tag: University of Michigan

Memory Disaggregation Research And Making It Practical With Hardware Trends (U. of Michigan)
By Technical Paper Link - 22 May, 2023 - Comments: 0

A new technical paper titled "Memory Disaggregation: Advances and Open Challenges" was published by researchers at University of Michigan. Abstract "Compute and memory are tightly coupled within each server in traditional datacenters. Large-scale datacenter operators have identified this coupling as a root cause behind fleet-wide resource underutilization and increasing Total Cost of Owners... » read more

Research Bits: May 2
By Jesse Allen - 02 May, 2023 - Comments: 0

Reconfigurable FeHEMT Researchers at the University of Michigan created a reconfigurable ferroelectric transistor that could enable a single amplifier to do the work of multiple conventional amplifiers. “By realizing this new type of transistor, it opens up the possibility for integrating multifunctional devices, such as reconfigurable transistors, filters and resonators, on the same plat... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Mar, 2023 - Comments: 0

The UK government published its National Quantum Strategy, which outlines the plan to invest £2.5 billion (~$3.0 billion) over the next 10 years into quantum technology, including computing, sensing, timing, imaging, and networking. "We will develop UK strengths across different hardware platforms, software, and components, and reinforce our capabilities throughout the supply chains. Although ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 14
By Linda Christensen - 14 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=86 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Ferroelectric HEMT Reconfigurable Transistor (U. of Michigan)
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A new technical paper titled "Fully epitaxial, monolithic ScAlN/AlGaN/GaN ferroelectric HEMT" was published by researchers at University of Michigan. “We can make our ferroelectric HEMT reconfigurable,” That means it can function as several devices, such as one amplifier working as several amplifiers that we can dynamically control. This allows us to reduce the circuit area and lower the... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 10 Mar, 2023 - Comments: 0

Global semiconductor sales decreased 5.2% month-to-month in January, according to a new report by the Semiconductor Industry Association (SIA). For the year, worldwide chip sales are down 18.5%, with the largest drop in sales by China at 31.6%, followed by the Asia Pacific region at 19.5%, and the Americas at 12.4%. Despite the contraction, companies are increasing investments in manufacturi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 24 Feb, 2023 - Comments: 0

Automotive Ambarella will use Samsung's 5nm process technology for its new CV3-AD685 automotive AI central domain controller, bringing "new levels of AI acceleration, system integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.” Renesas introduced four technologies for automotive communication gateway SoCs: (1) an architecture that dynamically changes... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14
By Linda Christensen - 14 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Nanoscale (5nm) Ferroelectric Semiconductor (University of Michigan)
By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper titled "Thickness scaling down to 5 nm of ferroelectric ScAlN on CMOS compatible molybdenum grown by molecular beam epitaxy" was published by researchers at University of Michigan, with DARPA funding. "Ferroelectric semiconductors stand out from others because they can sustain an electrical polarization, like the electric version of magnetism. But unlike a fridge magn... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 13 Jan, 2023 - Comments: 0

The head of the U.S. National Transportation Safety Board (NTSB), Jennifer Homendy, voiced concern about the impact of heavier electric vehicles (EVs) will have in crashes with smaller cars with internal combustion engines (ICEs). Homendy compared the weight of the GMC Hummer and the Ford F-150’s EV to ICE version and found the EVs are 2,000 to 6,000 pounds heavier. The extra weight in EVs is... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy