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tag: Bruker

Enabling Test Strategies For 2.5D, 3D Stacked ICs
By Laura Peters - 08 Sep, 2022 - Comments: 0

Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

Deep Learning To Classify And Establish Structure Property Predictions With PeakForce QNM Atomic Force Microscopy
By Bruker - 07 Sep, 2022 - Comments: 0

Machine learning and specifically, deep learning, is a powerful tool to establish the presence (or absence) of microstructure correlations to bulk properties with its ability to flesh out relationships and trends that are difficult to establish otherwise. This application note discusses the use of deep learning tools, to explore AFM phase and PeakForce Quantitative Nanomechanics (QNM) im... » read more

Nanosheet FETs Drive Changes In Metrology And Inspection
By Karen Heyman - 09 Aug, 2022 - Comments: 0

In the Moore’s Law world, it has become a truism that smaller nodes lead to larger problems. As fabs turn to nanosheet transistors, it is becoming increasingly challenging to detect line-edge roughness and other defects due to the depths and opacities of these and other multi-layered structures. As a result, metrology is taking even more of a hybrid approach, with some well-known tools moving... » read more

Advantages Of Measuring Surface Roughness With White Light Interferometry
By Bruker - 09 Aug, 2022 - Comments: 0

The concept of measuring surface roughness originated nearly a century ago as a means to prevent uncertainty and disputes between manufacturers and buyers. Now, it has become a common identifier used throughout industry for validating manufacturing processes, confirming adherence to both internal and regulatory specifications, and guaranteeing quality and performance of end products. Subjective... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 15 Jul, 2022 - Comments: 0

Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Jun, 2022 - Comments: 0

Automotive, mobility U.S. National Highway Traffic Safety Administration (NHTSA) release its first crash reports from ADAS (advanced driver assistance systems, i.e., SAE Level 2) and ADS (automated driving systems, i.e., SAE Levels 3-5).  The systems had to be in use at least 30 seconds before the crash in order for it to be reportable. The car may have had the system turned off at the time ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Jun, 2022 - Comments: 0

Automotive, mobility Lightyear, an automotive company based in the Netherlands, announced its solar car, the Lightyear 0, which goes into production this year. The car has a Worldwide Harmonised Light Vehicle Test Procedure (WLTP) range of 625 kilometers/388 miles and can charge itself while driving or parked, using double curved solar arrays on its roof. The daily charging adds 70 kilometers/... » read more

The Race To Zero Defects In Auto ICs
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the number of costly returns. Today, assembly defects account for between 12% and 15% of semiconductor customer returns in the automotive chip market. As component counts in vehicles climb from the ... » read more

Atomic Force Microscopy Covers The Landscape Of Polymer Characterization
By Bruker - 07 Jun, 2022 - Comments: 0

"Materials scientists designing a polymer-based material for a specific application must analyze how and why all these factors come together to impact the final product. Understanding the structure and properties at the microscopic level is critical to a complete understanding of the material. “Everybody wants to make their materials perform better at the macroscale,” says Bede Pittenger, a... » read more

Startup Funding: May 2022
By Jesse Allen - 06 Jun, 2022 - Comments: 0

May was another strong month for China as it continues its push to build a native semiconductor ecosystem. Over half the month's total funding went to startups in the country. Over half the companies funded were from China as well, including two FPGA companies, three making CPUs, a GPU startup, and numerous networking and wireless chip companies. Two of those, in FPGAs and CPUs, raised rounds s... » read more

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