Integrating Optics And Engineering: How Simulation Transforms Medical Device Design
By Synopsys - 14 Jan, 2026 - Comments: 0

The integration of optical systems in medical devices is a rapidly growing area of focus and investment within the medical technology sector. From surgical lasers and diagnostic imaging tools to microscopes applied in research, advanced optics have enormous potential to drive better patient outcomes. However, designing advanced optical systems for medical devices poses numerous complex... » read more

Blog Review: Jan. 14
By Jesse Allen - 14 Jan, 2026 - Comments: 0

Arm's Paul Black demonstrates how lightweight LLVM sanitizers help detect undefined behavior, improve code quality, and expose hidden bugs in embedded C and C++ projects, with a focus on two sanitizers that can catch issues such as unsigned signed shift overflows, array overflows, and stack corruption. Imagination's Alex Pim provides an overview of LLM inference acceleration for mobile and e... » read more

EDA and IP Revenue Up 8.8%
By Ed Sperling - 13 Jan, 2026 - Comments: 0

EDA and IP revenue grew 8.8% in Q3 2025 to $5.566 billion, up from $5.115 billion in the same period in 2024, according to new data from ESD Alliance. But beneath those respectable, if not spectacular numbers, some interesting shifts are underway. China returned to double-digit growth after several quarters of lackluster sales. But the biggest surprise was EDA/IP revenues from South Korea an... » read more

Loss Errors in Error-Corrected Circuits Across A Range Of Quantum Hardware Platforms (MIT, Harvard, QuEra)
By Technical Paper Link - 13 Jan, 2026 - Comments: 0

A new technical paper titled "Leveraging Qubit Loss Detection in Fault-Tolerant Quantum Algorithms" was published by researchers at MIT, Harvard and QuEra Computing. Abstract "Qubit loss errors constitute a dominant source of noise in many quantum hardware systems, particularly in neutral-atom quantum computers. We develop a theoretical framework to effectively detect and correct loss err... » read more

Wafer Probe Struggles To Adapt To Multi-Die Assemblies
By Gregory Haley - 13 Jan, 2026 - Comments: 1

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the semiconductor industry’s history, wafer probe occupied a stable, largely uncontested role in manufacturing. It was understood as a screening step, an electrical checkpoint to identify failing de... » read more

A Clear Advantage: Precision Glass Carrier Inspection For AI And HPC Markets
By Jason Lin - 13 Jan, 2026 - Comments: 0

If you’ve been following the evolution of advanced packaging, you know that the industry is pushing boundaries like never before. From high-performance computing to industry-upending AI devices, the demand for smaller, faster, and more powerful chips is driving innovation at every level. One of the unsung heroes in this transformation: Glass carriers. These carriers are becoming essential ... » read more

Semiconductor Manufacturing In The AI Era
By Christophe Begue - 13 Jan, 2026 - Comments: 0

At the 2025 PDF Solutions Users Conference, CEO John Kibarian delivered a wide-ranging keynote that positioned the semiconductor industry at a pivotal inflection point, one driven by explosive AI demand but constrained by unprecedented manufacturing complexity. His central message: the path to a trillion-dollar semiconductor industry by 2030 requires fundamentally rethinking how manufacturers c... » read more

Robust Dynamic Voltage Droop Mitigation And Power Management
By Graham Woods - 13 Jan, 2026 - Comments: 1

Power management is one of the keys for developing successful semiconductors products. There are virtually no applications for which power consumption is not a concern. Many creative solutions have been developed to reduce and manage power. Making these schemes work robustly in real-world conditions can be a challenge. This post considers widely used methods—voltage droop/glitch detection and... » read more

Early Zone Correction for Enhanced Overlay Precision in Next-Generation FOPLP Lithography
By Onto Innovation - 13 Jan, 2026 - Comments: 0

AI chiplet architectures are driving advanced IC substrates (AICS) toward larger panels, finer line/space, and much tighter overlay budgets. This study presents a lithography strategy that combines ultra-large exposure field and fine-resolution imaging with algorithmic early zone correction (EZC) to reduce alignment-solution errors, the largest item in the lithography overlay budget. In this st... » read more

Secure Data Sharing Becoming Critical For Chip Manufacturing
By Laura Peters - 13 Jan, 2026 - Comments: 0

Semiconductor companies increasingly need to share data to solve problems faster, boost yield, and trace the root cause of failed devices. But to make that work, companies need assurances that their data will be secure, free from data leaks that could result in the loss of valuable IP. Data sharing is becoming critical at leading device nodes, where process variability is starting to consume... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy