Chip Industry Week In Review

By The SE Staff - 22 Aug, 2025 - Comments: 0

The EU’s tariffs on semiconductors will not exceed 15%, according to Trump’s latest trade deal. In addition, the EU committed to purchasing at least $40 billion worth of U.S. AI chips as well as other investments. [FAQ is here.] Lifelines for Intel: Intel inked a deal to sell the U.S. government a 10% non-voting equity stake in its business, worth $8.9 billion. The stake will be fun... » read more

Chip Industry Week In Review

By The SE Staff - 11 Jul, 2025 - Comments: 0

GlobalFoundries plans to acquire MIPS, adding RISC-V processor IP and PPA optimization software capabilities to its foundry offerings. MIPS will continue to operate as a standalone business within GF. The deal is expected to close in the second half of 2025. The EU rolled out new general-purpose AI rules this week to limit copyright infringement, protect public safety, and require transparency... » read more

Research Bits: July 7

By Jesse Allen - 07 Jul, 2025 - Comments: 0

3D NAND PUF Researchers from Seoul National University developed a new hardware security technology based on commercially available 3D NAND flash memory. The approach is an adaptation of physical unclonable functions (PUFs) with the ability to hide a security key under user data when not in use and reveal it only when needed. The same memory space used for storing security keys can be repurpos... » read more

Research Bits: Feb. 25

By Jesse Allen - 25 Feb, 2025 - Comments: 0

Recording synaptic connections Researchers from Harvard University built a silicon chip capable of recording synaptic signals from a large number of neurons and used it to catalogue more than 70,000 synaptic connections from about 2,000 rat neurons. They hope the device is a step in creating a detailed synaptic connection map of the brain. The chip contains an array of 4,096 microhole elect... » read more

Research Bits: Feb. 4

By Jesse Allen - 04 Feb, 2025 - Comments: 0

High-power diamond transistors Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for high-power electronics that remains switched off by default. The performance of the diamond was improved by coating it in hydrogen atoms followed by layers of aluminum oxide. “The challenge for power electronics is that the design of the... » read more

Chip Industry Week In Review

By The SE Staff - 01 Nov, 2024 - Comments: 0

Siemens announced plans to acquire Altair Engineering, a provider of industrial simulation and analysis, data science, and high-performance computing (HPC) software, for about $10 billion. Altair's software will become part of Siemens' Xcelerator portfolio and provide a boost to physics-based digital twins. Onto Innovation bought Lumina Instruments, a San Jose, California-based maker of lase... » read more

Chip Industry Technical Paper Roundup: Oct. 8

By Linda Christensen - 08 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=365 /] More ReadingTechnical Paper Library home » read more

TFETs: Design and Operation, Including Material Selection and Simulation Methods

By Technical Paper Link - 07 Oct, 2024 - Comments: 0

A new technical paper titled "Multiscale Simulation and Machine Learning Facilitated Design of Two-Dimensional Nanomaterials-Based Tunnel Field-Effect Transistors: A Review" was published by researchers at University of Chicago and Argonne National Lab. Abstract "Traditional transistors based on complementary metal-oxide-semiconductor (CMOS) and metal-oxide-semiconductor field-effect transi... » read more

Chip Industry Week In Review

By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review

By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

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tag: University of Chicago

Chip Industry Week In Review

Chip Industry Week In Review

Research Bits: July 7

Research Bits: Feb. 25

Research Bits: Feb. 4

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Oct. 8

TFETs: Design and Operation, Including Material Selection and Simulation Methods

Chip Industry Week In Review

Chip Industry Week In Review

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