Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Chip Industry Week in Review


Deals of the week: Arteris announced plans to acquire cybersecurity provider Cycuity. “Expanding our technology portfolio to include Cycuity’s hardware security assurance products will enable our customers to achieve secure on-chip data movement,” said Charlie Janac, chairman and CEO of Arteris. Qualcomm acquired Ventana Micro Systems, a maker of RISC-V data center-class CPU IP. ... » read more

Chip Industry Week in Review


Texas Instruments will invest more than $60 billion to build and expand seven semiconductor fabs in Texas and Utah, supporting more than 60,000 U.S. jobs. Chinese automakers — including SAIC Motor, Changan, Great Wall Motor, BYD, Li Auto and Geely — are aiming to launch new models with 100% homemade chips, some as early as 2026, reports Nikkei Asia. Marvell introduced 2nm custom SRAM ... » read more

Chip Industry Week In Review


McKinsey issued a new report on the state of the chemical supply chain for semiconductors in the U.S., citing potential shortages of high-purity materials such as tungsten, aluminum and copper, lack of access to CMP slurries and photoresists for EUV, and rising competition for high-k precursors that can fetch higher prices outside of the U.S. CSIS weighed in on the U.S. goverment's recent ... » read more

Chip Industry Week In Review


Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Startup Funding: June 2023


June saw several large funding rounds, with seven of at least $100 million. Over half a billion dollars alone went to a Chinese company manufacturing silicon carbide (SiC) power semiconductors. The wide band gap material has seen steady interest from investors, particularly for its potential use in electric vehicles. Another of the month's mega-rounds went to a company designing RISC-V SoCs ... » read more

Week In Review: Design, Low Power


Power always has been a function of cost. The more power required, the more it costs to run a device, both in dollars and carbon footprint. This makes the breakthrough in fusion ignition at Lawrence Livermore National Laboratory all the more noteworthy, and one that could have significant implications for the future of computing, from data centers to rechargeable batteries in automobiles, robot... » read more

Startup Funding: June 2022


Big money went to manufacturing in June, with a massive round for a Chinese analog foundry’s expansion to 55 – 40nm nodes. A fab management software startup also drew sizeable investment, as did a supplier of semiconductor-grade silicon components. Investors didn’t forget chip design, with three EDA companies receiving new funding, one of which drew over $100 million. Plus, numerous te... » read more

Technical Paper Round-up: May 17


New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

Thinning of GaN-on-GaN HEMTs With A Laser Slicing Technique


New technical paper "Laser slice thinning of GaN-on-GaN high electron mobility transistors" from researchers at Nagoya University, Hamamatsu Photonics, and National Institute for Materials Science, Tsukuba. Abstract "As a newly developed technique to slice GaN substrates, which are currently very expensive, with less loss, we previously reported a laser slicing technique in this journal. In... » read more

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