category: Connect With SEMI

category: IoT, Security & Automotive

SEMICON Taiwan’s Packaging Punch
By SEMI - 17 Sep, 2015 - Comments: 0

SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

Much Ado About Weakening Currency, China, And IoT
By Lara Chamness - 31 Aug, 2015 - Comments: 0

At the 10th annual SEMI/Gartner Market Symposium, keynoted by ARM’s Ian Ferguson, market analysts gathered to present their views on the current state of the industry. Several key themes emerged including weakening currency impact on the industry’s forecasts, China’s $20 billion Industry Fund, and the Internet of Things (IoT). Industry overview and trends were presented by Bob Johnson,... » read more

Challenges And Opportunities for China in the Semiconductor Industry
By SEMI - 20 Aug, 2015 - Comments: 0

By Allen Lu China’s new industry investment and government promotion policies represent major opportunities for China and global semiconductor companies. The global industry is closely watching the details of the policy and its implementation ─ both because of the resources China’s government has dedicated and the potential impact to the global semiconductor manufacturing supply chain. I... » read more

Pathfinding Beyond 10nm
By Paula Doe - 10 Aug, 2015 - Comments: 0

After higher aspect-ratio finFETs and higher mobility SiGe and III-V materials, the industry will move to lateral nanowires and then to vertical nanowire transistors, and to new tunnel junction FETs or spin wave architectures ─ or to various combinations of these technologies for different applications, reported An Steegan, Imec senior vice president of process technology, during SEMICON West... » read more

Multiple Lithography Options Still Remain in Play
By Paula Doe - 03 Aug, 2015 - Comments: 1

The throughput and uptime of EUV, and the overlay accuracy of 193nm immersion lithography, continue to steadily improve, though neither is yet ready for 10nm production, according to speakers at SEMICON West. Mike Lercel, ASML director, Product Marketing, reported several EUV tool sites achieved 70 percent uptime for more than a week, and one customer site had done so for more than four ... » read more

It’s a Materials World, With Positive Forecast
By SEMI - 23 Jul, 2015 - Comments: 0

By Michael Fury What’s the latest in materials forecasts for ALD/CVD precursors, CMP consumables, electronic gases, silicon wafers and sputtering targets? Techcet gives us an update. Metal Gate and Electrode Precursors to Double in Five Years Use of front-end Ta and W metal gate and Hf gate dielectric precursors will grow over 2.5x by 2020, according to a new report from Techcet, “20... » read more

Japan: Finding Leadership In New Technology Areas
By SEMI - 18 Jun, 2015 - Comments: 0

By Osamu Nakamura The semiconductor industry is a technology-driven industry — and technology invention and innovation are the engines that drive industry growth. Japan has seen the global landscape for semiconductor manufacturing change, and in turn, Japan’s semiconductor industry has been changing, finding technology leadership opportunities in emerging technology areas that lead to grow... » read more

IoT Requires The Evolution Of The “New” 200mm Fab
By SEMI - 01 Jun, 2015 - Comments: 0

By Bill Martin & Paul Werbaneth In April, we all celebrated the 50th anniversary of Moore’s Law. While critical for the industry, sometimes “chasing-the-latest-technology” business model is not the answer. Sometimes veering away from Moore’s Law makes more sense and is a better alternative. But, ever since the 1970’s, many product developer minds were conditioned that smaller w... » read more

Next-Gen Metrology: Searching For A Bright X-Ray Source
By SEMI - 21 May, 2015 - Comments: 0

By Debra Vogler Metrology for semiconductor applications is a broad topic regardless of whether one is talking about front-end-of-line (FEOL) or back-end-of-line (BEOL) technologies. Benjamin Bunday, project manager, CD Metrology and senior member of the technical staff at SEMATECH, broke down the topic of next-generation metrology at 10nm and below into four main categories for SEMI: • I... » read more

The Roadmap To 5nm
By SEMI - 11 May, 2015 - Comments: 0

By Debra Vogler Among the challenges the semiconductor industry will be facing as it moves down the path to node 5 are resistance-capacitance (RC) management and integration. SEMI is pleased to announce a SEMICON West 2015 STS technical program exploring these and other high-volume manufacturing challenges. According to An Steegen, SVP of Process Technology at imec, the list of RC managemen... » read more

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