Surface Metrology for Hybrid Bonding in Advanced Semiconductor Packaging
By Bruker - 13 Jan, 2026 - Comments: 0

Achieving a reliable hybrid bond requires both surfaces to be pristine. To support this requirement, metrology methods such as atomic force microscopy (AFM) and atomic force profilometry (AFP) are critical for surface characterization and process optimization. AFM delivers localized, high-resolution surface measurements, while AFP provides complementary large-area topography scans that ... » read more

Why Scan Diagnosis Should Be Part Of Every Fabless Company’s Yield Playbook
By Jayant D'Souza - 13 Jan, 2026 - Comments: 0

A fabless semiconductor company's world spins around two things, pushing design differentiation and getting those designs to market quickly and profitably. Yield isn’t just a manufacturing KPI. It's a business lever. And one of the most under-used levers in modern fabs is scan diagnosis, the practice of turning deterministic test infrastructure and failing test data into precise and action... » read more

Revolutionizing Semiconductor Collaboration: The Emergence of AI-Driven Industry Platforms
By PDF Solutions - 13 Jan, 2026 - Comments: 0

Demand for advanced computing is robust, driven by AI, cloud technologies, and widespread electrification of the economy. As Moore’s Law slows, the industry is pivoting toward innovative approaches—exploring 3D architectures, chiplets, and sophisticated hybrid packages. Concurrently, the semiconductor landscape is becoming increasingly global, with advanced devices now relying on integratin... » read more

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding
By Bryon Moyer - 13 Jan, 2026 - Comments: 0

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s merely a postponement, not a cancellation. HBM has been in high demand for AI in data centers — especially for training. Data movement dominates energy consumption, and high-bandwidth memories... » read more

High-Throughput Image Sensors: Smart Testing Powers Progress
By Alexander Metzdorf - 13 Jan, 2026 - Comments: 0

In the race to produce higher resolution image sensors—now pushing beyond 500 megapixels—the industry faces significant challenges. These sensors aren’t just capturing more pixels; they’re handling massive streams of data, validating intricate on-chip AI functions, and doing it all at breakneck speeds. For manufacturers, the challenge is as unforgiving as it is critical: test more compl... » read more

Ultralow-Loss PIC Platform From Violet to Near-Infrared, CMOS-Foundry Compatible (Caltech, UCSB et al.)
By Technical Paper Link - 12 Jan, 2026 - Comments: 0

A new technical paper titled "Towards fibre-like loss for photonic integration from violet to near-infrared" was published by researchers at Caltech, UCSB, Leiden University and University of Southampton. Abstract excerpt: "Here we present an ultralow-loss PIC platform based on germano-silicate—the material underlying the extraordinary performance of optical fibre—but realized by a fu... » read more

Doping-Dependent Charge Trapping in WS2 FETs (KU Leuven, imec, TU Wien)
By Technical Paper Link - 12 Jan, 2026 - Comments: 0

A new technical paper titled "Impact of doping and channel inhomogeneities on the stability of industrially fabricated WS2 FETs" was published by researchers at KU Leuven, imec and TU Wien. Abstract "We report doping-dependent charge trapping in WS2 field-effect transistors fabricated on a 300 mm wafer. In particular, higher n-type doping–associated with smaller channel areas–correlat... » read more

Minimizing Optical Loss While Enabling Efficient Phase Modulation in TMD-Based Devices (Nanyang Technological Univ., et al.)
By Technical Paper Link - 12 Jan, 2026 - Comments: 0

A new technical paper titled "Hybrid tungsten oxyselenide/graphene electrodes for near-lossless 2D semiconductor phase modulators" was published by researchers at Nanyang Technological University, CNRS-International-NTU-Thales Research Alliance (CINTRA), University of Chicago, University of Wisconsin-Madison, Chungnam National University, National Institute for Materials Science, MIT, and Singa... » read more

Performant Side-Channel Resistant RISC-V Core to Secure Neural Network Inference (Northeastern Univ.)
By Technical Paper Link - 12 Jan, 2026 - Comments: 0

A new technical paper titled "PermuteV: A Performant Side-channel-Resistant RISC-V Core Securing Edge AI Inference" was published by researchers at Northeastern University. Abstract "Edge AI inference is becoming prevalent thanks to the emergence of small yet high-performance microprocessors. This shift from cloud to edge processing brings several benefits in terms of energy savings, impr... » read more

Improving End-to-End Cyber Threat Detection with Quantum Processors Through Hybrid Architecture (Johns Hopkins Univ.)
By Technical Paper Link - 12 Jan, 2026 - Comments: 0

A new technical paper titled "Cyber Threat Detection Enabled by Quantum Computing" was published by researchers at Johns Hopkins University. Abstract "Threat detection models in cybersecurity must keep up with shifting traffic, strict feature budgets, and noisy hardware, yet even strong classical systems still miss rare or borderline attacks when the data distribution drifts. Small, near-... » read more

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