Research Bits: Mar. 10


Incipient ferroelectricity Researchers from Penn State University and the University of Minnesota propose harnessing incipient ferroelectricity in multifunctional two-dimensional FETs to create neuromorphic computer memory. Materials with incipient ferroelectricity have no stable ferroelectric order at room temperature and need certain conditions to achieve an electrical charge. The FETs were ... » read more

Thermally Aware Chiplet Placement Algorithm Based on Automatic Differentiation (MIT, IBM)


A new technical paper titled "DiffChip: Thermally Aware Chip Placement with Automatic Differentiation" was published by researchers at MIT and IBM. Abstract "Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring ... » read more

4D mmWave Radar-Based Road Boundary Detection System


A new technical paper titled "Road Boundary Detection Using 4D mmWave Radar for Autonomous Driving" was published by Stanford University. Abstract "Detecting road boundaries, the static physical edges of the available driving area, is important for safe navigation and effective path planning in autonomous driving and advanced driver-assistance systems (ADAS). Traditionally, road boundary de... » read more

The Optical Implementation of Backpropagation (Oxford, Lumai)


A technical paper titled "Training neural networks with end-to-end optical backpropagation" was published by researchers at University of Oxford and Lumai Ltd. Abstract "Optics is an exciting route for the next generation of computing hardware for machine learning, promising several orders of magnitude enhancement in both computational speed and energy efficiency. However, reaching the full... » read more

Field-Coupled Nanocomputing: Scalable And Efficient Post-Layout Optimization (TU Munich)


A new technical paper titled "Efficient and Scalable Post-Layout Optimization for Field-coupled Nanotechnologies" was published by researcher at the Technical University of Munich (TUM). Abstract "As conventional computing technologies approach their physical limits, the quest for increased computational power intensifies, heightening interest in post-CMOS technologies. Among these, Field... » read more

Solution To Read Disturbance For Current And Future DRAM Chips at Low Area, Performance And Energy Costs (ETH Zurich et al.)


A new technical paper titled "Chronus: Understanding and Securing the Cutting-Edge Industry Solutions to DRAM Read Disturbance" was published by researchers at ETH Zurich, TOBB, and University of Sharjah. Abstract "We 1) present the first rigorous security, performance, energy, and cost analyses of the state-of-the-art on-DRAM-die read disturbance mitigation method, Per Row Activation Count... » read more

Understanding Fault Injection Attacks At The Pre-Silicon Level


A new technical paper titled "CRAFT: Characterizing and Root-Causing Fault Injection Threats at Pre-Silicon" was published by researchers at North Carolina State University. Abstract "Fault injection attacks represent a class of threats that can compromise embedded systems across multiple layers of abstraction, such as system software, instruction set architecture (ISA), microarchitecture, ... » read more

Chip Industry Week In Review


The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chiplets: A Technology, Not A Market


Chiplets are big business, and that business is growing. The total chiplet market today is roughly $40 billion annually. Chiplets account for roughly 15% of TSMC's revenues, and they account for about 25% of all DRAMs. All of the major AI/HPC semiconductor companies (NVIDIA, AMD, Marvell, Broadcom) and the major hyper scalers (Amazon, Google, etc) are looking to chiplets to build superior... » read more

Shift-Left Pattern Matching Boosts Automotive IC Quality And Time-To-Market


As the automotive industry races towards a future of connected, autonomous, and electrified vehicles, the complexity of integrated circuits (ICs) powering these innovations is reaching unprecedented levels. Modern automotive ICs incorporate a diverse mix of custom and third-party intellectual property (IP), each with unique performance requirements that must be meticulously verified to ensure f... » read more

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