Using cause-and-effect chains to debug IC designs.
This paper presents a new way to comprehend complex scenarios, in order to significantly accelerate bug detection and resolution. By defining a new visual language, which creates interaction vertices between the simulation scenarios and the code structure on a single matrix, we offer a novel way to compare multiple cycles. It enables verification engineers to reach solid conclusions regarding a failure by comparing successful events.
We propose a novel method that will significantly improve the cycle of failure detection. To read more, click here.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Heterogeneous designs and AI/ML processing expose the limitations of existing methodologies and tools.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Leave a Reply