Green ICT: The IoT World Also Needs Ecological Awareness
By Volkhard Beyer - 17 Oct, 2024 - Comments: 0

By Volkhard Beyer and Dirk Mayer Microelectronics support the fight against climate change and for a better environment; for example, by intelligently controlling drive units, ensuring optimal operation of energy systems, and monitoring the resource requirements of production processes. Unfortunately, however, the ICT sector itself is one of the fastest-growing emitters of greenhouse gase... » read more

GDDR7 Memory Supercharges AI Inference
By Tim Messegee - 17 Oct, 2024 - Comments: 0

GDDR7 is the state-of-the-art graphics memory solution with a performance roadmap of up to 48 Gigatransfers per second (GT/s) and memory throughput of 192 GB/s per GDDR7 memory device. The next generation of GPUs and accelerators for AI inference will use GDDR7 memory to provide the memory bandwidth needed for these demanding workloads. AI is two applications: training and inference. With tr... » read more

3DIO IP For Multi-Die Integration
By Lakshmi Jain - 17 Oct, 2024 - Comments: 0

By Lakshmi Jain and Wei-Yu Ma The demand for high performance computing, next-gen servers, and AI accelerators is growing rapidly, increasing the need for faster data processing with expanding workloads. This rising complexity presents two significant challenges: manufacturability and cost. From a manufacturing standpoint, these processing engines are nearing the maximum size that lithogra... » read more

Real-Time Low Light Video Enhancement Using Neural Networks On Mobile
By Ayaan Masood - 17 Oct, 2024 - Comments: 0

Video conferencing is a ubiquitous tool for communication, especially for remote work and social interactions. However, it is not always a straightforward plug and play experience, as adjustments may be needed to ensure a good audio and video setup. Lighting is one such factor that can be tricky to get right. A nicely illuminated video feed looks presentable in a meeting, but on the other hand,... » read more

How Big A Deal Is Aging?
By Brian Bailey - 17 Oct, 2024 - Comments: 0

Nothing lasts forever, but in the semiconductor world things used to last long enough to become obsolete long before their end of life. That's no longer the case with newer nodes, and it is raising concerns in safety-critical markets such as automotive. Being able to fully understand what happens inside of chips is still a work in progress, and analysis approaches are trying to keep up. Unti... » read more

Is Liquid Cooling Right For Your Data Center?
By Mark Seymour - 17 Oct, 2024 - Comments: 0

We live in an exciting time—liquid cooling, which once seemed more trouble than it’s worth, is fast becoming an accepted and sought-after technology in the data center industry. That said, it’s still a complex technology to implement, especially in legacy facilities. Is your data center ready to operationalize liquid cooling? Liquid cooling in the data center Liquid cooling in the d... » read more

Unbundling Analog From Digital Where It Makes Sense
By Ed Sperling - 17 Oct, 2024 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing in analog design with the shift toward heterogeneous integration and more safety- and mission-critical applications with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal product manager for custom I... » read more

Cloud Or On-premises? Why Not Both: A Hybrid Approach For Structure Simulation
By Thomas Lejeune - 17 Oct, 2024 - Comments: 0

Faced with large problem sizes and urgent deadlines, it’s not surprising that more and more product development teams are accessing high-performance computing (HPC) resources on the cloud. After all, a cloud computing model enables you to access the most advanced, leading-edge software and hardware on demand. There are no queues or wait times. Users can “dial up” core counts and other set... » read more

Mass Customization For AI Inference
By Ann Mutschler - 17 Oct, 2024 - Comments: 0

Rising complexity in AI models and an explosion in the number and variety of networks is leaving chipmakers torn between fixed-function acceleration and more programmable accelerators, and creating some novel approaches that include some of both. By all accounts, a general-purpose approach to AI processing is not meeting the grade. General-purpose processors are exactly that. They're not des... » read more

Thermal Modeling For 2.5D And 3D Integrated Chiplets
By Technical Paper Link - 16 Oct, 2024 - Comments: 0

A new technical paper titled "MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures" was published by researchers at University of Wisconsin–Madison, Washington State University, and University of Ulsan. Abstract: "Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D d... » read more

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