Upcoming System Modeling Challenges
By Stephan Gerth - 14 Jun, 2018 - Comments: 0

In the past, during the concept phase of a design, system models have typically lacked information regarding reliability. If at all, reliability was addressed late in the design phase shortly before tape out. As the functional safety aspect, and with it an extended device lifetime, gains more and more attention for certain applications, things have to change in the design processes. To ensure a... » read more

Process Detection & Variability
By Ramsay Allen - 14 Jun, 2018 - Comments: 0

A Q&A with Moortec CTO Oliver King. What do we mean by process variation? Process variation is a complex subject which covers a range of effects, but broadly we can consider that the effects are caused by imperfections in the manufacturing process. Examples are implant variations, mask misalignments, and optical variations. These all add up to give statistical variation on the ideal o... » read more

Chip Dis-Integration
By Brian Bailey - 14 Jun, 2018 - Comments: 2

Just because something can be done does not always mean that it should be done. One segment of the semiconductor industry is learning the hard way that continued chip integration has a significant downside. At the same time, another another group has just started to see the benefits of consolidating functionality onto a single substrate. Companies that have been following Moore's Law and hav... » read more

Near-Threshold Issues Deepen
By Ann Mutschler - 14 Jun, 2018 - Comments: 0

Complex issues stemming from near-threshold computing, where the operating voltage and threshold voltage are very close together, are becoming more common at each new node. In fact, there are reports that the top five mobile chip companies, all with chips at 10/7nm, have had performance failures traced back to process variation and timing issues. Once a rather esoteric design technique, near... » read more

5G Wireless Infrastructure Pushes High-Speed SerDes Protocols
By Mondeep Thiara - 14 Jun, 2018 - Comments: 0

5G is the 5th generation wireless system standard that, through high speeds and increased accessibility, promises to change the way we stream, communicate, work, and travel. Boasting speed capabilities of 20Gbps and network densities of 1 million connected devices per square kilometer, 5G is the required technology for the implementation of highly anticipated technologies like autonomous vehicl... » read more

Complexity, Reliability And Cost
By Ed Sperling - 14 Jun, 2018 - Comments: 0

Peter Schneider, director of Fraunhofer's Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about future challenges in complexity, time to market and reliability issues, advanced packaging architectures, and the impact of billions of connected devices. What follows are excerpts of that discussion. SE: What is the biggest challenge you see in the semico... » read more

Seven Steps To Build A Successful IoT Solution
By Paul Williamson - 14 Jun, 2018 - Comments: 0

The technology sector is on course to produce a trillion connected IoT devices in the next two decades. As an innovator, you want to take advantage of this, but how and where do you begin navigating a complex world of hardware and software choices? The breadth of technology makes it easy for designers to build any kind of IoT solution at any scale across a continuum of applications. W... » read more

Tech Talk: Data-Driven Design
By Ed Sperling - 14 Jun, 2018 - Comments: 0

Steven Woo, distinguished inventor at Rambus, talks about memory hierarchies and how they are changing as the amount of data continues to grow. https://youtu.be/4FwZ1YeQa18 » read more

Advanced Packaging Confusion
By Ed Sperling - 13 Jun, 2018 - Comments: 2

Advanced packaging is exploding in all directions. There are more chipmakers utilizing different packaging options, more options for the packages themselves, and a confusing array of descriptions and names being used for all of these. Several years ago, there were basically two options on the table, 3D-ICs and 2.5D. But as chipmakers began understanding the difficulty, cost and reduced benef... » read more

Investigation Of The Influence of Controller Types On Room Thermal Behavior – A Simulation Study
By Fraunhofer IIS/EAS - 13 Jun, 2018 - Comments: 0

To control the indoor temperature of rooms two kinds of approaches are common. The first one is to use standard PI-controllers with a set of default parameters, which often leads to insufficient performance, waste of energy and unacceptable comfort violations [Rahmati, 2003]. The other approach is to use specifically developed and adapted controllers [Seidel et al., 2015], which have the drawba... » read more

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