

Manufacturing Bits: Jan. 7


Beyond 5G chips At the recent IEEE International Electron Devices Meeting (IEDM), NTT and the Tokyo Institute of Technology presented a paper on a technology that could enable high-speed wireless devices beyond the 5G standard. Researchers have devised a 300GHz wireless transceiver (TRx) that supports a data rate of more than 100Gb/s. The device is based on a technology called indium phosph... » read more

Week In Review: Manufacturing, Test


Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best efforts, we have not yet resolved this challenge,” according to a statement from Michelle Johnston Holthaus, executive vice president and general manager of the Sales, Marketing and Communicati... » read more

Week in Review: Iot, Security, Automotive


IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Service Revenue Growing With Chip Complexity


Rising complexity, new markets, and a shortage of in-house expertise are beginning to rekindle demand for services for the first time in nearly a decade. The semiconductor industry has been racing to design chips for a variety of new and existing applications, but they are facing challenges on a number of fronts: Leading-edge chips require new architectures due to a sharp reduction in s... » read more

Manufacturing Bits: Oct. 22


3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

SiC Market Moves Into Overdrive


The silicon carbide (SiC) power semiconductor market continues to heat up in the automotive arena. In recent times, several automotive OEMs have formed a series of alliances with SiC device makers, and for good reason. In a major way, many automotive OEMs are entering or expanding their efforts in the battery-electric car market. SiC power semiconductors are among the key components used ... » read more

Hybrid Emulation Takes Center Stage


From mobile to networking to AI applications, system complexity shows no sign of slowing. These designs, which may contain multiple billion gates, must be validated, verified and tested, and it’s no longer possible to just throw the whole thing in a hardware emulator. For some time, emulation, FPGA-based prototyping, and virtual environments such as simulators have given design and verific... » read more

What’s Next In Advanced Packaging


Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

Wrestling With High-Speed SerDes


SerDes has emerged as the primary solution in chips where there is a need for fast data movement and limited I/O, but this technology is becoming significantly more challenging to work with as speeds continue to rise to offset the massive increase in data. A Serializer/Deserializer is used to convert parallel data into serial data, allowing designers to speed up data communication without h... » read more

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