Learn how multi-scale insights from AFM and AFP enhance hybrid bond integrity and device performance.
Achieving a reliable hybrid bond requires both surfaces to be pristine. To support this requirement, metrology methods such as atomic force microscopy (AFM) and atomic force profilometry (AFP) are critical for surface characterization and process optimization. AFM delivers localized, high-resolution surface measurements, while AFP provides complementary large-area topography scans that span from nanometer-scale features to full wafer dimensions, including the bevel edge.
This application note highlights how Bruker’s InSight 300 AFM and InSight AFP automated solutions offer multi-scale surface insights that inform surface conditioning decisions, ultimately enhancing hybrid bond integrity and device performance.
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