tag: University of Arkansas

Week In Review: Manufacturing, Test
By Karen Heyman - 25 Aug, 2023 - Comments: 0

Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, per Nikkei Asia. Huawei is building a collection of secret semiconductor fabrication facilities across China to let the company skirt U.S. sanctions, SIA warned in a presentation seen by Bloomberg. It’s acquired at least two existing plants and is building at l... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Nov, 2021 - Comments: 0

Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Oct, 2021 - Comments: 0

Government policy Hoping to resolve the ongoing worldwide chip shortage situation, the U.S. Department of Commerce late last month launched a “request for information (RFI)” initiative, which involved sending questionnaires to various semiconductor companies. The U.S. government is asking all parts of the supply chain – producers, consumers, and intermediaries – to voluntarily share in... » read more

Power/Performance Bits: Nov. 23
By Jesse Allen - 23 Nov, 2020 - Comments: 0

Graphene energy Researchers from the University of Arkansas, University of Pennsylvania, and Universidad Carlos III de Madrid built a circuit capable of capturing graphene's thermal motion and converting it into an electrical current. "An energy-harvesting circuit based on graphene could be incorporated into a chip to provide clean, limitless, low-voltage power for small devices or sensors,... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 26 Jun, 2020 - Comments: 0

Security The U.S. Defense Advanced Research Projects Agency (DARPA) selected Synopsys as the main contractor to provide SoC design tools and security IP for its Automatic Implementation of Secure Silicon (AISS) program. The four-year program’s goal to develop a design tool and IP ecosystem to automate adding security into integrated circuits. Synopsys will be working on a research team with ... » read more

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy