Week In Review: Manufacturing, Test

By Mark LaPedus - 06 Aug, 2021 - Comments: 0

Chipmakers Taiwan’s Foxconn continues to expand its efforts in the semiconductor business. Foxconn has acquired a 6-inch wafer fab and the equipment from Taiwan’s Macronix for NT$2.52 billion (US$90.76 million). With the fab, Foxconn plans to enter the wideband gap semiconductor market, namely silicon carbide (SiC). SiC devices are used in electric vehicles, a market that Foxconn is making... » read more

Design For Airborne Electronics

By Ann Mutschler - 03 Feb, 2020 - Comments: 0

The Next Generation Air Transportation System (NextGen), an FAA-led modernization of America's air transportation system meant to make flying more efficient, predictable and safer, is currently underway as one of the most ambitious infrastructure projects in U.S. history. This is not just a minor upgrade to an aging infrastructure. The FAA and partners are in the process of implementing new ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 16 Aug, 2019 - Comments: 0

Chipmakers In its latest move to cut costs and focus on its core business, GlobalFoundries (GF) has announced plans to jettison its U.S. photomask operations in Burlington, Vt., but the foundry vendor will maintain a stake in its joint venture mask unit. Under the plan, Toppan Photomasks will acquire certain assets of GF’s Burlington photomask facility. “GF is transferring its mask tool... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week In Review: Manufacturing, Test

Design For Airborne Electronics

Week In Review: Manufacturing, Test