Isambard Analysis of HPC-Optimized Arm Processors


Written by Simon McIntosh‐Smith, James Price, Tom Deakin, Andrei Poenaru (all from the High Performance Computing Research Group, Department of Computer Science, University of Bristol, Bristol, UK) In this paper, we present performance results from Isambard, the first production supercomputer to be based on Arm CPUs that have been optimized specifically for HPC. Isambard is the first Cray ... » read more

Domain Expertise Becoming Essential For Analytics


Sensors are being added into everything, from end devices to the equipment used to make those sensors, but the data being generated has limited or no value unless it's accompanied by domain expertise. There are two main problems. One is how and where to process the vast amount of data being generated. Chip and system architectures are being revamped to pre-process more of that data closer to... » read more

Making Things Simple With NVMe/TCP


Whether it is the aesthetics of the iPhone or a work of art like Monet’s ‘Water Lillies’, simplicity is often a very attractive trait. I hear this resonate in everyday examples from my own life – with my boss at work, whose mantra is “make it simple,” and my wife of 15 years telling my teenage daughter “beauty lies in simplicity.” For the record, both of these statements general... » read more

Week in Review: Design, Low Power


The U.S. Department of Energy (DOE) has awarded $35 million for 12 projects involving ultra-efficient power management. Called Arpa-E, the program encouraged participants to use medium-voltage electricity in new ways with real-world applications, such as industry, transportation and the grid. The top two award winners were Eaton Corp. (Arden, NC) for its DC wide-bandgap static circuit breaker, ... » read more

Making Autonomous Vehicles Safer


While self-driving vehicles are beta-tested on some public roads in real traffic situations, the semiconductor and automotive industries are still getting a grip on how to test and verify that vehicle electronics systems work as expected. Testing can be high stakes, especially when done in public. Some of the predictions about how humans will interact with autonomous vehicles (AVs) on public... » read more

Reducing Advanced Packaging Costs


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Where Advanced Packaging Makes Sense


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Affordable Design With Wireless Microcontrollers


Today, we are at the peak of technology product availability with the releases of the new iPhone models, Alexa-enabled devices, and more. In the coming days, there will be numerous international consumer OEMs preparing new offerings as we approach the holiday selling season. Along with the smartphones, voice assistant enabled smart speakers and deep learning wireless security cameras, many devi... » read more

VM Aware Fibre Channel Virtual Machine Traffic Visibility for SANs


Mysteries of the world, such as how the Monarch butterflies can find their way migration paths all the way back to their species’ origination point even though they had never been there before, but these occurrences in nature should remain a complete mystery. With VM clusters generating an increasing amount of FC traffic that crisscrosses across SANs within enterprise/datacenter ecosystem, th... » read more

Making Sure A Heterogeneous Design Will Work


An explosion of various types of processors and localized memories on a chip or in a package is making it much more difficult to verify and test these devices, and to sign off with confidence. In addition to timing and clock domain crossing issues, which are becoming much more difficult to deal with in complex chips, some of the new devices are including AI, machine learning or deep learning... » read more

← Older posts