tag: University of Chicago

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Chip Industry Week In Review
By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Research Bits: Mar. 19
By Jesse Allen - 19 Mar, 2024 - Comments: 0

Superconducting loops Researchers from University of California San Diego and University of California Riverside propose using superconducting loops to store and transmit information in a method similar to the human brain. “Our brains have this remarkable gift of associative memory, which we don't really understand,” said Robert C. Dynes, professor of physics at UC San Diego and preside... » read more

Chip Industry Week In Review
By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Research Bits: December 11
By Jesse Allen - 11 Dec, 2023 - Comments: 0

Diamond device with high breakdown voltage Researchers from the University of Illinois at Urbana-Champaign developed diamond p-type lateral Schottky barrier diodes they say have the highest breakdown voltage and lowest leakage current compared to previous diamond devices. The diamond device can sustain high voltage, approximately 5 kV, although the voltage was limited by setup of measurement a... » read more

Chip Industry’s Technical Paper Roundup: Dec 11
By Liz Allan - 11 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

A Novel Way To Stretch Diamond For Better Quantum Bits
By Technical Paper Link - 05 Dec, 2023 - Comments: 0

A technical paper titled “Microwave-Based Quantum Control and Coherence Protection of Tin-Vacancy Spin Qubits in a Strain-Tuned Diamond-Membrane Heterostructure” was published by researchers at University of Chicago, University of Cambridge, Argonne National Laboratory, and Delft University of Technology. Abstract: "Robust spin-photon interfaces in solids are essential components in quant... » read more

Technical Paper Roundup: November 28
By Linda Christensen - 28 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=169 /] More Reading Technical Paper Library home » read more

Continuous Energy Monte Carlo Particle Transport On AI HW Accelerators
By Technical Paper Link - 20 Nov, 2023 - Comments: 0

A technical paper titled “Efficient Algorithms for Monte Carlo Particle Transport on AI Accelerator Hardware” was published by researchers at Argonne National Laboratory, University of Chicago, and Cerebras Systems. Abstract: "The recent trend toward deep learning has led to the development of a variety of highly innovative AI accelerator architectures. One such architecture, the Cerebras... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

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