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Manufacturing Bits: July 13


Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

System Bits: Feb. 6


Compressing data in vehicles As the number of cameras in automobiles is on the rise with the move to autonomous vehicles, internal vehicle networks are being pushed to their limits from the flood of data. While special compression methods reduce the amount of video data, they also exhibit a high degree of latency for coding. But now, Fraunhofer researchers have adapted video compression in su... » read more

Security For Embedded Electronics


The embedded systems market is expected to enjoy steady growth in the near future—provided those systems can be adequately secured. One of the biggest challenges for embedded devices and systems, especially those employed in the [getkc id="76" comment="Internet of Things"], is adequately protecting them from increasingly sophisticated hacking. This is a new tool for criminal enterprises, a... » read more