Powering Next-Generation Insightful Design
By Sara Louie - 24 Jun, 2024 - Comments: 0

The Ansys team is gearing up for an exciting time at DAC this week, where we’ll be sharing a whole new way of visualizing physical phenomena in 3D-IC designs, powered by NVIDIA Omniverse, a platform for developing OpenUSD and RTX-enabled 3D applications and workflows. Please attend our Exhibitor Forum session so we can show you the valuable design insights you can gain by interactively viewin... » read more

U.S. Proposes Restrictions On Tech Investments In China
By Linda Christensen - 24 Jun, 2024 - Comments: 1

The U.S. proposed new regulations to curtail American investments in Chinese technologies that pose a national security threat, specifically calling out semiconductors and microelectronics, quantum information technologies, and AI. The draft regulations come nearly a year after the Biden administration issued an executive order prohibiting investments in sensitive technologies used to accele... » read more

Controlling Warpage In Advanced Packages
By Laura Peters - 24 Jun, 2024 - Comments: 1

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Warpage plays a critical role in determining whether an advanced package can be assembled successfully and meet long-term reliability targets. New advances, such as molding compounds with impro... » read more

NeuroHammer Attacks on ReRAM-Based Memories
By Technical Paper Link - 21 Jun, 2024 - Comments: 0

A new technical paper titled "NVM-Flip: Non-Volatile-Memory BitFlips on the System Level" was published by researchers at Ruhr-University Bochum, University of Duisburg-Essen, and Robert Bosch. Abstract "Emerging non-volatile memories (NVMs) are promising candidates to substitute conventional memories due to their low access latency, high integration density, and non-volatility. These super... » read more

ML Method To Predict IR Drop Levels
By Technical Paper Link - 21 Jun, 2024 - Comments: 0

A new technical paper titled "IR drop Prediction Based on Machine Learning and Pattern Reduction" was published by researchers at National Tsing Hua University, National Taiwan University of Science and Technology, and MediaTek. Abstract (partial) "In this paper, we propose a machine learning-based method to predict IR drop levels and present an algorithm for reducing simulation patterns, w... » read more

Chip Industry Week In Review
By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Power Electronic Packaging for Discrete Dies
By Technical Paper Link - 20 Jun, 2024 - Comments: 0

A technical paper titled “Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs” was published by researchers at University of Cambridge, University of Warwick, Chongqing University, and SpaceX. Abstract: "This paper proposes a new power electronic packaging for discrete dies, namely Standard Cell which consists of a step-etched active metal brazed (AMB) substrate and... » read more

Demonstrating Programmable Nonlinear Quantum Photonic ICs
By Technical Paper Link - 20 Jun, 2024 - Comments: 0

A technical paper titled “Programmable Nonlinear Quantum Photonic Circuits” was published by researchers at Niels Bohr Institute, University of Copenhagen, University of Bristol, and Ruhr-Universitat Bochum. Abstract: "The lack of interactions between single photons prohibits direct nonlinear operations in quantum optical circuits, representing a central obstacle in photonic quantum tech... » read more

Dedicated Approximate Computing Framework To Efficiently Compute PCs On Hardware
By Technical Paper Link - 20 Jun, 2024 - Comments: 0

A technical paper titled “On Hardware-efficient Inference in Probabilistic Circuits” was published by researchers at Aalto University and UCLouvain. Abstract: "Probabilistic circuits (PCs) offer a promising avenue to perform embedded reasoning under uncertainty. They support efficient and exact computation of various probabilistic inference tasks by design. Hence, hardware-efficient compu... » read more

Development Of Capacitance Measurement Unit For A System Level Tester
By BeomSeok Kim - 20 Jun, 2024 - Comments: 0

By BeomSeok Kim, SeongHwan Kim, Unki Kim, SeongBeom Cho, DongHo Seo, and SangHun Yun In back-end semiconductor processing it is important to improve the performance of semiconductors due to the limitations of miniaturization in front-end processes. To achieve this goal, the industry continues to invest in back-end processing and competition is fierce in advanced technology of back-end proces... » read more

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