224Gbps PHY For The Next Generation Of High Performance Computing
By Priyank Shukla - 18 Jul, 2024 - Comments: 0

Large language models (LLMs) are experiencing an explosive growth in parameter count. Training these ever-larger models requires multiple accelerators to work together, and the bandwidth between these accelerators directly limits the size of trainable LLMs in High Performance Computing (HPC) environments. The correlation between the LLM size and data rates of interconnect technology herald a... » read more

A Guide To Rigid-Flex PCB Design
By Gregory Beers - 18 Jul, 2024 - Comments: 0

In today’s electronics industry, compact, efficient, and versatile PCBs are in high demand. Rigid-flex technology allows engineers to design boards that bend and flex without compromising performance or reliability. Mastering rigid-flex PCB design can be challenging due to its unique requirements. Whether you're an experienced designer expanding your skills or new to the field, this ar... » read more

Sensor Requirements For Developing Robust Environment Perception Systems
By Ron Martin - 18 Jul, 2024 - Comments: 0

In recent years, sensor systems for environment perception have become increasingly important – whether for adaptive robotics, automated driving, industrial process and quality control, or condition monitoring. The aim is always to detect and interpret certain environmental characteristics. In doing so, it’s important to choose not only the right algorithm but also the right sensor or senso... » read more

PCIe 7.0: Speed, Flexibility & Efficiency For The AI Era
By Lou Ternullo - 18 Jul, 2024 - Comments: 0

As the industry came together for PCI-SIG DevCon last month, one thing took center stage, and that was PCI Express 7.0. While still in the final stages of development, the world is certainly ready for this significant new milestone of the PCIe specification. Let’s look at how PCIe 7.0 is poised to address the escalating demands of AI, high-performance computing, and emerging data-intensive ap... » read more

PCIe 6.0 Address Translation Services: Verification Challenges And Strategies
By Geeta Arora - 18 Jul, 2024 - Comments: 0

Address Translation Services (ATS) is a mechanism in PCIe that allows devices to request address translations from the Input/Output Memory Management Unit (IOMMU). This is particularly important where devices need to access virtual memory. ATS enhances performance by enabling devices to cache translations, reducing the latency associated with memory access. This blog delves into the semantics ... » read more

On-Device Speaker Identification For Digital Television (DTV)
By Marcus Corbin - 18 Jul, 2024 - Comments: 0

In recent years, the way we interact with our TVs has changed. Multiple button presses to navigate an on-screen keyboard have been replaced with direct interaction through our voices. While this has resulted in significant improvements to the Digital Television (DTV) user experience, more can be done to provide immersive and engaging experiences. Imagine you say, “recommend me a film” or... » read more

Data Center Thermal Management Improves
By Karen Heyman - 18 Jul, 2024 - Comments: 0

Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

IC Power Optimization Required, But More Difficult To Achieve
By Adam Kovac - 18 Jul, 2024 - Comments: 0

Power optimization is playing an increasingly vital role in chip and chip and system designs, but it's also becoming much harder to achieve as transistor density and system complexity continue to grow. This is especially evident with advanced packages, chiplets, and high-performance chips, all of which are becoming more common in complex designs. Inside data centers, racks of servers are str... » read more

How Simulation Addresses Hydrogen Fuel Challenges
By Kiyoung Jung - 18 Jul, 2024 - Comments: 0

By Kiyoung Jung and Kyutae Kim Hydrogen has gained the front seat as a fuel for carbon neutrality. The absence of carbon emission at the point of utilization makes it attractive for net-zero initiatives. Hydrogen fuel possesses qualities like higher flame speed (8x higher), lower ignition energy requirements (15x lower), and wider flammability limit (4% to 70%) compared to typical hydrocar... » read more

SiC Power Electronics Packaging: Floating Die Structure and Liquid Metal Fluidic Connection (Cambridge U. )
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging" was published by researchers at Cambridge University. Abstract "Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electroni... » read more

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