Power-Aware Revolution In Automated Test For ICs
By Gregory Haley - 11 Jun, 2024 - Comments: 0

As semiconductor devices advance in complexity and sensitivity to power fluctuations, the integration of power-aware automatic test pattern generation (ATPG) is becoming indispensable for yield and the overall functionality of a chip. Unlike traditional ATPG, which generates test patterns solely to ensure device functionality, power-aware ATPG takes it a step further by meticulously consider... » read more

Semiconductor Testing Unlocks Increasing Levels Of ADAS
By Fisher Zhang - 11 Jun, 2024 - Comments: 0

Today’s advanced driver assistance systems (ADAS) require unprecedented computing power – tasked with processing an incredible amount of data from sensors in real-time, making split-second decisions, and ensuring the safety and comfort of passengers. The challenge is fluid and, as vehicles ascend from one level of autonomous driving to the next, computational demands will rise exponentially... » read more

Micro Dispensing: From Semiconductors To Sushi
By Muge Deniz Meiller - 11 Jun, 2024 - Comments: 0

The phrase “micro fluid dispensing” is generally associated with applications like medical device assembly or battery manufacturing. It certainly doesn’t conjure up visions of sushi – at least not yet. If engineers at IHI Aerospace and Yamagata University have their way, though, 3D printed sushi will be served to space tourists as they circle in low Earth orbit. Yes, printed sush... » read more

Using Predictive Data Analytics In Manufacturing
By Dieter Rathei - 11 Jun, 2024 - Comments: 0

Data is said to be the gold of the 21st century, but is that true? Even with trillions of lines of data in your database, you won’t be mining any gold – unless you understand what the data means. Here’s what’s happening all around the semiconductor industry: we have far too much data. The problem is that the value you need is hidden in the data, and to mine the gold from it, you need to... » read more

Fundamentals of Power Amplifier Testing
By NI - 11 Jun, 2024 - Comments: 0

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In this application note, you will learn the basics of testing RF PAs and FEMs through an interactive application note with multiple how-to videos. When characterizing the performance of an RF PA, engin... » read more

The Future Of Data Analytics And Semiconductor Testing
By Michael Chang - 11 Jun, 2024 - Comments: 0

The world is changing more rapidly than ever. With the explosion of Artificial Intelligence (AI), Machine Learning (ML) and data analytics, semiconductor manufacturers now have the opportunity to extract valuable insights from the massive amounts of data being generated throughout the silicon lifecycle. By leveraging AI algorithms and ML, semiconductor manufacturers can now optimize silicon des... » read more

Speeding Up Metrology At Advanced Nodes
By Gregory Haley - 11 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk metrology at the most advanced nodes and the impact of using different substrates, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John Hoffman, computer vision engineering manager at Nordson Test & Measurement; and Jiangtao Hu, senior technology director at Onto Inn... » read more

Advanced FTIR Optical Modeling for Hydrogen Content Measurements in 3D NAND Cell Nitride and Amorphous Carbon Hard Mask
By Onto Innovation - 11 Jun, 2024 - Comments: 0

Abstract Fourier Transform Infrared spectroscopy offers inline solutions for chemical bonding, epi thickness, and trench depth measurements. Through optical modeling of the transmission or reflectance spectra, information about the electronic structure and chemical composition may be obtained, which can be used for process control and monitoring. In this article, we demonstrate the measurement... » read more

Datacenter Chipmaker Achieves Double-Digit Power Reduction with Next-Gen Voltage Scaling
By proteanTecs - 11 Jun, 2024 - Comments: 0

The Customer A fabless chipmaker making 5nm networking chips for datacenters. The Challenge High power consumption due to excessive voltage guard-bands What You'll Discover: Learn how the customer safely decreased the voltage from 650 mV to an average of 608 mV, resulting in a 12.5% dynamic power reduction. This significant optimization helped the chipmaker stand out as a low-pow... » read more

3D Metrology Meets Its Match In 3D Chips And Packages
By Laura Peters - 11 Jun, 2024 - Comments: 0

The pace of innovation in 3D device structures and packages is accelerating rapidly, driving the need for precise measurement and control of feature height to ensure these devices are reliable and perform as expected throughout their lifetimes. Expansion along the z axis is already well underway. One need look no further than the staircase-like 3D NAND stacks that rise like skyscrapers to p... » read more

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