Surface Metrology for Hybrid Bonding in Advanced Semiconductor Packaging

By Bruker - 13 Jan, 2026 - Comments: 0

Achieving a reliable hybrid bond requires both surfaces to be pristine. To support this requirement, metrology methods such as atomic force microscopy (AFM) and atomic force profilometry (AFP) are critical for surface characterization and process optimization. AFM delivers localized, high-resolution surface measurements, while AFP provides complementary large-area topography scans that ... » read more

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tag: atomic force profilometry

Surface Metrology for Hybrid Bonding in Advanced Semiconductor Packaging

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