System Bits: Feb. 11


Modeling computer vision on human vision University of Michigan scientists used digital foveation technology to render images that are more comprehensible to machine vision systems, while also reducing energy consumption by 80%. The effect is achieved by manipulating a camera’s firmware. “It'll make new things and things that were infeasible before, practical,” Professor Robert Dick s... » read more

In-Memory Computing Challenges Come Into Focus


For the last several decades, gains in computing performance have come by processing larger volumes of data more quickly and with superior precision. Memory and storage space are measured in gigabytes and terabytes now, not kilobytes and megabytes. Processors operate on 64-bit rather than 8-bit chunks of data. And yet the semiconductor industry’s ability to create and collect high quality ... » read more

Power/Performance Bits: Feb. 5


Photonic-magnetic memory Researchers at the Eindhoven University of Technology (TU/e) have developed a hybrid photonic-magnetic memory device that takes advantage of the speed of optical writing and stability of magnetic drives. "All-optical switching for data storage has been known for about a decade. When all-optical switching was first observed in ferromagnetic materials - amongst the mo... » read more

Power/Performance Bits: Dec. 26


2nm memristors Researchers at the University of Massachusetts Amherst and Brookhaven National Laboratory built memristor crossbar arrays with a 2nm feature size and a single-layer density up to 4.5 terabits per square inch. The team says the arrays were built with foundry-compatible fabrication technologies. "This work will lead to high-density memristor arrays with low power consumption fo... » read more

Power/Performance Bits: Sept. 25


Heat transfer in 2D materials Engineers at the University of Illinois developed a way to reduce overheating in nanoelectronics that incorporate 2D components by adding another layer to the structure. "In the field of nanoelectronics, the poor heat dissipation of 2D materials has been a bottleneck to fully realizing their potential in enabling the manufacture of ever-smaller electronics whil... » read more

System Bits: Sept. 4


Quantum material is both conductor, insulator University of Michigan researchers reminded that quantum materials are a type of odd substance that could be many times more efficient at conducting electricity through a mobile device like an iPhone than the commonly used conductor silicon if physicists could figure out how they work. Now, a University of Michigan physicist has taken a step clo... » read more

Power/Performance Bits: Aug. 28


Multilayer stretchable electronics Researchers at UC San Diego, the University of Electronic Science and Technology of China, and the Air Force Research Laboratory developed an approach to creating stacked, stretchable electronics with complex functionality. "Rigid electronics can offer a lot of functionality on a small footprint--they can easily be manufactured with as many as 50 layers of... » read more

Week In Review: Design, Low Power


Intel disclosed a speculative execution side-channel attack method called L1 Terminal Fault (L1TF). Leslie Culbertson, Intel's executive vice president and general manager of Product Assurance and Security, writes: "This method affects select microprocessor products supporting Intel Software Guard Extensions (Intel SGX) and was first reported to us by researchers at KU Leuven University, Techni... » read more

System Bits: Aug. 7


ML leverages existing hospital patient data to detect trouble Focusing on emergency and critical care patients, a University of Michigan spinout, Fifth Eye, has developed a system that combines a machine learning algorithm with signal processing to monitor the autonomic nervous system of hospital patients and interprets the data every two minutes, which can sometimes be almost two days faster ... » read more

The Chiplet Race Begins


Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

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