An Acquisition To Streamline SoC Integration


Late last year Arteris IP closed its acquisition of Magillem assets, bringing together two companies with a single mission: To support integration of systems-on-chip (SoCs) at the interconnect fabric level and the data integration level. The value of joining forces has been appealing for some time. Since the early days of both companies, we’ve been working with mutual customers and integratio... » read more

Design For Reliability


Circuit aging is emerging as a mandatory design concern across a swath of end markets, particularly in markets where advanced-node chips are expected to last for more than a few years. Some chipmakers view this as a competitive opportunity, but others are unsure we fully understand how those devices will age. Aging is the latest in a long list of issues being pushed further left in the desig... » read more

Analysis And Development of Safety-Critical Embedded Systems


Today’s automobiles and airplanes feature more electronic components than ever. Hundreds of connected systems enable safety-critical functions like braking, acceleration, steering, navigation and communication. Ansys has the only comprehensive simulation solution for designing safe, reliable systems — including hardware, electronics and embedded software — for human-controlled and autonom... » read more

Week In Review: Manufacturing, Test


Chipmakers The U.S. Semiconductor Industry Association (SIA) and several chip executives have sent a joint letter to President Biden, urging the administration to include substantial funding for semiconductor manufacturing and research in the U.S. As reported, the share of global semiconductor manufacturing capacity in the U.S. has decreased from 37% in 1990 to 12% today. “Semiconductors pow... » read more

Week In Review: Design, Low Power


Renesas Electronics Corporation will acquire Dialog Semiconductor in an all-cash deal worth about US $5.9 billion. Dialog is a supplier of mixed-signal ICs targeting IoT, consumer, automotive, and industrial. The company's primary areas of focus were communications and power control. These products are complementary to existing Renesas embedded compute products. Dialog CEO Dr. Jalal Bagherli... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

Design Support For A Green IoT


By Dirk Mayer and Roland Jancke The Internet of Things (IoT) is growing rapidly all around the world. New devices are continually being added, all collecting a variety of data and transmitting them (often wirelessly) to edge devices, which in turn relay the data to the cloud for further processing. It is estimated that in a few years IoT devices will be responsible for over 20% of global ene... » read more

The Many Flavors Of UPF: Which Is Right For Your Design?


Energy efficient electronic systems require sophisticated power management architectures that present difficult low-power verification challenges. Accellera introduced the Unified Power Format (UPF) standard in 2007 to help engineers deal with these complex issues. To keep pace with the growing complexity of low-power designs, the UPF standard has itself continued to evolve through the relea... » read more

Modeling PCBs For Common Causes Of Failure


By Theresa Duncan and Michael Blattau When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical tests to determine how and why electronics fail, however, a much faster and cost-effective solution is PCB modeling and simulation. When simulation is used i... » read more

CXL: Sorting Out The Interconnect Soup


In the webinar Hidden Signals: Memory and Interconnect Decisions for AI, IoT and 5G, Shane Rau of IDC and Rambus Fellow Steven Woo discussed how interconnects were a critical enabling technology for future computing platforms. One of the major complications was the “interconnect soup” of numerous and divergent interface protocols. The Compute Express Link (CXL) standard offers to sort out m... » read more

← Older posts Newer posts →