3D NAND Race Faces Huge Tech And Cost Challenges


Amid the ongoing memory downturn, 3D NAND suppliers continue to race each other to the next technology generations with several challenges and a possible shakeout ahead. Micron, Samsung, SK Hynix and the Toshiba-Western Digital duo are developing 3D NAND products at the next nodes on the roadmap, but the status of two others, Intel and China’s Yangtze Memory Technologies Co. (YMTC), is les... » read more

Finding The Bottom Of The Memory Trough


In announcing its Q2 fiscal 2019 results, Micron Technology, Inc. provided lower-than-expected revenue guidance of between $46 billion and $50 billion for the current quarter. However, what was particularly noteworthy was the company’s announcement to cut output by 5 percent due to weaker-than-expected market demand and its prediction that its customers’ inventory correction will last until... » read more

3D NAND Metrology Challenges Growing


3D NAND vendors face several challenges to scale their devices to the next level, but one manufacturing technology stands out as much more difficult at each turn—metrology. Metrology, the art of measuring and characterizing structures, is used to pinpoint problems and ensure yields for all chip types. In the case of 3D NAND, the metrology tools are becoming more expensive at each iteration... » read more

Week In Review: Manufacturing, Test


Chipmakers TrendForce released its foundry rankings for the first quarter of 2019. TSMC is still the clear leader, followed in order by Samsung, GlobalFoundries and UMC, according to the firm. It was a tough quarter for all foundries. Samsung has rolled out its new High Bandwidth Memory (HBM2E) product. The new solution, called Flashbolt, is the industry’s first HBM2E to deliver a 3.2Gbps... » read more

Self-Driving Architecture With eFPGAs


The favored self-driving architecture of the future will be increasingly decentralized. However, both the centralized and decentralized architectural design approaches will require hardware acceleration in the form of far more lookaside co-processing than is currently realized. Whether centralized or decentralized, the anticipated computing architectures for automated and autonomous driving ... » read more

5 Top Storylines For NAND Biz


2019 is expected to be a busy, if not difficult, year in the NAND flash memory market. Vendors will continue to ramp up 3D NAND, the successor to traditional 2D or planar NAND. Then, over the last year, prices for NAND have dropped with oversupply in the market. What’s in store in 2019? Vendors are expected to rush out their next-generation products. Then, there is a debate whether the... » read more

In-Memory Vs. Near-Memory Computing


New memory-centric chip technologies are emerging that promise to solve the bandwidth bottleneck issues in today’s systems. The idea behind these technologies is to bring the memory closer to the processing tasks to speed up the system. This concept isn’t new and the previous versions of the technology fell short. Moreover, it’s unclear if the new approaches will live up to their billi... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Taiwan specialty foundry vendor Vanguard International Semiconductor (VIS) will acquire GlobalFoundries’ Fab 3E facility in Singapore for $236 million. Fab 3E manages a monthly capacity of approximately 35,000 200mm wafers. The transaction includes buildings, facilities, and equipment, as well as IP associated with GF’s MEMS business. VIS currently has three 200mm fa... » read more

China’s Foundry Biz Takes Big Leap Forward


China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

Embedded Phase-Change Memory Emerges


The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

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