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Week In Review: Semiconductor Manufacturing, Test


Starting in 2025, SEMICON West will move to Phoenix for a five-year annual rotation. And in 2024, it will shift dates from July to October. This year’s conference will still take place July 11 to 13 at the Moscone Center. Phoenix will first host SEMICON West on October 7-9, 2025. Thereafter, it will be held at the Moscone Center in San Francisco on the alternating years and over the long term... » read more

Where All The Semiconductor Investments Are Going


Companies and countries are funneling huge sums of money into semiconductor manufacturing, materials, and research — at least a half-trillion dollars over the next decade, and maybe much more — to guarantee a steady supply of chips and know-how to support growth across a wide swath of increasingly data-centric industries. The build-out of a duplicate supply chain that can guarantee capac... » read more

Week In Review: Semiconductor Manufacturing, Test


Nikkei Asia reports the U.S. is urging allies, including Japan, to restrict exports of advanced semiconductors and related technology to China. The U.S. holds 12% of the global semiconductor market, Japan has a 15% share, while Taiwan and South Korea each have about a 20% share. Some U.S. companies have called for other countries to adopt U.S.-style export curbs, arguing it is unfair for only A... » read more

Week In Review: Semiconductor Manufacturing, Test


The United States imposed further export controls aimed at preventing foreign firms from selling advanced chips to China or supplying Chinese firms with semiconductor processing tools. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. Officials noted that they h... » read more

Week In Review: Semiconductor Manufacturing, Test


Micron selected Syracuse, New York as the site for its new megafab complex, which is expected to create 9,000 company jobs and 40,000 construction and supply chain jobs. President Biden called it “another win for America.” The chip manufacturing facility will be the nation’s largest, including a 7.2 million square foot complex and 2.4 million square foot of cleanroom. Site preparation wil... » read more

Week In Review: Manufacturing, Test


Highlights from ITC The hot topic at this week’s International Test Conference (ITC) was tackling silent data corruption, with panel discussions, papers, and Google’s Parthasarathy Ranganathan’s keynote address all emphasizing the urgency of the issue. In the past two years Meta, Google, and Microsoft have reported on silent errors, errors not detected at test, which are adversely impact... » read more

Week In Review: Manufacturing, Test


President Biden signed an executive order on Sept. 15, limiting foreign investments in U.S. technology by "competitor or adversarial nations" that are deemed a threat to national security. In the past, the Committee on Foreign Investment in the United States (CFIUS) largely limited its actions to the sale of U.S. companies. The new directive expands that to include investments involving "U.S. s... » read more

Week In Review: Manufacturing, Test


The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Week In Review: Manufacturing, Test


Ramping capacity Samsung is considering building as many as 11 fabs in central Texas, investing an estimated $200 billion and creating as many as 10,000 jobs. The plans came to light when the company filed paperwork for tax breaks. Samsung already has broken ground on a new $17 billion fab in Taylor, Texas. The remaining nine fabs, including two in nearby Austin, would be built over the next c... » read more

Hybrid Bonding Moves Into The Fast Lane


The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

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