category: Blogs – MD

category: IoT, Security & Automotive

Techniques To Identify And Correct Asymmetric Wafer Map Defects Caused By Design And Process Errors
By James Kim - 22 Feb, 2024 - Comments: 0

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during any number of process steps. In this article, I want to share a different mechanism that can cause wafer defects. Namely, that these defects can be structural defects that are caused by a biased dep... » read more

Utilizing Artificial Intelligence For Efficient Semiconductor Manufacturing
By Vivek Jain - 22 Feb, 2024 - Comments: 0

The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. It can take hundreds of process steps and more than a month to process a single wafer. It can subsequently take more than another month to go through the assembly, testing, and packaging st... » read more

Integrating Digital Twins In Semiconductor Operations
By Mark da Silva - 22 Feb, 2024 - Comments: 0

By Mark da Silva, Nishita Rao and Karim Somani Chipmakers must adopt transformative technologies including Digital Twins (DT) to keep pace with unprecedented global semiconductor industry growth that is expected to drive its total market value to $1 trillion[1] as soon as 2030. Leveraging predictive modeling and other efficiency-enhancing innovations, DTs promise to optimize semiconductor d... » read more

Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design
By Shela Aboud - 22 Jan, 2024 - Comments: 0

Wide-bandgap (WBG) semiconductors are a class of materials that can offer a range of advantages over silicon. These materials can operate at higher voltages and higher temperatures, serving as critical enablers of innovation in Power and RF applications and functioning in a wider range of environments that are sometimes extreme. Electronics applications benefit from these wide-bandgap materials... » read more

Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging
By JiHye Kwon - 18 Jan, 2024 - Comments: 0

The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and circuit density, and these needs encourage the development of a High-Density Fan-Out (HDFO) package with fine copper (Cu) redistribution layer (RDL). For mobile and networking application with high performance, HDFO is an emerging solution because aggressive design rules can be applied to HDFO ... » read more

Developing ReRAM As Next Generation On-Chip Memory For Machine Learning, Image Processing And Other Advanced CPU Applications
By Brett Lowe - 18 Jan, 2024 - Comments: 0

In modern CPU device operation, 80% to 90% of energy consumption and timing delays are caused by the movement of data between the CPU and off-chip memory. To alleviate this performance concern, designers are adding additional on-chip memory to their CPUs. Traditionally, SRAM has been the most widely used on-chip CPU memory type. Unfortunately, SRAM is currently limited to a size of hundreds of ... » read more

AI-Driven Innovation For Manufacturing Automation
By Calvin Shiao - 18 Jan, 2024 - Comments: 0

By Calvin Shiao, AshtonWS Huang, and Alfos Hsu Artificial intelligence (AI) is changing the world and improving our lives in many ways. The semiconductor industry is a key part of the AI revolution, as it provides powerful computing chips for AI applications and leverages AI to optimize business operations and management, customer service, office workflows, as well as the intricate realms of... » read more

Photonic Debonding Provides A Cost-Efficient, High-Throughput Debond Process
By Jessica Albright - 18 Jan, 2024 - Comments: 0

As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with no force and no damage to the delicate wafer upon activation of the release layer... » read more

Semiconductors Accelerate The Artificial Intelligence Revolution
By Ajit Manocha - 18 Jan, 2024 - Comments: 0

By Ajit Manocha, Pushkar Apte, and Melissa Grupen-Shemansky Five years ago, SEMI published an article predicting that Artificial Intelligence (AI) would change everything – and it has! AI has moved out of labs and taken popular imagination by storm. It is now a hot topic of discussion everywhere, from family dining tables and corporate boardrooms to corridors of government. While it m... » read more

Industry Luminaries Highlight Opportunities For Advancing The Non-EUV Leading Edge
By Jan Willis - 19 Dec, 2023 - Comments: 0

The eBeam Initiative’s 12th annual Luminaries survey in 2023 reported a range of nodes from >5nm to 14nm as the most advanced non-EUV nodes using 193i lithography. A panel of semiconductor photomask and lithography experts debated several of the survey results, including this one, to provide more insights behind the results. Aki Fujimura, CEO of D2S, Inc., the managing company sponsor of t... » read more

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