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The Physics Of Ferroelectrics


The physics of ferroelectric materials is a large topic — too large for comprehensive coverage in a single article. While researching my recent article on negative capacitance, I found a number of papers that might be of interest to readers seeking more depth. Researchers in Japan used ferroelectric BiFeO3 to control the behavior of CaMnO3, a Mott insulator. Changing the polarization of th... » read more

An OSAT Perspective On Semiconductor Market Trends


For the semiconductor industry, 2022 was a very interesting year. On one hand, it witnessed shortages in the supply chain. On the other hand, the macro-economic situation turned and demand for several consumer and computing devices plummeted. A trade war with China and ensuing localization of supply chain with passage of CHIPS act took shape in 2022. The auto industry is still recovering from t... » read more

Supply Chain Collaboration Key To Making Chip Industry More Sustainable


Coming in the wake of the COP27, the Smart and Green Manufacturing Summit at SEMICON Europa 2022 (Munich, 15-17 November) had a timely focus on the semiconductor industry’s contribution to meeting the United Nations’ target of limiting global warming to 1.5°C above pre-industrial levels. However, in an industry as large and valuable as semiconductors, social as well as environmental imp... » read more

Multi-Beam Mask Writers Are A Game Changer


The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported strong purchasing predictions for multi-beam mask writers, enabling both EUV and curvilinear photomask growth. A panel of experts debated remaining barriers to curvilinear photomask adoption during an event co-located with the SPIE Photomask Technology Conference in late September. Industry luminaries representing 44 compan... » read more

3D Sensing Package Solutions


By Chiung Lee, Weilung Lu, and Adrian Arcedera 3D sensing technology is rapidly being adopted in a variety of growing markets. End-product applications include smartphones, tablets, augmented/virtual reality products, robot vacuum cleaners, industry inspection machines, and automotive vehicles. As shown in figure 1, Yole Développement expects the 3D imaging and sensing market to expand from... » read more

Automotive MEMS Accelerometer Design Verification: A Real Life Example


Standard Finite Element (FE) models, especially those that incorporate multiple physical domains, consist of detailed representations of a device that include a large number of Degrees of Freedom (DoF). The Degrees of Freedom in a design are the number of independent variables or parameters needed to describe the motion or state of the device. Generally, the larger the number of Degrees of Free... » read more

A New Dimension In Optical CD


One of the biggest challenges for nanoscale fabrication is how to measure devices on such a minute scale. As the semiconductor industry demands ever smaller devices, the need for reliable, robust measurements for quality control and process optimization increases. One robust and commonly used technique in semiconductor manufacturing is optical critical dimension (OCD) metrology. Standard, al... » read more

Driving Toward Net-Zero: Key Takeaways From Semiconductor Sustainability Summit


To address the climate crisis, countries around the world are pursuing ambitious targets to achieve net-zero carbon emissions by 2050 under the Paris Agreement. In March, Taiwan redoubled its focus on decarbonization by announcing its net-zero pathway, while its Environmental Protection Administration (EPA) under the Executive Yuan is reshaping the Greenhouse Gas Reduction and Management Act in... » read more

The Rise Of Copper Wires In Automotive ICs


In 2011, the price of Gold (Au) surged to $1900/oz which had a drastic impact on Wirebonded ICs using Au wires. IC suppliers scrambled to convert from Au to copper (Cu) wire on as many products as they could. However, automotive ICs were reluctant to make the jump due to lack of reliability data and performance track-record. However, today’s automotive ICs are big users of Cu wires driven by ... » read more

High-NA EUV Complicates EUV Photomask Future


The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported EUV fueling growth of the semiconductor photomask industry while a panel of experts cited a number of complications in moving to High-NA EUV during an event co-located with the SPIE Photomask Technology Conference in late September. Industry luminaries representing 44 companies from across the semiconductor ecosystem partic... » read more

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