3D NAND: Challenges Beyond 96-Layer Memory Arrays


Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the first V-NAND product using 24 layers and MLC [1]. Five years later, in 2018, vendors of 3D-NAND have all announced production plans for 96-Layer NAND using TLC [2]. According to recent news reports, vendors are already working ... » read more

EUV’s Uncertain Future


The ground appears to be solidifying under EUV. Intel announced this week it is reducing its stake in ASML to less than 3%, the second such move in a year. Apparently ASML no longer needs outside help. According to the company's earnings report, ASML turned in net sales of €2.776 billion, a slight increase over the €2.447 billion (GAAP) the company reported in Q3 and way up over the €... » read more

Silicon Wafers: Tight Supply, High Prices


For years, the silicon wafer industry suffered from oversupply and depressed prices, causing considerable consolidation in the industry. Then, two or so years ago, the IC industry entered into a boom cycle. Silicon wafer vendors began to experience tight supply amid strong demand from IC makers. Some silicon wafer makers even raised their prices. Today, the silicon wafer market remains st... » read more

Digging Deep Into High Aspect Ratio Process Control For Memory Technology


By Mark Shirey and Janay Camp Data is an integral part of our lives. Contrary to the past, where files had to be removed periodically to free up storage space, we now assume that our data will never be deleted. Why risk deleting the wrong file? Just keep them! This new approach consumes a lot of memory, and intensifies the demand for storage. Two of the main workhorses of the memory segment ... » read more

Looking For The Next Big Innovation


Never has there been more demand for “The Big Innovation” — one that moves the needle for performance, power and area-cost (PPAC) in a big way — as there is in the current era of AI and machine learning (ML). As summarized in Why AI Workloads Require New Computing Architectures, AI workloads require new architectures to process data. These workloads also call for heterogeneous comp... » read more

The State Of MEMS Process Standardization


SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of MEMS technology development and manufacturing ahead of his presentation at the 22nd Fab Management Forum at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany. To register for the... » read more

Market Trends For Large Volume Semi Products


Material and capacity shortages typically prompt changes in normal operating procedures, especially purchasing strategies. If the uncertainty regarding world trade policies and tariffs are added on top of the shortages, the impact results in unusual gyrations in industry sales data and possible misleading signals. Discretes, analog and opto are the three largest semiconductor product categories... » read more

The Big Blur


Chip companies, research houses, foundries—and more recently large systems companies—have been developing alternative technologies to continue scaling power and performance. It's still not obvious which of those will win, let alone survive, or what they will do to the economics of developing chips. For more than five decades, the biggest concern was scaling devices in order to save money... » read more

China’s Electric Car Ambitions


China, the world’s largest car market, is also leading the charge in the electric vehicle business. But with little or no fanfare, China also wants to dominate the critical ecosystem for battery-electric vehicles and hybrids. In fact, the nation is already the world’s largest producer of batteries for electric vehicles. And it also controls a sizable part of the supply chain, such as the... » read more

A New Type Of Switch


Back in July, Applied Materials announced that we’d been selected by the Defense Advanced Research Projects Agency (DARPA) to develop technology for AI. While Applied is engaged on the development of many disruptive technologies, it’s not often that we’re in a position to discuss them in early development. Thanks to the vision of DARPA’s Electronics Resurgence Initiative and their ... » read more

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