tag: FormFactor

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Mar, 2020 - Comments: 0

The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Mar, 2020 - Comments: 0

Market research The coronavirus is having a major impact on the semiconductor, smartphone and related markets. For example, global fab equipment spending promises to rebound from its 2019 downturn and see a modest recovery this year, according to a report from SEMI. But the coronavirus (COVID-19) outbreak has eroded fab equipment spending in China and elsewhere in 2020, according to the rep... » read more

Grading Chips For Longer Lifetimes
By Ed Sperling - 10 Mar, 2020 - Comments: 0

Figuring out how to grade chips is becoming much more difficult as these chips are used in applications where they are supposed to last for decades rather than just a couple of years. During manufacturing, semiconductors typically are run through a battery of tests involving performance and power, and then priced accordingly. But that is no longer a straightforward process for several reason... » read more

Wafer Test Challenges For Chiplets
By Amy Leong - 10 Mar, 2020 - Comments: 0

In a heterogeneous integrated system, the impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage. From a test perspective, making chiplets a mainstream technology depends on ensuring Good Enough Die at a reasonable test cost. Wafer-level test plays a critical and intricate role in the chipl... » read more

Improving Wafer-Level S-Parameters Measurement Accuracy And Stability With Probe-Tip Power Calibration Up To 110 GHz For 5G Applications
By FormFactor - 09 Mar, 2020 - Comments: 0

Author: Choon Beng Sia, FormFactor Inc., Singapore Demands for mission critical wireless services such as autonomous driving and telehealth require higher data transfer rates and lower latencies. Such applications are now driving the use of radio frequencies (RF) at 28, 38, 60 and 73 GHz for the emerging 5G mobile communication systems. Waferlevel RF measurements of devices or circuits for 5... » read more

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Feb, 2020 - Comments: 0

Fab tools The United States is mulling over new trade export restrictions for U.S. fab equipment to China, according to a report from The Wall Street Journal. “Recent press reports suggest the U.S. Department of Commerce is exploring additional measures to limit Huawei's access to U.S. semiconductor capital equipment (SPE) by requiring chip manufacturing plants globally to procure license... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Feb, 2020 - Comments: 0

Chipmakers and OEMs IC Insights has released its rankings of the 25 largest wafer capacity leaders in terms of monthly installed capacity in 200mm-equivalents as of December 2019. Samsung was in first place, followed by TSMC, Micron, SK Hynix, and Kioxia, formerly Toshiba Memory, according to IC Insights. Combined capacity of the top five companies represented 53% of total global wafer capa... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Oct, 2019 - Comments: 0

Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 May, 2019 - Comments: 0

Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

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