Chip Industry Week In Review


Notable deals Cadence and Intel Foundry inked a multi-year agreement to advance design technology co-optimization and create PDKs for Intel Foundry's 14A process. Nvidia and SK hynix announced a multi-year partnership to co-develop memory technology for AI infrastructure and physical AI. Teradyne unveiled an integrated test cell solution with TEL that supports known-good device scree... » read more

High-Speed Manufacturing And In-Field Scan Test Access Via PCI Express For GPIO Limited SoCs


By Ash Patel and Shubharthi Datta, Synopsys, and Chuanyun Fan, Cisco Today’s huge, deep submicron system on chip (SoC) designs present many challenges at every stage of development, from architectural exploration to volume production. This post addresses the specific hurdle of effective and efficient manufacturing tests for these complex devices. It outlines a commercially available soluti... » read more

Chip Industry Week in Review


Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Chip Industry Week in Review


Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Chip Industry Week In Review


Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Silicon Photonics In The Data Center: What A CMOS Exec Needs To Know


Silicon Photonics is changing the data center, with the biggest changes still ahead. Figure 1: Google Jupiter Network for multi-thousand Ironwood TPU clusters. Source: Google Refresher for new readers: Data centers contain hundreds or thousands of racks. For example, the Nvidia GB200 NVL72 AI compute/switch rack is about 24 inches wide, about 88 inches high and 42 inches deep. I... » read more

Annual Global IC Fabs And Facilities Report


Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Chip Industry Week In Review


China's Hefei Lumiverse Technology reportedly has developed a desktop-sized High Harmonic Generation light source that generates wavelengths as small as 1nm. One customer already has used it to produce 14nm chips, which was the original target node for EUV, according to one report. As a point of comparison, TSMC and Samsung didn't start using EUV until the 7nm node, relying instead on immersion... » read more

Chip Industry Week in Review


San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

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